Global Patent Index - EP 4345387 A1

EP 4345387 A1 20240403 - HEAT PUMP APPARATUS

Title (en)

HEAT PUMP APPARATUS

Title (de)

WÄRMEPUMPENVORRICHTUNG

Title (fr)

APPAREIL DE POMPE À CHALEUR

Publication

EP 4345387 A1 20240403 (EN)

Application

EP 23199433 A 20230925

Priority

JP 2022158773 A 20220930

Abstract (en)

There is provided a heat pump apparatus that prevents a refrigerant, which has leaked from the refrigerant circuit, from entering an electrical equipment box. A heat pump apparatus 1 includes a machine room 13 and a blower room 12 each in a housing 10, the machine room 13 being a room in which a compressor 22 and an expansion device 24 are disposed, the blower room 12 being a room in which a heat exchanger 20 and a blower device 21 are disposed. The heat pump apparatus 1 includes an electrical equipment box 30; the electrical equipment box 30 includes an electrical equipment box body 32 and a cover member 33; and the electrical equipment box body 32 includes a terminal block 51 for cable (main power line) 45, a window opening 152 that the terminal block 51 faces, and a window cover body 155 that can seal the window opening 152 with a sealing material interposed therebetween.

IPC 8 full level

F24F 1/22 (2011.01); F24F 11/88 (2018.01); F24F 13/20 (2006.01)

CPC (source: EP)

F24F 1/22 (2013.01); F24F 11/88 (2018.01); F24F 13/20 (2013.01)

Citation (applicant)

EP 3312531 A1 20180425 - MITSUBISHI ELECTRIC CORP [JP]

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4345387 A1 20240403; JP 2024052211 A 20240411

DOCDB simple family (application)

EP 23199433 A 20230925; JP 2022158773 A 20220930