Global Patent Index - EP 4388045 A1

EP 4388045 A1 20240626 - THERMALLY CONDUCTIVE SILICONE COMPOSITION

Title (en)

THERMALLY CONDUCTIVE SILICONE COMPOSITION

Title (de)

WÄRMELEITFÄHIGE SILIKONZUSAMMENSETZUNG

Title (fr)

COMPOSITION THERMOCONDUCTRICE DE SILICONE

Publication

EP 4388045 A1 20240626 (EN)

Application

EP 21778341 A 20210819

Priority

CN 2021113465 W 20210819

Abstract (en)

[origin: WO2023019504A1] A composition contains: (A) a curable silicone composition including: (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30-400 milliPascal*seconds, (a2) a silicon-hydride functional crosslinker, and (a3) a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5: 1 to 1: 1; (B) a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and (C) a thermally conductive filler mixture including (c1) 40-55 wt%of aluminum nitride fillers, containing a blend of: (c1-a) 15-41 wt%of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of 20-80 micrometers; (c2) spherical aluminum oxide particles having a D50 particle size of 1-5 micrometers; and (c3) 10-20 wt%of irregular zinc oxide particles having a D50 particle size of 0.1-0.5 micrometer; where the total amount of the thermally conductive filler mixture is 94-97 wt%; and where wt%values are relative to the weight of the thermally conductive composition unless otherwise stated.

IPC 8 full level

C08K 3/38 (2006.01); C08L 83/04 (2006.01); C09D 183/04 (2006.01); C09J 183/04 (2006.01)

CPC (source: EP KR US)

C08G 77/12 (2013.01 - KR US); C08G 77/20 (2013.01 - KR US); C08K 3/22 (2013.01 - KR); C08K 3/28 (2013.01 - KR); C08K 3/38 (2013.01 - EP); C08K 5/5419 (2013.01 - KR); C08K 13/06 (2013.01 - US); C08L 83/04 (2013.01 - EP KR); C09D 183/04 (2013.01 - EP KR); C09J 183/04 (2013.01 - EP KR); C09K 5/14 (2013.01 - US); H05K 7/2039 (2013.01 - US); C08G 77/12 (2013.01 - EP); C08G 77/20 (2013.01 - EP); C08K 7/18 (2013.01 - US); C08K 9/08 (2013.01 - US); C08K 2003/2227 (2013.01 - EP KR); C08K 2003/2296 (2013.01 - EP KR US); C08K 2003/282 (2013.01 - KR US); C08K 2003/385 (2013.01 - EP); C08K 2201/001 (2013.01 - KR US); C08K 2201/005 (2013.01 - KR US)

C-Set (source: EP)

  1. C08K 3/38 + C08L 83/04
  2. C08L 83/04 + C08L 83/00 + C08L 83/00 + C08K 5/56 + C08K 3/38 + C08K 3/38 + C08K 3/22 + C08K 3/22
  3. C08L 83/04 + C08L 83/00 + C08K 5/56 + C08K 5/5419 + C08K 3/38 + C08K 3/38 + C08K 3/22 + C08K 3/22

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

Designated validation state (EPC)

KH MA MD TN

DOCDB simple family (publication)

WO 2023019504 A1 20230223; CN 117693552 A 20240312; EP 4388045 A1 20240626; JP 2024532704 A 20240910; KR 20240046899 A 20240411; TW 202313854 A 20230401; US 2024279525 A1 20240822

DOCDB simple family (application)

CN 2021113465 W 20210819; CN 202180100830 A 20210819; EP 21778341 A 20210819; JP 2024506729 A 20210819; KR 20247008602 A 20210819; TW 111130509 A 20220812; US 202118566121 A 20210819