Global Patent Index - EP 4315418 A1

EP 4315418 A1 20240207 - METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING A METHOD OF THIS TYPE

Title (en)

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING A METHOD OF THIS TYPE

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES METALL-KERAMIK-SUBSTRATS UND METALL-KERAMIK-SUBSTRAT HERGESTELLT MIT EINEM SOLCHEN VERFAHREN

Title (fr)

PROCÉDÉ DE FABRICATION D'UN SUBSTRAT MÉTAL-CÉRAMIQUE ET SUBSTRAT MÉTAL-CÉRAMIQUE FABRIQUÉ AU MOYEN D'UN TEL PROCÉDÉ

Publication

EP 4315418 A1 20240207 (DE)

Application

EP 22718103 A 20220323

Priority

  • DE 102021107690 A 20210326
  • EP 2022057595 W 20220323

Abstract (en)

[origin: WO2022200406A1] The present invention relates to a method for producing a metal-ceramic substrate (1) comprising: - providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE), - joining the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal joining method, a hot isostatic pressing method and/or a soldering method. A structuring, preferably for forming an insulation of metal sections (10') and/or a recess, preferably for forming a solder stop is provided in the at least one metal layer (10) by means of a laser method and a chemical method, in particular an etching.

IPC 8 full level

H01L 23/373 (2006.01); C04B 35/645 (2006.01); C04B 37/02 (2006.01); H01L 21/48 (2006.01)

CPC (source: EP KR US)

C04B 37/026 (2013.01 - EP KR); H01L 21/4846 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP KR US); C04B 2237/34 (2013.01 - EP KR); C04B 2237/343 (2013.01 - EP KR); C04B 2237/348 (2013.01 - EP KR); C04B 2237/365 (2013.01 - EP KR); C04B 2237/366 (2013.01 - EP KR); C04B 2237/368 (2013.01 - EP KR)

Citation (search report)

See references of WO 2022200406A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

DE 102021107690 A1 20220929; CN 117043934 A 20231110; EP 4315418 A1 20240207; JP 2024510808 A 20240311; KR 20230150354 A 20231030; US 2024178098 A1 20240530; WO 2022200406 A1 20220929

DOCDB simple family (application)

DE 102021107690 A 20210326; CN 202280018031 A 20220323; EP 2022057595 W 20220323; EP 22718103 A 20220323; JP 2023558562 A 20220323; KR 20237032968 A 20220323; US 202218283506 A 20220323