(19)
(11)EP 2 536 262 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
04.11.2020 Bulletin 2020/45

(21)Application number: 12169879.9

(22)Date of filing:  29.05.2012
(51)International Patent Classification (IPC): 
H05K 7/20(2006.01)

(54)

Vertically mounted multi-hybrid module and heat sink

Vertikal montiertes Multihybridmodul und Kühlkörper

Module multi-hybride monté verticalement et dissipateur thermique


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 16.06.2011 US 201113161842

(43)Date of publication of application:
19.12.2012 Bulletin 2012/51

(73)Proprietor: Hamilton Sundstrand Corporation
Windsor Locks, CT 06096-1010 (US)

(72)Inventors:
  • Kokas, Jay, W.
    East Granby, Connecticut 06026 (US)
  • Roy, Kevin, P.
    West Springfield, Massachusetts 01089 (US)
  • Schwartz, Judy
    Longmeadow, Massachusetts 01106 (US)
  • Maynard, Michael
    Springfield, Massachusetts 01118 (US)
  • Pennell, John, D.
    Enfield, Connecticut 06082 (US)
  • Fitzpatrick, Matthew, S.
    Portland, Connecticut 06480 (US)
  • Speziale, Richard, M.
    Winsted, Connecticut 06098 (US)

(74)Representative: Dehns 
St. Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)


(56)References cited: : 
US-A- 4 602 315
US-A- 5 482 109
US-A- 4 785 379
US-B2- 6 320 750
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description

    BACKGROUND



    [0001] The invention is directed to electronics packaging, and more particularly, to an electronic assembly with a hybrid electronics package mounted vertically with respect to a circuit board.

    [0002] Electronics packaging is used to protect microelectronics and circuitry by typically encasing them in a sealed high-temperature plastic housing. In the avionics industry, this electronics packaging is then affixed to a circuit board, such as a printed circuit board, which is mounted within an electronic box, frequently along with other similar printed circuit board assemblies for electronic control. The electronics packaging must be mounted to the printed circuit board so as to withstand the harsh mechanical, structural, electrical, and thermal requirements of the avionics environment.

    [0003] Conventional practice for electronics packaging is to populate the printed circuit board with commercial-off-the-shelf electrical components that extend just above the surface of the printed circuit board along a horizontal plane parallel thereto. However, this arrangement does not optimize the space and weight of the resulting assembly, as populating each circuit board with additional electrical components to achieve desired functionality increases the overall surface area of the printed circuit board.

    SUMMARY



    [0004] Viewed from one aspect the present invention provides an electronic assembly comprising: a first electronic hybrid assembly; a second electronic hybrid assembly; and a heat sink having a center wall, the first electronic hybrid assembly and the second electronic hybrid assembly being mounted on opposing sides of the center wall from one another, characterized by: a first substrate fabricated from a ceramic material and contained within the first electronic hybrid assembly and connected to the heat sink, and a second substrate fabricated from a ceramic material and contained within the second electronic hybrid assembly and connected to the heat sink; wherein the first electronic hybrid assembly includes a first outer cover and houses at least one electronic component mounted to the first substrate and the second electronic hybrid assembly includes a second outer cover and houses at least one electronic component mounted to the second substrate; wherein the heat sink includes a first column disposed at a first end of the heat sink, and a second column disposed at a second opposing end of the heat sink with the center wall extending between the first column and the second column; and wherein the first column and second column have threaded holes to receive a fastener for connecting the electronic assembly to a circuit board.

    BRIEF DESCRIPTION OF THE DRAWINGS



    [0005] 

    FIG. 1 is a perspective view of a portion of an electrical box which houses at least two circuit boards with electronic components and multi-hybrid modules mounted thereto.

    FIG. 2 is a perspective view of one of the multi-hybrid modules of FIG. 1 showing a heat sink, substrates, and two hybrid assemblies.

    FIG. 2A is side view of the multi-hybrid module of FIG. 2.

    FIG. 2B is a sectional view of the multi-hybrid module of FIG. 2A taken along line B-B and showing electrical components internal to the multi-hybrid module.


