EP 4292152 A1 20231220 - METHOD OF COATING BIPOLAR PLATES AND BIPOLAR PLATE
Title (en)
METHOD OF COATING BIPOLAR PLATES AND BIPOLAR PLATE
Title (de)
VERFAHREN ZUR BESCHICHTUNG VON BIPOLARPLATTEN UND BIPOLARPLATTE
Title (fr)
PROCÉDÉ DE REVÊTEMENT DE PLAQUES BIPOLAIRES ET PLAQUE BIPOLAIRE
Publication
Application
Priority
- DE 102021000763 A 20210215
- EP 2022053451 W 20220214
Abstract (en)
[origin: WO2022171844A1] The invention relates to a method of coating bipolar plates (1). It is characterized by at least the following method steps: – applying an epoxy resin-carbon mixture (2) at least to regions of at least one side (S) that is to be coated of a bipolar plate (1); – placing a die (3) onto the side (S) coated with epoxy resin-carbon mixture (2) of the bipolar plate (1) and fixing the die (3) relative to the bipolar plate with a fixed distance (x) between bipolar plate (1) and die (3); – curing the epoxy resin-carbon mixture (2) and removing the die (3); – roughening at least regions of the cured epoxy resin-carbon mixture coating (4); – hydrophilizing at least the roughened regions (4.1) of the epoxy resin-carbon mixture coating (4) by exposing at least the roughened regions (4.1) to a low-pressure plasma.
IPC 8 full level
H01M 8/0221 (2016.01); H01M 8/0226 (2016.01); H01M 8/0228 (2016.01); H01M 8/026 (2016.01); H01M 8/0263 (2016.01)
CPC (source: EP KR US)
H01M 8/0221 (2013.01 - EP KR US); H01M 8/0226 (2013.01 - EP KR US); H01M 8/0228 (2013.01 - EP KR US); H01M 8/026 (2013.01 - EP KR US); H01M 8/0263 (2013.01 - EP KR US); H01M 2250/20 (2013.01 - EP KR US); Y02E 60/50 (2013.01 - EP KR); Y02T 90/40 (2013.01 - EP KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
DE 102021000763 A1 20210401; CN 116830324 A 20230929; EP 4292152 A1 20231220; JP 2024509703 A 20240305; KR 20230129036 A 20230905; US 2024105966 A1 20240328; WO 2022171844 A1 20220818
DOCDB simple family (application)
DE 102021000763 A 20210215; CN 202280014186 A 20220214; EP 2022053451 W 20220214; EP 22706566 A 20220214; JP 2023547374 A 20220214; KR 20237026687 A 20220214; US 202218264030 A 20220214