Global Patent Index - EP 4332259 A3

EP 4332259 A3 20240522 - HIGH-STRENGTH HIGH-THERMAL-CONDUCTIVITY WROUGHT NICKEL ALLOY

Title (en)

HIGH-STRENGTH HIGH-THERMAL-CONDUCTIVITY WROUGHT NICKEL ALLOY

Title (de)

HOCHFESTE NICKELKNETLEGIERUNG MIT HOHER WÄRMELEITFÄHIGKEIT

Title (fr)

ALLIAGE DE NICKEL FORGEABLE A HAUTE RESISTANCE ET CONDUCTIVITE THERMIQUE ELEVEE

Publication

EP 4332259 A3 20240522 (EN)

Application

EP 24152972 A 20141216

Priority

  • US 201361921380 P 20131227
  • EP 14873424 A 20141216
  • US 2014070646 W 20141216

Abstract (en)

A nickel alloying process includes providing a nickel-vanadium-carbon powder, forming a nickel alloy from the nickel-vanadium-carbon powder, removing air and absorbed water from the nickel alloy, and hot extruding the nickel alloy.

IPC 8 full level

C22C 19/03 (2006.01); B22F 1/12 (2022.01); C22C 1/04 (2023.01); C22C 1/053 (2023.01); C22C 1/059 (2023.01); C22C 1/10 (2023.01); C22C 19/00 (2006.01)

CPC (source: EP US)

B22F 1/12 (2022.01 - EP US); B22F 3/20 (2013.01 - US); B22F 9/04 (2013.01 - US); C22C 1/0433 (2013.01 - EP US); C22C 1/053 (2013.01 - EP); C22C 1/059 (2023.01 - EP); C22C 1/1084 (2013.01 - EP US); C22C 19/007 (2013.01 - EP US); C22C 19/03 (2013.01 - EP US); B22F 2003/208 (2013.01 - US); B22F 2009/041 (2013.01 - US); B22F 2009/043 (2013.01 - US); B22F 2301/15 (2013.01 - US); B22F 2302/10 (2013.01 - US); B22F 2302/20 (2013.01 - US); B22F 2302/25 (2013.01 - US); B22F 2302/253 (2013.01 - US); B22F 2302/256 (2013.01 - US); B22F 2302/35 (2013.01 - US); B22F 2998/00 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US); B22F 2999/00 (2013.01 - EP US)

C-Set (source: EP US)

  1. B22F 2999/00 + C22C 1/1084 + B22F 2009/043 + B22F 2009/042
  2. B22F 2998/00 + C22C 32/0026 + C22C 32/0052 + C22C 32/0068

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2015100074 A1 20150702; EP 3087210 A1 20161102; EP 3087210 A4 20171101; EP 3087210 B1 20240124; EP 4332259 A2 20240306; EP 4332259 A3 20240522; EP 4353856 A2 20240417; EP 4353856 A3 20240710; US 2016325357 A1 20161110

DOCDB simple family (application)

US 2014070646 W 20141216; EP 14873424 A 20141216; EP 24152972 A 20141216; EP 24152983 A 20141216; US 201415108476 A 20141216