EP 4397720 A1 20240710 - CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FOR PRODUCING SAID CURED OBJECT
Title (en)
CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FOR PRODUCING SAID CURED OBJECT
Title (de)
HÄRTBARE SILIKONZUSAMMENSETZUNG, GEHÄRTETES OBJEKT DARAUS UND VERFAHREN ZUR HERSTELLUNG DES GEHÄRTETEN OBJEKTS
Title (fr)
COMPOSITION DE SILICONE DURCISSABLE, ARTICLE DURCI ASSOCIÉ, ET PROCÉDÉ DE FABRICATION DE CETTE COMPOSITION
Publication
Application
Priority
- JP 2021140800 A 20210831
- JP 2022031578 W 20220822
Abstract (en)
[Problem] To provide a curable silicone composition or the like having excellent handleability and curing properties during sealing due to good hot-melt properties and excellent melting properties, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. [Solution] Provided is a curable silicone composition comprising: (A) a hot-melt MDT-type organopolysiloxane resin having a specific siloxane unit ratio; (B) an organohydrogensiloxane compound; (C) a hydrosilylation catalyst; and (D) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (C), wherein the curable silicone composition is solid at 25°C and has hot-melt properties at a temperature of 200°C or lower, along with the use thereof.
IPC 8 full level
C08L 83/07 (2006.01); C08J 5/00 (2006.01); C08K 3/013 (2018.01); C08K 5/544 (2006.01); C08L 83/05 (2006.01); C08L 91/06 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP KR)
C08G 77/12 (2013.01 - KR); C08G 77/20 (2013.01 - KR); C08J 5/00 (2013.01 - EP); C08K 3/013 (2018.01 - EP KR); C08K 5/544 (2013.01 - EP); C08K 5/549 (2013.01 - KR); C08L 83/04 (2013.01 - EP KR); C08L 91/06 (2013.01 - EP KR); H01L 23/29 (2013.01 - EP); H01L 23/295 (2013.01 - KR); H01L 23/31 (2013.01 - EP); C08G 77/70 (2013.01 - KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
EP 4397720 A1 20240710; CN 117881747 A 20240412; JP WO2023032734 A1 20230309; KR 20240046792 A 20240409; TW 202313792 A 20230401; WO 2023032734 A1 20230309
DOCDB simple family (application)
EP 22864318 A 20220822; CN 202280056297 A 20220822; JP 2022031578 W 20220822; JP 2023545463 A 20220822; KR 20247010070 A 20220822; TW 111132731 A 20220830