Global Patent Index - EP 4365337 A1

EP 4365337 A1 20240508 - METHOD FOR MANUFACTURING TITANIUM-CONTAINING ELECTRODEPOSIT, AND METAL TITANIUM ELECTRODEPOSIT

Title (en)

METHOD FOR MANUFACTURING TITANIUM-CONTAINING ELECTRODEPOSIT, AND METAL TITANIUM ELECTRODEPOSIT

Title (de)

VERFAHREN ZUR HERSTELLUNG TITANHALTIGER ELEKTROTAUCHLACKIERUNGEN UND METALLTITANELEKTROTAUCHLACKIERUNG

Title (fr)

PROCÉDÉ DE FABRICATION D'ÉLECTRODÉPÔT CONTENANT DU TITANE ET ÉLECTRODÉPÔT DE TITANE MÉTALLIQUE

Publication

EP 4365337 A1 20240508 (EN)

Application

EP 22832600 A 20220427

Priority

  • JP 2021109251 A 20210630
  • JP 2022019152 W 20220427

Abstract (en)

Provided is a method for producing a titanium-containing electrodeposit, which can achieve good refinement by an electrodeposition without using the Kroll method. A method for producing a titanium-containing electrodeposit, including an electrodeposition step of electrodepositing a titanium-containing electrodeposit in a chloride bath, the chloride bath being a molten salt, using an anode including a TiAlO conductive material containing titanium, aluminum, and oxygen, and a cathode, wherein, in the electrodeposition step, a current density of the cathode is in a range of 0.3 A/cm<sup>2</sup> or more and 2.0 A/cm<sup>2</sup> or less, and wherein the chloride bath contains 1 mol% or more of a titanium subchloride.

IPC 8 full level

C25C 3/28 (2006.01); C22B 34/12 (2006.01); C25C 7/02 (2006.01)

CPC (source: EP US)

C22B 34/12 (2013.01 - EP); C22B 34/129 (2013.01 - EP); C22C 14/00 (2013.01 - US); C25C 3/28 (2013.01 - EP); C25C 7/02 (2013.01 - EP); C25D 3/56 (2013.01 - US)

Citation (search report)

See references of WO 2023276440A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

EP 4365337 A1 20240508; CA 3220641 A1 20230105; JP WO2023276440 A1 20230105; US 2024191385 A1 20240613; WO 2023276440 A1 20230105

DOCDB simple family (application)

EP 22832600 A 20220427; CA 3220641 A 20220427; JP 2022019152 W 20220427; JP 2023531474 A 20220427; US 202218569131 A 20220427