(19)
(11)EP 1 675 178 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
28.05.2008 Bulletin 2008/22

(43)Date of publication A2:
28.06.2006 Bulletin 2006/26

(21)Application number: 05111431.2

(22)Date of filing:  29.11.2005
(51)International Patent Classification (IPC): 
H01L 23/66(2006.01)
H01L 23/495(2006.01)
(84)Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK YU

(30)Priority: 30.11.2004 US 999591

(71)Applicant: M/A-COM, INC.
Lowell, MA 01853 (US)

(72)Inventors:
  • Channabasappa, Eswarappa
    MA 01720, Acton (US)
  • Anderson, Richard Alan
    MA 02760, North Attleborough (US)

(74)Representative: Johnstone, Douglas Ian et al
Baron & Warren, 19 South End, Kensington
London W8 5BU
London W8 5BU (GB)

  


(54)Connection arrangement for micro lead frame plastic packages


(57) A connection arrangement for a micro lead frame plastic (MLP) package (20) is provided that includes a paddle (28) configured to be connected to a circuit board (24) and a first ground pad (26) and a second ground pad (26) each connected to the paddle (28). The first and second ground pads (26, 26) together with the paddle (28) are configured to provide continuity of ground between the circuit board (24) and a chip (40) mounted to the paddle (28).







Search report