EP 4290985 A1 20231213 - SEMICONDUCTOR PACKAGE
Title (en)
SEMICONDUCTOR PACKAGE
Title (de)
HALBLEITERGEHÄUSE
Title (fr)
BOÎTIER DE SEMI-CONDUCTEUR
Publication
Application
Priority
- KR 20210016445 A 20210205
- KR 2022001849 W 20220207
Abstract (en)
A semiconductor package according to an embodiment includes a first insulating layer; a first pad disposed on a first surface of the first insulating layer; a second pad disposed on a second surface of the first insulating layer opposite to the first surface; and a first through part passing through the first insulating layer, wherein the first through part comprises a first-first through electrode disposed in a first region of the first insulating layer; and a first-second through electrode disposed in a second region of the first insulating layer, wherein the second region is adjacent to an outer side surface of the first insulating layer, wherein an outer side surface of the first-second through electrode is positioned on the same plane as the outer side surface of the first insulating layer, and wherein the first pad extends from the first region of the first insulating layer to the second region to connect the first-first through electrode and the first-second through electrode.
IPC 8 full level
H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H05K 1/11 (2006.01)
CPC (source: EP KR US)
H01L 23/3677 (2013.01 - EP KR); H01L 23/49822 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP); H01L 23/49838 (2013.01 - US); H01L 23/5383 (2013.01 - KR); H01L 23/5386 (2013.01 - KR); H05K 1/0206 (2013.01 - EP KR); H05K 1/111 (2013.01 - KR); H05K 1/113 (2013.01 - US); H05K 1/115 (2013.01 - KR); H01L 23/145 (2013.01 - EP); H01L 23/15 (2013.01 - EP); H01L 24/32 (2013.01 - US); H01L 2224/16225 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP); H01L 2924/1517 (2013.01 - US); H05K 1/0298 (2013.01 - EP); H05K 1/113 (2013.01 - EP); H05K 2201/094 (2013.01 - US); H05K 2201/09481 (2013.01 - US); H05K 2201/096 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4290985 A1 20231213; JP 2024505694 A 20240207; KR 20220112922 A 20220812; US 2024107668 A1 20240328; WO 2022169330 A1 20220811
DOCDB simple family (application)
EP 22750079 A 20220207; JP 2023547517 A 20220207; KR 20210016445 A 20210205; KR 2022001849 W 20220207; US 202218275930 A 20220207