|(57) The present invention is an apparatus (100) and method for controlling pressure, pumping a vacuum and providing abatement for a plurality of vacuum processing chambers (110,115,120,125). The system may be used in semiconductor manufacture. Multiple vacuum processing chambers (110,115,120,125) are exhausted by turbo pumps (111,116,121,126) into a common abatement chamber (131), which is maintained at sub-atmospheric pressure by a backing pump (140). Pressure in the processing chambers (110,115,120,125) is independently controlled. The internal volume of the abatement device (131) provides a buffer that reduces the effect of pressure changes in one processing chamber affecting pressure in the other chambers.