(19)
(11)EP 2 708 505 A1

(12)EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(43)Date of publication:
19.03.2014 Bulletin 2014/12

(21)Application number: 12786765.3

(22)Date of filing:  11.05.2012
(51)Int. Cl.: 
C01B 19/00  (2006.01)
C01G 51/00  (2006.01)
H01L 31/042  (2014.01)
C01G 15/00  (2006.01)
C01G 30/00  (2006.01)
(86)International application number:
PCT/KR2012/003739
(87)International publication number:
WO 2012/157916 (22.11.2012 Gazette  2012/47)
(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 13.05.2011 KR 20110045348
13.05.2011 KR 20110045349
25.05.2011 KR 20110049609
11.05.2012 KR 20120050460

(71)Applicant: LG Chem, Ltd.
Seoul 150-721 (KR)

(72)Inventors:
  • PARK, Cheol-Hee
    Daejeon 305-761 (KR)
  • KIM, Tae-Hoon
    Daejeon 305-728 (KR)

(74)Representative: Goddar, Heinz J. 
Boehmert & Boehmert Pettenkoferstrasse 20-22
80336 München
80336 München (DE)

  


(54)NOVEL COMPOUND SEMICONDUCTOR AND USAGE FOR SAME


(57) Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: InxMyCo4-m-aAmSb12-n-z-bXnQz, where M is at least one selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, A is at least one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt, X is at least one selected from the group consisting of Si, Ga, Ge and Sn, Q is at least one selected from the group consisting of O, S, Se and Te, 0<x<1, 0≤y<1, 0≤m≤1, 0≤a≤1, 0≤n<9, 0≤z≤4, 0≤b≤3 and 0<n+z+b.




Description

TECHNICAL FIELD



[0001] The present disclosure relates to a new compound semiconductor material which may be used for solar cells or as thermoelectric materials, its preparation method, and its applications.

[0002] This application claims priority to Korean Patent Application No. 10-2011-0045348 filed on May 13, 2011, Korean Patent Application No. 10-2011-0045349 filed on May 13, 2011, Korean Patent Application No. 10-2011-0049609 filed on May 25, 2011 and Korean Patent Application No. 10-2012-0050460 filed on May 11, 2012 in the Republic of Korea, the entire contents of which are incorporated herein by reference.

BACKGROUND ART



[0003] A compound semiconductor is not a single element such as silicon and germanium but a compound having two or more kinds of combined elements serving as a semiconductor. Various kinds of compound semiconductors have been developed and used in many fields. For example, a compound semiconductor may be used for thermoelectric conversion devices using a Peltier effect, light emitting devices such as light emitting diodes and laser diodes using a photoelectric conversion effect, solar cells, or the like.

[0004] Among these, the thermoelectric conversion device may be applied to thermoelectric conversion generation, thermoelectric conversion cooling or the like. Here, in the thermoelectric conversion generation, a thermal electromotive force generated by applying a temperature difference to the thermoelectric conversion device is used for converting thermal energy to electric energy.

[0005] The energy conversion efficiency of the thermoelectric conversion device depends on ZT which is a performance index of the thermoelectric conversion material. Here, ZT is determined according to a Seebeck coefficient, electric conductivity, thermal conductivity, or the like. In more detail, ZT is proportional to the square of the Seebeck coefficient and the electric conductivity and is inversely proportional to the thermal conductivity. Therefore, in order to enhance the energy conversion efficiency of the thermoelectric conversion device, development of a thermoelectric conversion material with a high Seebeck coefficient, a high electric conductivity, or a low thermal conductivity is desired.

[0006] Meanwhile, a solar cell is environment-friendly since it does not need an energy source other than solar rays, and therefore are actively studied as an alternative future energy source. A solar cell may be generally classified as a silicon solar cell using a single element of silicon, a compound semiconductor solar cell using a compound semiconductor, and a tandem solar cell where at least two solar cells having different band gap energies are stacked.

[0007] Among these, a compound semiconductor solar cell uses a compound semiconductor in a light absorption layer which absorbs solar rays and generates an electron-hole pair, and may particularly use compound semiconductors in the III-V group such as GaAs, InP, GaAlAs and GaInAs, compound semiconductors in the II-VI group such as CdS, CdTe and ZnS, and compound semiconductors in the I-III-VI group represented by CuInSe2.

