EP 4347912 A1 20240410 - METHOD FOR DIGITAL FORMATION OF 2D MATERIALS STRUCTURES, APPLICATIONS THEREOF AND A SYSTEM
Title (en)
METHOD FOR DIGITAL FORMATION OF 2D MATERIALS STRUCTURES, APPLICATIONS THEREOF AND A SYSTEM
Title (de)
VERFAHREN ZUR DIGITALEN BILDUNG VON 2D-MATERIALSTRUKTUREN, ANWENDUNGEN DAVON UND SYSTEM
Title (fr)
PROCÉDÉ DE FORMATION NUMÉRIQUE DE STRUCTURES DE MATÉRIAUX 2D, SES APPLICATIONS ET SYSTÈME
Publication
Application
Priority
- US 202163193968 P 20210527
- US 202217725365 A 20220420
- GR 2022000025 W 20220427
Abstract (en)
[origin: WO2022248893A1] A system and method for performing is laser induced forward transfer (LIFT) of 2D materials is disclosed. The method includes generating a receiver substrate, generating a donor substrate, wherein the donor substrate comprises a back surface and a front surface, applying a coating to the front surface, wherein the coating includes donor material, aligning the front surface of the donor substrate to be parallel to and facing the receiver substrate, wherein the donor material is disposed adjacent to the target layer, and irradiating the coating through the back surface of the donor substrate with one or more laser pulses produced by a laser to transfer a portion of the donor material to the target layer. The donor material may include Bi2S3-xSx, MoS2, hexagonal boron nitride (h-BN) or graphene. The method may be used to create touch sensors and other electronic components.
IPC 8 full level
C23C 14/04 (2006.01); B23K 26/00 (2014.01); B41J 2/00 (2006.01); B41J 2/005 (2006.01); B41M 1/26 (2006.01); B41M 5/035 (2006.01); B41M 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C01B 32/184 (2017.01); C23C 14/06 (2006.01); C23C 14/12 (2006.01); C23C 14/28 (2006.01); C23C 14/58 (2006.01); G06F 3/00 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP)
B23K 26/0622 (2015.10); B23K 26/083 (2013.01); B23K 26/0869 (2013.01); B23K 26/1224 (2015.10); B23K 26/127 (2013.01); B23K 26/342 (2015.10); B23K 26/57 (2015.10); C01B 32/184 (2017.07); C23C 14/048 (2013.01); C23C 14/0605 (2013.01); C23C 14/0623 (2013.01); C23C 14/0647 (2013.01); C23C 14/12 (2013.01); C23C 14/28 (2013.01); C23C 14/5813 (2013.01); G06F 3/044 (2013.01); H01L 24/11 (2013.01); B23K 2103/50 (2018.07); B82Y 40/00 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01)
Citation (search report)
See references of WO 2022248893A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
DOCDB simple family (application)
GR 2022000025 W 20220427; EP 22721839 A 20220427