(19)
(11)EP 1 968 368 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
24.11.2010 Bulletin 2010/47

(43)Date of publication A2:
10.09.2008 Bulletin 2008/37

(21)Application number: 08157080.6

(22)Date of filing:  28.09.1999
(51)International Patent Classification (IPC): 
H05K 3/46(2006.01)
H05K 1/09(2006.01)
H05K 3/38(2006.01)
(84)Designated Contracting States:
DE FI GB NL

(30)Priority: 28.09.1998 JP 27279998
29.09.1998 JP 27601098
29.09.1998 JP 27601198
13.10.1998 JP 29045098
30.10.1998 JP 31044598
10.12.1998 JP 35157298
14.12.1998 JP 35473398
28.12.1998 JP 37227498
14.04.1999 JP 10618499
01.07.1999 JP 18741899

(62)Application number of the earlier application in accordance with Art. 76 EPC:
06115382.1 / 1699279
99943468.1 / 1119227

(71)Applicant: IBIDEN CO., LTD.
Ogaki Gifu 503-0695 (JP)

(72)Inventors:
  • En, Honchin
    Ibi-gun Gifu 501-0695 (JP)
  • Hayashi, Masayuki
    Ibi-gun Gifu 501-0695 (JP)
  • Wang, Dongdong
    Ibi-gun Gifu 501-0695 (JP)
  • Shimada, Kenichi
    Ibi-gun Gifu 501-0695 (JP)
  • Asai, Motoo
    Ibi-gun Gifu 501-0695 (JP)
  • Sekine, Koji
    Ibi-gun Gifu 501-0695 (JP)
  • Nakai, Tohru
    Ibi-gun Gifu 501-0695 (JP)
  • Ichikawa, Shinichiro
    Ibi-gun Gifu 501-0695 (JP)
  • Toyoda, Yukihiko
    Ibi-gun Gifu 501-0695 (JP)

(74)Representative: TBK-Patent 
Bavariaring 4-6
80336 München
80336 München (DE)

  


(54)Printed wiring board and method for producing the same


(57) In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (19) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4th through 7th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).







Search report