[0008] The light absorption layer of the solar cell demands excellent long-term electric and optical stability, high photoelectric conversion efficiency, and easy control of the band gap energy or conductivity by composition change or doping. In addition, conditions such as production cost and yield should also be met for practical use. However, many conventional compound semiconductors fail to meet all of these conditions at once.

DISCLOSURE


Technical Problem



[0009] The present disclosure is designed to solve the problems of the prior art, and therefore it is an object of the present disclosure to provide a new compound semiconductor material, which may be utilized in various ways for thermoelectric conversion materials of thermoelectric conversion devices, solar cells or the like, a preparation method thereof, and a thermoelectric conversion device or solar cell using the same.

[0010] Other objects and advantages of the present disclosure will be understood from the following descriptions and become apparent by the embodiments of the present disclosure. In addition, it is understood that the objects and advantages of the present disclosure may be implemented by components defined in the appended claims or their combinations.

Technical Solution



[0011] In one aspect, after repeated studies of a compound semiconductor, inventors of the present disclosure have successfully synthesized a compound semiconductor represented by Chemical Formula 1, and found that this compound can be used for a thermoelectric conversion material of a thermoelectric conversion device or a light absorption layer of a solar cell.

        Chemical Formula 1     InxMyCo4-m-aAmSb12-n-z-bXnQz

where M is at least one selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, A is at least one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt, X is at least one selected from the group consisting of Si, Ga, Ge and Sn, Q is at least one selected from the group consisting of O, S, Se and Te, 0<x<1, 0≤y<1, 0≤m≤1, 0≤a≤1, 0≤n<9, 0≤z≤4, 0≤b≤3 and 0<n+z+b.

[0012] Preferably, in Chemical Formula 1, 0<x+y≤1.

[0013] Also preferably, in Chemical Formula 1, 0<n+z+b≤9.

[0014] Also preferably, in Chemical Formula 1, 0<x≤0.5.

[0015] Also preferably, in Chemical Formula 1, 0<z≤2.

[0016] In another aspect, the present disclosure also provides a preparation method of a compound semiconductor, which includes: forming a mixture containing In and Co; and thermally treating the mixture, thereby preparing the compound semiconductor expressed by Chemical Formula 1.

[0017] Preferably, the mixture further includes at least one element selected from the group consisting of O, S, Se, Te and their oxides.

[0018] Also preferably, the mixture further includes at least one element selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and their oxides.

[0019] Also preferably, the mixture further includes at least one element selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir, Pt and their oxides.

[0020] Also preferably, the mixture further includes Sb.

[0021] Also preferably, the mixture further includes at least one element selected from the group consisting of Si, Ga, Ge, Sn and their oxides.

[0022] Preferably, in the preparation method of a compound semiconductor, the thermally treating step is performed at 400°C to 800°C.

[0023] Also preferably, the thermally treating step includes at least two thermal treatment stages.

[0024] In another aspect, the present disclosure also provides a thermoelectric conversion device, which includes the compound semiconductor as above.

[0025] In another aspect, the present disclosure also provides a solar cell, which includes the compound semiconductor as above.

Advantageous Effects



[0026] According to the present disclosure, a new compound semiconductor material is provided.

[0027] In one aspect, the new compound semiconductor may replace a conventional compound semiconductor or may be used as another material in addition to the conventional compound semiconductor.

[0028] Further, in one aspect of the present disclosure, since the compound semiconductor has good thermoelectric conversion performance, it may be used for a thermoelectric conversion device. In particular, the compound semiconductor of the present disclosure has low thermal conductivity and high electric conductivity. Therefore, the compound semiconductor of the present disclosure may have an improved ZT value which is a thermoelectric performance index. For this reason, the compound semiconductor of the present disclosure may be suitably used as a thermoelectric conversion material of a thermoelectric conversion device.

[0029] In addition, in another aspect of the present disclosure, the compound semiconductor may be used for a solar cell. Particularly, the compound semiconductor of the present disclosure may be used as a light absorption layer of the solar cell.

[0030] Moreover, in another aspect of the present disclosure, the compound semiconductor may be used for an IR window or IR sensor which selectively passes IR, a magnetic device, a memory or the like.

