EP 4338562 A1 20240320 - DEVICE FOR DISSIPATING HEAT FROM ELECTRONIC COMPONENTS IN AN ELECTRONICS HOUSING
Title (en)
DEVICE FOR DISSIPATING HEAT FROM ELECTRONIC COMPONENTS IN AN ELECTRONICS HOUSING
Title (de)
VORRICHTUNG ZUR WÄRMEABLEITUNG VON IN EINEM ELEKTRONIKGEHÄUSE ANGEORDNETEN ELEKTRONISCHEN BAUTEILEN
Title (fr)
DISPOSITIF DE DISSIPATION DE CHALEUR DE COMPOSANTS ÉLECTRONIQUES DANS UN BOÎTIER ÉLECTRONIQUE
Publication
Application
Priority
- EP 21182506 A 20210629
- EP 2022066703 W 20220620
Abstract (en)
[origin: WO2023274767A1] The invention relates to a device for dissipating heat from electronic components in an electronics housing, in particular electronic components on a printed circuit board in an electronics housing. The invention for the first time provides a device which dissipates heat from electronic components in an electronics housing and is not exclusively based on primary heat dissipation via a thermal conduction paste. Instead, heat is dissipated via a working fluid that has cooling power in the electronics housing using evaporation and condensation.
IPC 8 full level
H05K 7/20 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01)
CPC (source: EP)
F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 3/12 (2013.01); H01L 23/3733 (2013.01); H01L 23/427 (2013.01); H05K 7/203 (2013.01); H05K 7/20336 (2013.01); F28D 2021/0029 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4114159 A1 20230104; CN 117941481 A 20240426; EP 4338562 A1 20240320; WO 2023274767 A1 20230105
DOCDB simple family (application)
EP 21182506 A 20210629; CN 202280059286 A 20220620; EP 2022066703 W 20220620; EP 22737788 A 20220620