EP 4335257 A1 20240313 - COMPUTER COOLING
Title (en)
COMPUTER COOLING
Title (de)
COMPUTERKÜHLUNG
Title (fr)
REFROIDISSEMENT POUR ORDINATEUR
Publication
Application
Priority
- US 202163183259 P 20210503
- US 202117361064 A 20210628
- US 2022023572 W 20220406
Abstract (en)
[origin: WO2022235368A1] The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.
IPC 8 full level
H05K 7/20 (2006.01)
CPC (source: EP)
H05K 7/203 (2013.01); H05K 7/20809 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
WO 2022235368 A1 20221110; EP 4335257 A1 20240313; TW 202248802 A 20221216
DOCDB simple family (application)
US 2022023572 W 20220406; EP 22720133 A 20220406; TW 111113983 A 20220413