    DETAILED DESCRIPTION



    [0006] FIG. 1 shows a perspective view of a portion of an electrical box or housing 10. Electrical box 10 houses a plurality of circuit boards therein (only two circuit boards 12a and 12b are shown in the portion of the electrical box 10 illustrated in FIG. 1). In addition to circuit boards 12a and 12b, electrical box 10 houses microprocessors 13a and 13b, multi-hybrid modules 14a and 14b, and features 16a and 16b.

    [0007] Electrical box 10 is of standard construction with a chassis constructed of a metal such as aluminum. Electrical box 10 surrounds circuit boards 12a and 12b and houses circuit boards 12a and 12b in a stack formation therein. Circuit boards 12a and 12b comprise printed circuit boards and are populated with a plurality of electronic components such as microprocessors 13a and 13b and multi-hybrid modules 14a and 14b. Circuit boards 12a and 12b are mechanically supported relative to electrical box 10 by features 16a and 16b. Each circuit board 12a and 12b mechanically supports and electrically connects components such as microprocessor 13a and multi-hybrid module 14a using conductive pathways. Microprocessors 13a and 13b are illustrated for exemplary purposes in FIG. 1, and are one of many electronic components that circuit board 12a can be populated with based on desired functionality.

    [0008] Multi-hybrid modules 14a and 14b will be discussed in detail subsequently, however, FIG. 1 illustrates that multi-hybrid modules 14a and 14b are configured to mount generally perpendicularly with respect to circuit boards 12a and 12b, respectively. This configuration allows multi-hybrid modules 14a and 14b to utilize the vertical space between circuit board 12a and circuit board 12b and circuit board 12b and chassis of electrical box 10 while still meeting the mechanical, structural, electrical, and thermal requirements of the avionics environment in which multi-hybrid modules 14a and 14b are disposed. With the vertical configuration described, the size and weight of each circuit board 12a and 12b can be reduced. More particularly, by mounting multi-hybrid modules 14a and 14b generally perpendicularly with respect to circuit boards 12a and 12b so as to reduce multi-hybrid modules 14a and 14b horizontal profiles (area) on circuit boards 12a and 12b, the area of circuit boards 12a and 12b can be reduced by over 75 percent, and the weight of each circuit board 12a and 12b can be significantly reduced.

    [0009] FIG. 2 shows one multi-hybrid module 14a mounted on circuit board 12a. Multi-hybrid module 14a includes a first hybrid assembly 18a, a second hybrid assembly 18b, a first substrate 20a, and a second substrate 20b. First substrate 20a is part of first hybrid assembly 20a and second substrate 20b is part of second hybrid assembly 18b. Multi-hybrid module 14a additionally includes a heat sink 22 and lead terminations 24a and 24b (FIG. 2B). Heat sink 22 includes a first column 22a, a second column 22b, and a center wall 22c.

    [0010] First and second hybrid assemblies 18a and 18b are mounted on opposing sides of multi-hybrid module 14a from one another. More particularly, heat sink 22 is disposed between first hybrid assembly 18a and second hybrid assembly 18b. Heat sink 22 and first and second hybrid assemblies 18a and 18b are mounted on circuit board 12a so as to extend generally perpendicular with respect thereto. First hybrid assembly 18a and second hybrid assembly 18b are connected to the heat sink 22 via first substrate 20a and second substrate 20b and extend generally vertically with respect to circuit board 12a. Outer cover of first hybrid assembly 18a is bonded to generally flat first substrate 20a which in turn is bonded on heat sink 22. Bonding can be accomplished by a high temperature adhesive such as an epoxy. More particularly, first substrate 20a is mounted on a first side of center wall 22c between first column 22a and second column 22b and has a lower edge that is contacted by lead terminations 24a. Similarly, second hybrid assembly 18b has an outer cover that is bonded to generally flat second substrate 20b which in turn is bonded on heat sink 22. More particularly, second substrate 20b is mounted on an opposing side of center wall 22c from first substrate 20a between first column 22a and second column 22b and has a lower edge that is contacted by lead terminations 24b (FIG. 2B). Lead terminations 24a are disposed about the lower portion of first substrate 20a and connect between circuit board 12a contacts and contacts in first substrate 20a to accomplish an electrical connection. Similarly, lead terminations 24b are disposed about the lower portion of second substrate 20b and connect between circuit board 12a contacts and contacts in second substrate 20b to accomplish an electrical connection.

