EP 4377044 A1 20240605 - METHOD FOR PRODUCING A SOLDER CONNECTION AND ASSEMBLY WITH A SOLDER CONNECTION
Title (en)
METHOD FOR PRODUCING A SOLDER CONNECTION AND ASSEMBLY WITH A SOLDER CONNECTION
Title (de)
VERFAHREN ZUM HERSTELLEN EINER LÖTVERBINDUNG SOWIE BAUGRUPPE MIT LÖTVERBINDUNG
Title (fr)
PROCÉDÉ DE FABRICATION D'UNE CONNEXION SOUDÉE ET ENSEMBLE COMPORTANT UNE CONNEXION SOUDÉE
Publication
Application
Priority
- EP 21201813 A 20211011
- EP 2022077550 W 20221004
Abstract (en)
[origin: WO2023061801A1] The invention relates to a method for producing a solder connection between a first component (10) being soldered and a second component (20) being soldered by a soldering agent (100), wherein the soldering agent comprises a metal solder material (110) and a plurality of magnetic nanoparticles (120), wherein the method comprises at least the following steps: a) generating an alternating magnetic field (200) with at least one magnetic coil (210, 220) and the alternating magnetic field (200) influencing the solder material (100); b) heating the magnetic nanoparticles (120) via the interaction with the alternating magnetic field (200); c) melting the metal solder material (110) due to heat transfer (300) from the magnetic nanoparticles (120) to the metal solder material (110), and forming the solder connection between the first component (10) being soldered and the second component (20) being soldered using the molten metal solder material (110). The invention also relates to an assembly (1) comprising a corresponding solder connection.
IPC 8 full level
B23K 31/02 (2006.01); B23K 35/24 (2006.01); H05K 3/34 (2006.01); B23K 101/36 (2006.01)
CPC (source: EP)
B23K 3/0638 (2013.01); B23K 35/24 (2013.01); H05K 3/3463 (2013.01); H05K 3/3494 (2013.01); B23K 2101/36 (2018.08); H05K 2201/0218 (2013.01); H05K 2201/0224 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/086 (2013.01); H05K 2203/104 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4163049 A1 20230412; EP 4377044 A1 20240605; WO 2023061801 A1 20230420
DOCDB simple family (application)
EP 21201813 A 20211011; EP 2022077550 W 20221004; EP 22800176 A 20221004