EP 4416232 A1 20240821 - HOT-MELT ADHESIVE COMPOSITION
Title (en)
HOT-MELT ADHESIVE COMPOSITION
Title (de)
SCHMELZKLEBSTOFFZUSAMMENSETZUNG
Title (fr)
COMPOSITION ADHÉSIVE THERMOFUSIBLE
Publication
Application
Priority
- FR 2110895 A 20211014
- FR 2022051930 W 20221013
Abstract (en)
[origin: WO2023062324A1] The invention relates to a hot-melt adhesive composition comprising: (i) at least one specific semi-crystalline aliphatic copolyamide; (ii) at least one filler, the carbon atom content of which is between 60 and 100% relative to the number of atoms constituting the filler, the carbonaceous filler having a median particle size D90 ranging from 1 to 400 micrometers; (iii) at least one electrically insulative filler selected from the metal oxides and nitrides, the sum of the contents of the carbonaceous filler and the electrically insulative filler is between 30 and 75% by weight relative to the total weight of the composition, said fillers having a median particle size D90 ranging from 1 to 400 micrometers The invention also relates to the method for preparing same and to the use thereof.
IPC 8 full level
C09J 177/06 (2006.01)
CPC (source: EP)
C09J 177/06 (2013.01); C08G 69/34 (2013.01); C08G 69/40 (2013.01); C08K 3/34 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/001 (2013.01)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA
Designated validation state (EPC)
KH MA MD TN
DOCDB simple family (publication)
WO 2023062324 A1 20230420; CN 118103473 A 20240528; EP 4416232 A1 20240821; FR 3128224 A1 20230421
DOCDB simple family (application)
FR 2022051930 W 20221013; CN 202280068328 A 20221013; EP 22801844 A 20221013; FR 2110895 A 20211014