DESCRIPTION OF DRAWINGS



[0031] Other objects and aspects of the present disclosure will become apparent from the following descriptions of the embodiments with reference to the accompanying drawings in which:

FIG. 1 is a graph showing thermal conductivity values according to a temperature change of compound semiconductors according to Examples 1 to 4 according to the present disclosure and a comparative example;

FIG. 2 is a graph showing ZT values according to a temperature change of compound semiconductors according to Examples 1 to 4 according to the present disclosure and the comparative example;

FIG. 3 is a graph showing electric conductivity values according to a temperature change of compound semiconductors according to Examples 5 to 7 according to the present disclosure and the comparative example;

FIG. 4 is a graph showing thermal conductivity values according to a temperature change of compound semiconductors according to Examples 5 to 7 according to the present disclosure and the comparative example;

FIG. 5 is a graph showing ZT values according to a temperature change of compound semiconductors according to Examples 5 to 7 according to the present disclosure and the comparative example;

FIG. 6 is a graph showing electric conductivity values according to a temperature change of compound semiconductors according to Example 8 according to the present disclosure and the comparative example;

FIG. 7 is a graph showing power factor values according to a temperature change of compound semiconductors according to Example 8 according to the present disclosure and the comparative example;

FIG. 8 is a graph showing thermal diffusivity values according to a temperature change of compound semiconductors according to Examples 9 and 10 according to the present disclosure and the comparative example; and

FIGS. 9 to 17 are graphs showing thermal conductivity values according to a temperature change of compound semiconductors according to Examples 11 to 19 according to the present disclosure and the comparative example.


PREFERRED EMBODIMENTS



[0032] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Prior to the description, it should be understood that the terms used in the specification and the appended claims should not be construed as limited to general and dictionary meanings, but interpreted based on the meanings and concepts corresponding to technical aspects of the present disclosure based on the principle that the inventor is allowed to define terms.

[0033] Therefore, the description proposed herein is just a preferable example for the purpose of illustration only, and is not intended to limit the scope of the disclosure, so it should be understood that other equivalents and modifications could be made thereto without departing from the spirit and scope of the disclosure.

[0034] The present disclosure provides a new compound semiconductor represented by Chemical Formula 1 below.

        Chemical Formula 1     InxMyCo4-m-aAmSb12-n-z-bXnQz

where M is at least one selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, A is at least one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt, X is at least one selected from the group consisting of Si, Ga, Ge and Sn, Q is at least one selected from the group consisting of O, S, Se and Te, 0<x<1, 0≤y<1, 0≤m≤1, 0≤a≤1, 0≤n<9, 0≤z≤4, 0≤b≤3 and 0<n+z+b.

[0035] Preferably, in Chemical Formula 1, 0≤m≤0.5.

[0036] Also preferably, in Chemical Formula 1, 0≤a≤0.5.

[0037] Also preferably, in Chemical Formula 1, 0≤b≤0.5.

[0038] Also preferably, in Chemical Formula 1, 0<x+y≤1.

[0039] Also preferably, in Chemical Formula 1, 0<n+z+b≤9.

[0040] More preferably, in Chemical Formula 1, 0<n+z+b≤5.

[0041] Most preferably, in Chemical Formula 1, 0<n+z+b≤3.

[0042] Also preferably, in Chemical Formula 1, 0<x≤0.5.

[0043] More preferably, in Chemical Formula 1, 0<x≤0.25.

[0044] Also preferably, in Chemical Formula 1, 0<z≤2.

[0045] Meanwhile, the compound semiconductor expressed by Chemical Formula 1 may include a secondary phase, and the amount of the secondary phase may vary depending on a thermal treatment condition.

[0046] The above compound semiconductor may be prepared by a method including: forming a mixture containing In and Co; and thermally treating the mixture, thereby preparing the compound semiconductor expressed by Chemical Formula 1.

[0047] Preferably, the mixture may further include at least one element selected from the group consisting of O, S, Se, Te and their oxides.

[0048] Also preferably, the mixture may further include at least one element selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and their oxides.

[0049] Also preferably, the mixture may further include at least one element selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir, Pt and their oxides.

