Global Patent Index - EP 4385285 A1

EP 4385285 A1 20240619 - METHOD FOR CONTACTING AN ELECTRICALLY CONDUCTIVE PAPER STRUCTURE, COMPOSITE BODY AND USE

Title (en)

METHOD FOR CONTACTING AN ELECTRICALLY CONDUCTIVE PAPER STRUCTURE, COMPOSITE BODY AND USE

Title (de)

VERFAHREN ZUR KONTAKTIERUNG EINES ELEKTRISCH LEITENDEN PAPIERGEFÜGES, VERBUNDKÖRPER UND VERWENDUNG

Title (fr)

PROCÉDÉ DE MISE EN CONTACT D'UNE STRUCTURE DE PAPIER ÉLECTRIQUEMENT CONDUCTRICE, CORPS COMPOSITE ET UTILISATION

Publication

EP 4385285 A1 20240619 (DE)

Application

EP 22762029 A 20220805

Priority

  • DE 102021120697 A 20210809
  • EP 2022072136 W 20220805

Abstract (en)

[origin: WO2023016945A1] The invention relates to a composite body, comprising: a support plate (1) having recesses, an upper main surface and a lower main surface; and an electrically conductive paper structure (4) adjoining the upper main surface of the support plate, wherein: the electrically conductive paper structure (4) has at least one conductor track (3) facing the upper main surface of the support plate; and conductor elements (2) are introduced into the recesses of the support plate such that the conductor elements (2) terminate flush with the upper main surface of the support plate (1), the conductor elements (2) are in electrical contact with the at least one conductor track (3) of the electrically conductive paper structure (4), and the conductor elements (2) are contactable with a current source from the lower main surface of the support plate (1).

IPC 8 full level

H05B 3/20 (2006.01); H05B 3/46 (2006.01); H05B 3/48 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01)

CPC (source: EP)

H05B 3/145 (2013.01); H05B 3/48 (2013.01); H05K 1/0212 (2013.01); H05K 1/0386 (2013.01); H05K 3/107 (2013.01); H05B 2203/011 (2013.01); H05B 2203/017 (2013.01); H05B 2214/04 (2013.01); H05K 1/0216 (2013.01); H05K 1/0366 (2013.01); H05K 1/113 (2013.01); H05K 3/0047 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0281 (2013.01); H05K 2201/0284 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10416 (2013.01); H05K 2203/1115 (2013.01)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

DE 102021120697 A1 20230209; EP 4385285 A1 20240619; WO 2023016945 A1 20230216

DOCDB simple family (application)

DE 102021120697 A 20210809; EP 2022072136 W 20220805; EP 22762029 A 20220805