(19)
(11)EP 0 489 911 A1

(12)

(43)Date of publication:
17.06.1992 Bulletin 1992/25

(21)Application number: 90904421.0

(22)Date of filing:  07.03.1990
(51)International Patent Classification (IPC): 
B29C 45/ 00( . )
B29C 45/ 18( . )
B29C 45/ 23( . )
B29C 45/ 57( . )
B29C 45/ 77( . )
B29C 45/ 17( . )
B29C 45/ 20( . )
B29C 45/ 26( . )
B29C 45/ 76( . )
(86)International application number:
PCT/JP1990/000300
(87)International publication number:
WO 1991/005651 (02.05.1991 Gazette  1991/10)
(84)Designated Contracting States:
DE FR GB IT

(30)Priority: 12.10.1989 WO 1989JP01052

(71)Applicant: SEIKI CORPORATION
Minato-ku, Tokyo 105 (JP)

(72)Inventor:
  • TSUTSUMI, Shigeru
    Yonezawa-shi Yamagata 992 (JP)

(74)Representative: Harrison, Ivor Stanley, et al 
Withers & Rogers 4 Dyer's Buildings Holborn
London EC1N 2JT
London EC1N 2JT (GB)

  


(54)IMPROVED PRESSURE-HOLDING CHAMBER TYPE INJECTION MOLDING PROCESS AND APPARATUS