(19)
(11)EP 3 613 081 A1

(12)

(43)Date of publication:
26.02.2020 Bulletin 2020/09

(21)Application number: 18788160.2

(22)Date of filing:  18.04.2018
(51)International Patent Classification (IPC): 
H01L 29/04(2006.01)
H01L 21/027(2006.01)
H01L 21/47(2006.01)
H01L 21/32(2006.01)
H01L 29/16(2006.01)
H01L 51/52(2006.01)
H01L 21/306(2006.01)
H01L 21/3213(2006.01)
(86)International application number:
PCT/US2018/028089
(87)International publication number:
WO 2018/195152 (25.10.2018 Gazette  2018/43)
(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30)Priority: 18.04.2017 US 201762486518 P
19.04.2017 US 201762487036 P
20.04.2017 US 201762487739 P

(71)Applicant: Massachusetts Institute Of Technology
Cambridge, MA 02139 (US)

(72)Inventors:
  • LEE, Kyusang
    Crozet, VA 22932 (US)
  • KIM, Jeehwan
    Cambridge Massachusetts 02141 (US)

(74)Representative: Hoffmann Eitle 
Patent- und Rechtsanwälte PartmbB Arabellastraße 30
81925 München
81925 München (DE)

  


(54)SYSTEMS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES VIA REMOTE EPITAXY