[0050] Also preferably, the mixture may further include Sb.

[0051] Also preferably, the mixture may further include at least one element selected from the group consisting of Si, Ga, Ge, Sn and their oxides.

[0052] Meanwhile, each material used in the mixture forming step may be in a powder form, but the present disclosure is not limited to a specific form of the material.

[0053] Also preferably, the thermally treating step may be performed in vacuum or in a gas such as Ar, He and N2, partially containing hydrogen or not containing hydrogen.

[0054] At this time, the thermally treating temperature may be 400°C to 800°C. Preferably, the thermally treating temperature may be 450°C to 700°C. More preferably, the thermally treating temperature may be 500°C to 650°C.

[0055] Meanwhile, the thermally treating step may include at least two thermal treatment stages. For example, a first thermal treatment may be performed at a first temperature to the mixture obtained in the mixture forming step, namely in the step of mixing materials, and a second thermal treatment may be performed thereto at a second temperature.

[0056] Here, some of the thermal treatment stages may be performed during the mixture forming step where materials are mixed is executed.

[0057] For example, the thermally treating step may include three thermal treatment stages composed of a first thermal treatment stage, a second thermal treatment stage and a third thermal treatment (sintering) stage. In addition, the first thermal treatment stage may be performed in a temperature range of 400°C to 600°C, and the second and third thermal treatment stages may be performed in a temperature range of 600°C to 800°C. The first thermal treatment stage may be performed during the mixture forming step, and the second and third thermal treatment stages may be performed in order after the mixture forming step.

[0058] A thermoelectric conversion device according to the present disclosure may include the compound semiconductor described above. In other words, the compound semiconductor according to the present disclosure may be used as a thermoelectric conversion material for the thermoelectric conversion device. Particularly, the compound semiconductor according to the present disclosure has a large ZT value, which is a performance index of the thermoelectric conversion material. In addition, due to low thermal conductivity, a high Seebeck coefficient and high electric conductivity, the compound semiconductor has excellent thermoelectric conversion performance. Therefore, the compound semiconductor according to the present disclosure may replace a conventional thermoelectric conversion material or may be used for a thermoelectric conversion device in addition to the conventional compound semiconductor.

[0059] In addition, a solar cell according to the present disclosure may include the compound semiconductor above. In other words, the compound semiconductor according to the present disclosure may be used for a solar cell, particularly as a light absorption layer of the solar cell.

[0060] The solar cell may be produced in a structure where a front surface transparent electrode, a buffer layer, a light absorption layer, a rear surface electrode and a substrate are laminated in order from the side where a solar ray is incident. The substrate located at the lowest portion may be made of glass, and the rear surface electrode on the entire surface thereof may be formed by depositing metal such as Mo.

[0061] Subsequently, the compound semiconductor according to the present disclosure may be laminated on the rear surface electrode by means of an electron beam deposition method, a sol-gel method, or a PLD (Pulsed Laser Deposition) to form the light absorption layer. On the light absorption layer, a buffer layer for buffering the difference in lattice constants and band gaps between a ZnO layer serving as the front surface transparent electrode and the light absorption layer may be present. The buffer layer may be formed by depositing a material such as CdS by means of CBD (Chemical Bath Deposition) or the like. Next, the front surface transparent electrode may be formed on the buffer layer by means of sputtering or the like as a ZnO film or a ZnO and ITO laminate.

[0062] The solar cell according to the present disclosure may be modified in various ways. For example, it is possible to manufacture a tandem solar cell where a solar cell using the compound semiconductor according to the present disclosure as the light absorption layer is laminated. In addition, the solar cell laminated as described above may employ a solar cell using silicon or another known compound semiconductor.

[0063] In addition, it is possible to change a band gap of the compound semiconductor according to the present disclosure and laminate a plurality of solar cells which use compound semiconductors having different band gaps as the light absorption layer. The band gap of the compound semiconductor according to the present disclosure may be adjusted by changing a composition ratio of a component of the compound, particularly Te.

[0064] In addition, the compound semiconductor according to the present disclosure may also be applied to IR windows or IR sensors which selectively pass IR.