    [0011] First and second hybrid assemblies 18a and 18b with outer covers made of a high temperature plastic, or metal, such as aluminum, house one or more electronic components therein. First and second substrates 20a and 20b comprise circuitry that supports electrical components housed within first and second hybrid assemblies 18a and 18b. First and second substrates 20a and 20b have electrical conductors thereon that connect the electrical components to circuit board 12a via lead terminations 24a and 24b. First and second substrates 20a and 20b are fabricated from a ceramic material that is thermally conductive but electrically insulating.

    [0012] Heat sink 22 comprises a metal, such as aluminum, and provides a thermal pathway for heat to be transferred away from the one or more electronic components housed in first and second hybrid assemblies 18a and 18b to circuit board 12a. First column 22a and second column 22b comprise posts and are connected by center wall 22c so as to form pockets in which first hybrid assembly 18a and second hybrid assembly 18b can be mounted. First column 22a, second column 22b, and center wall 22c have a vertical orientation, such that they are mounted to circuit board 12a so as to be generally perpendicular to a plane defined by the surface of circuit board 12a. The size of heat sink 22, including first column 22a, second column 22b, and center wall 22c can be altered to meet operational criteria such as vibration levels and the required amount of heat transfer away from first and second hybrid assemblies 18a and 18b.

    [0013] FIG. 2A shows a side view of multi-hybrid module 14a. In addition to the features previously discussed, FIG. 2A illustrates that the base portion of first column 22a is threaded hole 26a and the base portion of second column 22b is threaded hole 26b. Threaded holes 26a and 26b receive fasteners 28a and 28b, respectively. This allows multi-hybrid module 14a to mount on circuit board 12a. More particularly, fasteners 28a and 28b extend through circuit board 12a and are received in threaded holes 26a and 26b. First column 22a and second column 22b (along with fasteners 28a and 28b) provide rigidity and support for multi-hybrid module 14a in the harsh avionics environment. In addition to providing rigidity, first and second columns 22a and 22b contact circuit board 12a in order to provide for heat transfer away from multi-hybrid module 14a. Additionally, first and second columns 22a and 22b have exposed surface area adequate to provide for heat transfer to air, if air is being moved across circuit board 12a. Generally flat thinner center wall 22c extends between first column 22a and second column 22b. Flat center portion interfaces with first substrate 20a and second substrate 20b and has adequate surface area to provide for a desired amount of heat transfer away from first and second hybrid assemblies 18a and 18b. Although illustrated as cylindrical in the FIGURES, first column 22a and second column 22b can have any shape as is practical to manufacture.

    [0014] FIG. 2B shows a cross-section of multi-hybrid module 14a of FIG. 2A. FIG. 2B illustrates a first electronic component 30a, a second electronic component 30b, and bond wires 32. Additionally, lead terminations 24a and 24b include multiple bends 34.

    [0015] As shown in FIG. 2B, first hybrid assembly 18a and second hybrid assembly 18b are connected to heat sink 22 so as to cantilever from the heat sink 22 above the circuit board 12a. First electronic component 30a is housed in first hybrid assembly 18a and is electrically connected to conductive pads/traces on first substrate 20a by bond wires 32. Similarly, second electronic component 30b is housed in second hybrid assembly 18b and is electrically connected to conductive pads/traces on second substrate 20b by bond wires 32. Lead terminations 24a and 24b are disposed around bottom portions of first substrate 20a and second substrate 20b and have multiple bends 34, which allow lead terminations 24a and 24b to be compliant and flex when contacted by the surface of circuit board 12a when heat sink 22 is mounted. This configuration allows lead terminations 24a and 24b to be coplanar with the surface of circuit board 12a.

