EP 4316757 A1 20240207 - CUTTING DEVICE AND CUTTING METHOD
Title (en)
CUTTING DEVICE AND CUTTING METHOD
Title (de)
SCHNEIDVORRICHTUNG UND SCHNEIDVERFAHREN
Title (fr)
DISPOSITIF DE COUPE ET PROCÉDÉ DE COUPE
Publication
Application
Priority
- JP 2021054942 A 20210329
- JP 2022001546 W 20220118
Abstract (en)
A cutting device 1 cuts a connection body 4 of an electrode plate 2 having: a current collector plate 12 that has a first surface 12a and a second surface 12b facing away from each other; a first active material layer 14 that is laminated on the first surface 12a; and a second active material layer 16 that is laminated on the second surface 12b. The cutting device 1 comprises: a first processing part 8 that forms a cut 28 in the first active material layer 14 by advancing a first cutting blade 26 from the first active material layer 14 side to a position before the current collector plate 12; and a second processing part 10 that cuts the connection body 4 by advancing a second cutting blade 32 from a position on the second active material layer 16 side facing the cut 28 to past the current collector plate 12.
IPC 8 full level
B26D 1/08 (2006.01); B26D 1/36 (2006.01); B26D 3/08 (2006.01); B26D 7/20 (2006.01); B26D 11/00 (2006.01); H01G 11/86 (2013.01); H01G 13/00 (2013.01); H01M 4/04 (2006.01); H01M 4/139 (2010.01)
CPC (source: EP US)
B26D 1/08 (2013.01 - US); B26D 1/085 (2013.01 - EP); B26D 1/36 (2013.01 - US); B26D 1/365 (2013.01 - EP); B26D 1/626 (2013.01 - EP); B26D 3/08 (2013.01 - EP US); B26D 7/204 (2013.01 - EP); B26D 9/00 (2013.01 - EP); B26D 11/00 (2013.01 - US); H01G 11/28 (2013.01 - US); H01G 11/86 (2013.01 - EP US); H01G 13/00 (2013.01 - EP); H01M 4/04 (2013.01 - EP US); H01M 4/139 (2013.01 - EP US); B26D 7/204 (2013.01 - US); H01G 11/28 (2013.01 - EP); Y02E 60/10 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4316757 A1 20240207; CN 117083731 A 20231117; JP WO2022209161 A1 20221006; US 2024149484 A1 20240509; WO 2022209161 A1 20221006
DOCDB simple family (application)
EP 22779393 A 20220118; CN 202280025053 A 20220118; JP 2022001546 W 20220118; JP 2023510504 A 20220118; US 202218284393 A 20220118