(19)
(11)EP 2 959 301 A1

(12)

(43)Date of publication:
30.12.2015 Bulletin 2015/53

(21)Application number: 14709845.3

(22)Date of filing:  26.02.2014
(51)International Patent Classification (IPC): 
G01R 15/20(2006.01)
H01L 23/00(2006.01)
H01L 23/495(2006.01)
H01L 43/06(2006.01)
(86)International application number:
PCT/US2014/018525
(87)International publication number:
WO 2014/149448 (25.09.2014 Gazette  2014/39)
(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30)Priority: 15.03.2013 US 201313834617

(71)Applicant: Allegro Microsystems, LLC
Worcester, Massachusetts 01606 (US)

(72)Inventors:
  • LIU, Shixi, Louis
    Worcester, Massachusetts 01605 (US)
  • WONG, Harianto
    Southborough, Massachusetts 01772 (US)
  • DAVID, Paul
    Bow, New Hampshire 03304 (US)
  • SAUBER, John, B.
    Millbury, Massachusetts 01527 (US)
  • MILANO, Shaun, D.
    Dunbarton, New Hampshire 03046 (US)
  • KANDA, Raguvir
    North Attleboro, Massachusetts 02760 (US)
  • HEMENWAY, Bruce
    Milford, Massachusetts 01757 (US)

(74)Representative: South, Nicholas Geoffrey et al
A.A. Thornton & Co. 10 Old Bailey
London EC4M 7NG
London EC4M 7NG (GB)

  


(54)PACKAGING FOR AN ELECTRONIC CIRCUIT