    [0016] For simplicity, first electronic component 30a is illustrated as a single component, housed within first hybrid assembly 18a and disposed on first substrate 20a. However, in other embodiments first electronic component 30a and second electronic component 30b can comprise a plurality of analog or digital electronic components and can be disposed on or adjacent to multiple substrates. A non-exhaustive list of electronic components that can be housed in hybrid assembly 18a and 18b include: various circuits, various microcircuits, resistors, capacitors, diodes, transistors, op-amps, switches, multiplexers, and microprocessors. As disclosed herein, the term "hybrid" refers to electronic components that contain specialized components and features, which allow the electronic components to be used in the avionics environment.

    [0017] While the invention has been described with reference to an exemplary embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention, which is defined by the claims. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.


    Claims

    1. An electronic assembly (14a) comprising:

    a first electronic hybrid assembly (18a);

    a second electronic hybrid assembly (18b); and

    a heat sink (22) having a center wall (22c), the first electronic hybrid assembly and the second electronic hybrid assembly being mounted on opposing sides of the center wall from one another,

    characterized by:

    a first substrate (20a) fabricated from a ceramic material and contained within the first electronic hybrid assembly and connected to the heat sink, and

    a second substrate (20b) fabricated from a ceramic material and contained within the second electronic hybrid assembly and connected to the heat sink;

    wherein the first electronic hybrid assembly includes a first outer cover and houses at least one electronic component (30a) mounted to the first substrate and the second electronic hybrid assembly includes a second outer cover and houses at least one electronic component (30b) mounted to the second substrate;

    wherein the heat sink includes a first column (22a) disposed at a first end of the heat sink, and a second column (22b) disposed at a second opposing end of the heat sink with the center wall extending between the first column and the second column; and

    wherein the first column and second column have threaded holes (26a, 26b) to receive a fastener (28a, 28b) for connecting the electronic assembly to a circuit board.


     
    2. The electronic assembly of claim 1, wherein the first electronic hybrid assembly and the second electronic hybrid assembly are affixed to either side of the center wall of the heat sink between the first column and the second column.
     
    3. The electronic assembly of any preceding claim, further comprising a plurality of compliant lead terminations (24a, 24b) disposed around a bottom portion of the first substrate and second substrate, the lead terminations having multiple bends (34) which allow the lead terminations to contact and be co-planar with a surface of a circuit board to which the electronic assembly may be mounted.
     
    4. A multi-hybrid module mounted to a circuit board (12a) comprising:

    the electronic assembly of any preceding claim,

    wherein the heat sink is fastened to the circuit board and extends generally perpendicular with respect to a plane of the circuit board; and

    wherein the first hybrid assembly and the second hybrid assembly are mounted on either side of the heat sink so as to be disposed generally perpendicularly with respect to the plane of the circuit board.


     
    5. The assembly of claim 4, wherein the first electronic hybrid assembly and the second electronic hybrid assembly extend generally vertically between the circuit board and a second circuit board (12b).
     
    6. The assembly of claim 4 or 5, wherein the first electronic hybrid assembly and the second electronic hybrid assembly are mounted on the heat sink so as to be edge mounted with respect to the circuit board.
     
    7. The assembly of claim 4, 5 or 6, wherein the first electronic hybrid assembly and the second electronic hybrid assembly are affixed to either side of a center wall (22c) of the heat sink between the first column (22a) and the second column (22b) and contact the circuit board via lead terminations.
     
    8. The assembly of claim 4, 5, 6 or 7, further comprising:
    an electronic box (10) housing the electronic assembly and the circuit board, the electronic box additionally housing a plurality of circuit boards with one or more electronic assemblies mounted thereto.
     


