EP 4285421 A1 20231206 - MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT
Title (en)
MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT
Title (de)
MASKENBELICHTUNGSVERFAHREN, TRANSPARENTE, LEITFÄHIGE METALLISIERUNG UND PIGMENT
Title (fr)
PROCÉDÉ D'EXPOSITION DE MASQUE, MÉTALLISATION CONDUCTRICE TRANSPARENTE ET PIGMENT
Publication
Application
Priority
- DE 102021000478 A 20210201
- EP 2022025006 W 20220110
Abstract (en)
[origin: WO2022161737A1] The invention relates to a mask exposure method comprising the following steps: - the providing of a carrier substrate; - the print application of a radiation-crosslinkable washable dye layer to the full area of the carrier substrate; - the exposure of the radiation-crosslinkable washable dye layer in defined regions to radiation by means of a radiation mask, such that the washable dye is cured in the defined regions; - the applying of a metallization over the full area; - the removing of the non-radiation-exposed washable dye outside the defined regions together with the metal present thereon with the aid of a solvent, such that the resultant carrier substrate has cured washable dye with metal applied thereto only in defined regions.
IPC 8 full level
B42D 25/29 (2014.01); C08K 3/08 (2006.01)
CPC (source: EP US)
B42D 25/373 (2014.10 - EP US); B42D 25/41 (2014.10 - EP US); B42D 25/445 (2014.10 - EP US); H10K 71/621 (2023.02 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
DE 102021000478 A1 20220804; EP 4285421 A1 20231206; US 2024042788 A1 20240208; WO 2022161737 A1 20220804
DOCDB simple family (application)
DE 102021000478 A 20210201; EP 2022025006 W 20220110; EP 22700458 A 20220110; US 202218263787 A 20220110