EXAMPLES



[0065] Hereinafter, embodiments of the present disclosure will be described in detail. The embodiments of the present disclosure, however, may take several other forms, and the scope of the present disclosure should not be construed as being limited to the following examples. The embodiments of the present disclosure are provided to more fully explain the present disclosure to those having ordinary knowledge in the art to which the present disclosure pertains.

Example 1



[0066] In, Co and Sb were prepared as reagents, and were mixed by using mortar to make a mixture having a composition of In0.25Co4Sb11 in a pellet form. The mixture was heated at 500°C for 15 hours under H2 (1.94%) and N2 gas. The time for raising the temperature to 500°C was 1 hour and 30 minutes.

[0067] Next, Te was added to In0.25Co4Sb11 as a reagent to make an In0.25Co4Sb11Te1 mixture. The mixture was prepared in a glove bag filled with Ar.

[0068] The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb11Te1 powder was obtained.

[0069] A part of the composed materials prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP (Cold Isostatic Pressing). Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0070] In regard to the sintered disk, thermal conductivity (κ) of the material prepared above was measured by using TC-7000 (Ulvac-Rico, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 1 as Example 1.

[0071] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. In addition, a ZT value was calculated by using each measured value. The calculation result is shown in FIG. 2 as Example 1.

Example 2



[0072] In, Co and Sb were prepared as reagents, and were mixed by using mortar to make a mixture having compositions of In0.25Co4Sb10 and In0.25Co4Sb11 in a pellet form. The mixture was heated at 500°C for 15 hours under H2 (1.94%) and N2 gas. The time for raising the temperature to 500°C was 1 hour and 30 minutes.

[0073] Next, Te was added to In0.25Co4Sb10 as a reagent to make an In0.25Co4Sb10Te2 mixture. In addition, this mixture was suitably mixed with the In0.25Co4Sb11 to make an In0.25Co4Sb10.75Te1.25 mixture. The mixture was prepared in a glove bag filled with Ar.

[0074] The materials mixed as above were put in a silica tube and vacuum-sealed, and then were heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb10.75Te1.25 powder was obtained.

[0075] A part of the material prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0076] In regard to the sintered disk, thermal conductivity (κ) of the material prepared above was measured by using TC-7000 (Ulvac-Rico, Inc). The measurement result is shown in FIG. 1 as Example 2.

[0077] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. In addition, a ZT value was calculated by using each measured value. The calculation result is shown in FIG. 2 as Example 2.

Example 3



[0078] In, Co and Sb were prepared as reagents, and were mixed by using mortar to make a mixture having compositions of In0.25Co4Sb10 and In0.25Co4Sb11 in a pellet form. The mixture was heated at 500°C for 15 hours under H2 (1.94%) and N2 gas. The time for raising the temperature to 500°C was 1 hour and 30 minutes.

[0079] Next, Te was added to In0.25Co4Sb10 as a reagent to make an In0.25Co4Sb10Te2 mixture. In addition, the mixture was suitably mixed with the In0.25Co4Sb11 to make an In0.25Co4Sb10.5Te1.5 mixture. The mixture was prepared in a glove bag filled with Ar.

[0080] The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. Here, the temperature rising time was 1 hour and 30 minutes, and In0.25Co4Sb10.5Te1.5 powder was obtained.

[0081] A part of the material prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0082] In regard to the sintered disk, thermal conductivity (κ) of the material prepared above was measured by using TC-7000 (Ulvac-Rico, Inc). The measurement result is shown in FIG. 1 as Example 3.

[0083] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. In addition, a ZT value was calculated by using each measured value. The calculation result is shown in FIG. 2 as Example 3.

Example 4



[0084] In, Co and Sb were prepared as reagents, and were mixed by using mortar to make a mixture having a composition of In0.25Co4Sb10 in a pellet form. The mixture was heated at 500°C for 15 hours under H2 (1.94%) and N2 gas. The time for raising the temperature to 500°C was 1 hour and 30 minutes.

[0085] Next, Te was added to In0.25Co4Sb10 as a reagent to make an In0.25Co4Sb10Te2 mixture. The mixture was prepared in a glove bag filled with Ar.

[0086] The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. Here, the time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb10Te2 powder was obtained.