    Ansprüche

    1. Elektronische Baugruppe (14a), umfassend:

    eine erste elektronische Hybridbaugruppe (18a);

    eine zweite elektronische Hybridbaugruppe (18b); und

    einen Kühlkörper (22), der eine Mittelwand (22c) aufweist, wobei die erste elektronische Hybridbaugruppe und die zweite elektronische Hybridbaugruppe auf voneinander gegenüberliegenden Seiten der Mittelwand montiert sind,

    gekennzeichnet durch:

    ein erstes Substrat (20a), das aus einem Keramikmaterial hergestellt ist und innerhalb der ersten elektronischen Hybridbaugruppe enthalten ist und mit dem Kühlkörper verbunden ist, und

    ein zweites Substrat (20b), das aus einem Keramikmaterial hergestellt ist und innerhalb der zweiten elektronischen Hybridbaugruppe enthalten ist und mit dem Kühlkörper verbunden ist;

    wobei die erste elektronische Hybridbaugruppe eine erste Außenabdeckung beinhaltet und mindestens eine elektronische Komponente (30a) einhaust, die auf das erste Substrat montiert ist, und die zweite elektronische Hybridbaugruppe eine zweite Außenabdeckung beinhaltet und mindestens eine elektronische Komponente (30b) einhaust, die auf das zweite Substrat montiert ist;

    wobei der Kühlkörper eine erste Säule (22a), die an einem ersten Ende des Kühlkörpers angeordnet ist, und eine zweite Säule (22b) beinhaltet, die an einem zweiten gegenüberliegenden Ende des Kühlkörpers angeordnet ist, wobei sich die Mittelwand zwischen der ersten Säule und der zweiten Säule erstreckt; und

    wobei die erste Säule und zweite Säule Gewindelöcher (26a, 26b) zum Empfangen eines Befestigungsmittels (28a, 28b) für ein Verbinden der elektronischen Baugruppe mit einer Leiterplatte aufweisen.


     
    2. Elektronische Baugruppe nach Anspruch 1, wobei die erste elektronische Hybridbaugruppe und die zweite elektronische Hybridbaugruppe auf jeder Seite der Mittelwand des Kühlkörpers zwischen der ersten Säule und der zweiten Säule befestigt sind.
     
    3. Elektronische Baugruppe nach einem der vorhergehenden Ansprüche, ferner umfassend eine Vielzahl von konformen Leiterabschlüssen (24a, 24b), die um einen unteren Abschnitt des ersten Substrats und zweiten Substrats angeordnet sind, wobei die Leiterabschlüsse mehrere Biegungen (34) aufweisen, welche das Kontaktieren und koplanare Gestalten der Leiterabschlüsse mit einer Oberfläche einer Leiterplatte, auf die die elektronische Baugruppe montiert werden kann, gewähren.
     
    4. Multihybridmodul, das auf eine Leiterplatte (12a) montiert ist, umfassend:

    die elektronische Baugruppe nach einem der vorhergehenden Ansprüche,

    wobei der Kühlkörper an der Leiterplatte befestigt ist und sich im Allgemeinen senkrecht in Bezug auf eine Ebene der Leiterplatte erstreckt; und

    wobei die erste Hybridbaugruppe und die zweite Hybridbaugruppe auf jeder Seite des Kühlkörpers montiert sind, um im Allgemeinen senkrecht in Bezug auf die Ebene der Leiterplatte angeordnet zu sein.


     
    5. Baugruppe nach Anspruch 4, wobei sich die erste elektronische Hybridbaugruppe und die zweite elektronische Hybridbaugruppe im Allgemeinen vertikal zwischen der Leiterplatte und einer zweiten Leiterplatte (12b) erstrecken.
     
    6. Baugruppe nach Anspruch 4 oder 5, wobei die erste elektronische Hybridbaugruppe und die zweite elektronische Hybridbaugruppe auf den Kühlkörper montiert sind, um in Bezug auf die Leiterplatte randgefasst zu sein.
     
    7. Baugruppe nach Anspruch 4, 5 oder 6, wobei die erste elektronische Hybridbaugruppe und die zweite elektronische Hybridbaugruppe an jeder Seite einer Mittelwand (22c) des Kühlkörpers zwischen der ersten Säule (22a) und der zweiten Säule (22b) befestigt sind und die Leiterplatte über Leiterabschlüsse kontaktieren.
     
    8. Baugruppe nach Anspruch 4, 5, 6 oder 7, ferner umfassend:
    eine Elektronikbox (10), die die elektronische Baugruppe und die Leiterplatte einhaust, wobei die Elektronikbox zusätzlich eine Vielzahl von Leiterplatten mit einer oder mehreren elektronischen Baugruppen, die an dieser montiert sind, einhaust.
     


