EP 4331816 A1 20240306 - POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RELEASING DEVICE
Title (en)
POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RELEASING DEVICE
Title (de)
POLYMERFILMFREISETZUNGSVERFAHREN, VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG UND FREISETZUNGSVORRICHTUNG
Title (fr)
PROCÉDÉ DE LIBÉRATION DE FILM POLYMÈRE, PROCÉDÉ DE FABRICATION DE DISPOSITIF ÉLECTRONIQUE ET DISPOSITIF DE LIBÉRATION
Publication
Application
Priority
- JP 2021076402 A 20210428
- JP 2021082330 A 20210514
- JP 2022014586 W 20220325
Abstract (en)
Provided is a releasing method that, without affecting the quality of an electronic device formed on a surface of a polymer film, can easily release the polymer film from an inorganic substrate. Provided is a method for releasing a first polymer film, characterized by including: a step A in which a layered body is prepared by adhering, to each other, an inorganic substrate and a first polymer film on which an electronic device has been formed; a step B1 in which the first polymer film side of the layered body is placed and fixed so as to be in contact with a vacuum suction plate, a partition wall is provided on a side surface of the layered body, and a second polymer film that is larger than the inorganic substrate is layered onto the inorganic substrate side of the layered body, so as to provide an enclosed space formed by the vacuum suction plate, the second polymer film, and the partition wall; and a step C in which a releasing portion is provided between the first polymer film and the inorganic substrate of the layered body and air is injected into this releasing portion to release the first polymer film while keeping same approximately level.
IPC 8 full level
B29C 69/00 (2006.01); B65H 41/00 (2006.01); H01L 21/02 (2006.01); H01L 21/301 (2006.01); H01L 21/683 (2006.01)
CPC (source: EP KR US)
B29C 69/00 (2013.01 - EP); B32B 43/006 (2013.01 - KR); B65H 29/54 (2013.01 - EP KR); B65H 41/00 (2013.01 - EP KR); H01L 21/022 (2013.01 - US); H01L 21/566 (2013.01 - US); H01L 21/67092 (2013.01 - US); H01L 21/67126 (2013.01 - US); H01L 21/67132 (2013.01 - EP); H01L 21/6835 (2013.01 - KR); H01L 21/6838 (2013.01 - EP KR US); H05K 3/288 (2013.01 - KR); B65H 2301/51122 (2013.01 - KR); B65H 2406/351 (2013.01 - KR); B65H 2701/1726 (2013.01 - KR); B65H 2701/1752 (2013.01 - KR); H01L 2221/68381 (2013.01 - KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4331816 A1 20240306; JP WO2022230505 A1 20221103; KR 20240004413 A 20240111; TW 202243916 A 20221116; US 2024153785 A1 20240509; WO 2022230505 A1 20221103
DOCDB simple family (application)
EP 22795422 A 20220325; JP 2022014586 W 20220325; JP 2022548047 A 20220325; KR 20237037480 A 20220325; TW 111116161 A 20220428; US 202218550329 A 20220325