(19)
(11)EP 0 295 848 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
27.09.1989 Bulletin 1989/39

(43)Date of publication A2:
21.12.1988 Bulletin 1988/51

(21)Application number: 88305378.7

(22)Date of filing:  13.06.1988
(51)International Patent Classification (IPC)4H01L 21/48
(84)Designated Contracting States:
DE FR GB NL

(30)Priority: 15.06.1987 US 61741

(71)Applicant: TEKTRONIX INC.
Beaverton Oregon 97077-0001 (US)

(72)Inventors:
  • Reagan, John J.
    Beaverton Oregon 97005 (US)
  • Parks, Peggy J.
    Beaverton Oregon 97007 (US)
  • Miller, Nancy L.
    Portland Oregon 97225 (US)
  • Beckman, Robert L.
    Beaverton Oregon 97006 (US)

(74)Representative: Burke, Steven David et al
R.G.C. Jenkins & Co. 26 Caxton Street
London SW1H 0RJ
London SW1H 0RJ (GB)


(56)References cited: : 
  
      


    (54)Fabrication of a multilayer conductive pattern on a dielectric substrate


    (57) A pattern of conductive material (12'/14) is formed on a substrate of dielectric material. The substrate comprises a layer of flexible dielectric material (4) having a layer of dimensionally-stable material (6) adhered to one main face. The pattern is formed on the opposite main face of the layer of flexible dielectric material.







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