    Revendications

    1. Ensemble électronique (14a) comprenant :

    un premier ensemble hybride électronique (18a) ;

    un second ensemble hybride électronique (18b) ; et

    un dissipateur thermique (22) ayant une paroi centrale (22c), le premier ensemble hybride électronique et le second ensemble hybride électronique étant montés sur des côtés opposés de la paroi centrale l'un par rapport à l'autre,

    caractérisé par :

    un premier substrat (20a) fabriqué à partir d'un matériau céramique et contenu à l'intérieur du premier ensemble hybride électronique et relié au dissipateur thermique, et

    un second substrat (20b) fabriqué à partir d'un matériau céramique et contenu à l'intérieur du second ensemble hybride électronique et relié au dissipateur thermique ;

    dans lequel le premier ensemble hybride électronique comporte un premier couvercle extérieur et loge au moins un composant électronique (30a) monté sur le premier substrat et le second ensemble hybride électronique comporte un second couvercle extérieur et loge au moins un composant électronique (30b) monté sur le second substrat ;

    dans lequel le dissipateur thermique comporte une première colonne (22a) disposée à une première extrémité du dissipateur thermique, et une seconde colonne (22b) disposée à une seconde extrémité opposée du dissipateur thermique avec la paroi centrale s'étendant entre la première colonne et la seconde colonne ; et

    dans lequel la première colonne et la seconde colonne ont des trous filetés (26a, 26b) pour recevoir une attache (28a, 28b) pour relier l'ensemble électronique à une carte de circuit imprimé.


     
    2. Ensemble électronique selon la revendication 1, dans lequel le premier ensemble hybride électronique et le second ensemble hybride électronique sont fixés de chaque côté de la paroi centrale du dissipateur thermique entre la première colonne et la seconde colonne.
     
    3. Ensemble électronique selon une quelconque revendication précédente, comprenant en outre une pluralité de terminaisons de fil conformes (24a, 24b) disposées autour d'une partie inférieure du premier substrat et du second substrat, les terminaisons de fil ayant de multiples coudes (34) qui permettent aux terminaisons de fil d'entrer en contact et d'être coplanaires avec une surface d'une carte de circuit imprimé sur laquelle l'ensemble électronique peut être monté.
     
    4. Module multi-hybride monté sur une carte de circuit imprimé (12a) comprenant :

    l'ensemble électronique selon une quelconque revendication précédente,

    dans lequel le dissipateur thermique est fixé à la carte de circuit imprimé et s'étend généralement perpendiculairement par rapport à un plan de la carte de circuit imprimé ; et

    dans lequel le premier ensemble hybride et le second ensemble hybride sont montés de chaque côté du dissipateur thermique de manière à être disposés généralement perpendiculairement par rapport au plan de la carte de circuit imprimé.


     
    5. Ensemble selon la revendication 4, dans lequel le premier ensemble hybride électronique et le second ensemble hybride électronique s'étendent généralement verticalement entre la carte de circuit imprimé et une seconde carte de circuit imprimé (12b) .
     
    6. Ensemble selon la revendication 4 ou 5, dans lequel le premier ensemble hybride électronique et le second ensemble hybride électronique sont montés sur le dissipateur thermique de manière à être montés sur les bords par rapport à la carte de circuit imprimé.
     
    7. Ensemble selon la revendication 4, 5 ou 6, dans lequel le premier ensemble hybride électronique et le second ensemble hybride électronique sont fixés de chaque côté d'une paroi centrale (22c) du dissipateur thermique entre la première colonne (22a) et la seconde colonne (22b) et entrent en contact avec la carte de circuit imprimé par l'intermédiaire des terminaisons de fils.
     
    8. Ensemble selon la revendication 4, 5, 6 ou 7, comprenant en outre :
    un boîtier électronique (10) logeant l'ensemble électronique et la carte de circuit imprimé, le boîtier électronique logeant en outre une pluralité de cartes de circuit imprimé avec un ou plusieurs ensembles électroniques montés sur celles-ci.
     




    Drawing