[0087] A part of the material prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0088] In regard to the sintered disk, thermal conductivity (κ) of the material prepared above was measured by using TC-7000 (Ulvac-Rico, Inc). The measurement result is shown in FIG. 1 as Example 4.

[0089] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. In addition, a ZT value was calculated by using each measured value. The calculation result is shown in FIG. 2 as Example 4.

Example 5



[0090] In, Co, Zn, Sb and Te were prepared as reagents, and were mixed by using mortar to make a mixture having a composition of In0.25Zn0.1Co4Sb11Te in a pellet form. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Co4Sb11Te powder was obtained.

[0091] A part of the composed materials prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mn, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0092] In regard to the sintered disk, thermal conductivity (κ) of the material prepared above was measured by using TC-7000 (Ulvac-Rico, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 4 as Example 5.

[0093] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. At this time, the measurement results of the electric conductivity (σ) are shown in FIG. 3 as Example 5. In addition, a ZT value was calculated by using each measured value. The calculation result is shown in FIG. 5 as Example 5.

Examples 6



[0094] In, Co, Zn, Cd, Sb and Te were prepared as reagents, and were mixed by using mortar to make a mixture having a composition of In0.25Zn0.1Cd0.1Co4Sb11Te in a pellet form. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Cd0.1Co4Sb11Te powder was obtained.

[0095] A part of the composed materials prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0096] In regard to the sintered disk, thermal conductivity of the material prepared above was measured by using TC-7000 (Ulvac-Rico, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 4 as Example 6.

[0097] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. At this time, the measurement results of the electric conductivity are shown in FIG. 3 as Example 6. In addition, a ZT value was calculated by using each measured value. The calculation result is shown in FIG. 5 as Example 6.

Example 7



[0098] In, Co, Zn, Cd, Sb, Ni and Te were prepared as reagents, and were mixed by using mortar to make a mixture having a composition of In0.25Zn0.1Cd0.1Co3.98Ni0.02Sb11Te in a pellet form. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Cd0.1Co3.98Ni0.02Sb11Te powder was obtained.

[0099] A part of the composed materials prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0100] In regard to the sintered disk, thermal conductivity of the material prepared above was measured by using TC-7000 (Ulvac-Rico, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 4 as Example 7.

[0101] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. At this time, the measurement results of the electric conductivity are shown in FIG. 3 as Example 7. In addition, a ZT value was calculated by using each measured value. The calculation result is shown in FIG. 5 as Example 7.

Example 8



[0102] In, Co, Sb and Te were prepared as reagents, and were mixed by using mortar to make a mixture having a composition of In0.25Co3.88Sb11Te in a pellet form. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co3.88Sb11Te powder was obtained.

[0103] A part of the composed materials prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0104] In regard to the sintered cylinder, electric conductivity (σ) of the material prepared above was measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. The measurement results are shown in FIG. 6 as Example 8. In addition, a Seebeck coefficient (S) was measured by using ZEM-3 (Ulvac-Rico, Inc), and then a power factor value (PF) was calculated by using each measured value. The calculation result is shown in FIG. 7 as Example 8. Here, PF may be expressed as S2σ.

Example 9



[0105] In, Co and Sb were prepared as reagents, and were mixed by using mortar to make a mixture having compositions of In0.25Co4Sb12 and In0.25Co4Sb10.5 in a pellet form. The mixture was heated at 500°C for 15 hours under H2 (1.94%) and N2 gas. The time for raising the temperature to 500°C was 1 hour and 30 minutes.

[0106] Next, Se was added to In0.25Co4Sb10.5 as a reagent to make an In0.25Co4Sb10.5Se1.5 mixture, which was mixed with In0.25Co4Sb12 prepared above to have a composition of In0.25Co4Sb11.75Se0.25.

[0107] The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb11.75Se0.25 powder was obtained.

[0108] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0109] In regard to the sintered disk, thermal diffusivity (T.D.) was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 8 as Example 9.

Example 10



[0110] In, Co and Sb were prepared as reagents, and were mixed by using mortar to make a mixture having compositions of In0.25Co4Sb12 and In0.25Co4Sb10.5 in a pellet form. The mixture was heated at 500°C for 15 hours under H2 (1.94%) and N2 gas. The time for raising the temperature to 500°C was 1 hour and 30 minutes.

