| (11) | EP 2 557 598 A3 |
(12) | EUROPEAN PATENT APPLICATION |
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(54) | Optoelectric integrated circuit substrate and method of fabricating the same |
(57) An optoelectronic integrated circuit substrate may include a first region and a second region. The first region and the second region each include at least two buried insulation layers having different thicknesses. The at least two buried insulation layers of the first region are formed at a greater depth and have a greater thickness as compared to the at least two buried insulation layers of the second region. A micro-electromechanical systems (MEMS) structure may be formed in a third region that does not include a buried insulation layer.
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