[0111] Next, Se was added to In0.25Co4Sb10.5 as a reagent to make an In0.25Co4Sb10.5Se1.5 mixture, which was mixed with In0.25Co4Sb12 prepared above to have a composition of In0.25Co4Sb11.5Se0.5.

[0112] The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb11.5Se0.5 powder was obtained.

[0113] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0114] In regard to the sintered disk, thermal diffusivity (T.D.) was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 8 as Example 10.

Example 11



[0115] 0.0510g of In, 0.3873g of Co, 2.2923g of Sb, 0.0428g of Co3O4 and 127.6g of Te were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb10.6O0.4Te powder was obtained.

[0116] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours. In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 9 as Example 11.

Example 12



[0117] 0.1727g of In, 1.3121g of Co, 8.1329g of Sb, 0.2375g of Se and 0.1449g of Co3O4 were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb11O0.5Se0.5 powder was obtained.

[0118] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0119] In regard to the sintered disk, thermal conductivity (κ) was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 10 as Example 12.

Example 13



[0120] 0.0681g of In, 0.5452g of Co, 3.2353g of Sb and 0.1514g of Te were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co3.9Sb11.2Te0.5 powder was obtained.

[0121] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0122] In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 11 as Example 13.

Example 14



[0123] 0.0494g of In, 0.0112g of Zn, 0.3648g of Co, 0.0531g of Rh, 2.2612g of Sb, 0.0408g of Sn and 0.2194g of Te were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Co3.6Rh0.3Sb10.8Sn0.2Te powder was obtained.

[0124] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0125] In regard to the sintered disk, thermal conductivity (κ) was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 12 as Example 14.

Example 15



[0126] 0.0504g of In, 0.0115g of Zn, 0.3728g of Co, 0.0543g of Rh, 2.1825g of Sb, 0.1043g of Sn and 0.2242g of Te were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Co3.6Rh0.3Sb10.2Sn0.5Te powder was obtained.

[0127] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours. In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 13 as Example 15.

Example 16



[0128] 0.0497g of In, 0.0113g of Zn, 0.3522g of Co, 0.0713g of Rh, 2.2149g of Sb, 0.1028g of Sn, 0.1768g of Te and 0.0209g of Co3O4 were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Co3.6Rh0.4Sb10.5Sn0.5O0.2Te0.8 powder was obtained.

[0129] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours. In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 14 as Example 16.

Example 17



[0130] 0.0502g of In, 0.0114g of Zn, 0.3708g of Co, 0.0540g of Rh, 2.3409g of Sb, 0.1037g of Sn and 0.0690g of Se were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Co3.6Rh0.3Sb11Sn0.5Se0.5 powder was obtained.

[0131] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours. In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 15 as Example 17.

Example 18



[0132] 0.0520g of In, 0.0119g of Zn, 0.3844g of Co, 0.0559g of Rh, 2.3167g of Sb, 0.1076g of Sn and 0.0715g of Se were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Co3.6Rh0.3Sb10.5Sn0.5Se0.5 powder was obtained.

[0133] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours. In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 16 as Example 18.

Example 19



[0134] 0.0498g of In, 0.0113g of Zn, 0.4037g of Co, 0.0020g of Ni, 2.3078g of Sb, 0.0041g of Sn and 0.2213g of Te were prepared as reagents, and were mixed by using mortar. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. The time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Zn0.1Co3.95Ni0.02Sb10.93Sn0.02Te powder was obtained.

[0135] A part of the composed materials prepared above was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours. In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 17 as Example 19.

Comparative Example



[0136] In, Co and Sb were prepared as reagents, and were mixed by using mortar to make a mixture having a composition of In0.25Co4Sb12 in a pellet form. In addition, the mixture was heated at 500°C for 15 hours under H2 (1.94%) and N2 gas. The time for raising the temperature to 500°C was 1 hour and 30 minutes. The materials mixed as above were put into a silica tube and vacuum-sealed and then heated at 650°C for 36 hours. Here, the time for raising the temperature to 650°C was 1 hour and 30 minutes, and In0.25Co4Sb12 powder was obtained.

[0137] A part of the material prepared above was formed into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disk having a diameter of 10 mm and a thickness of 1 mm. After that, a pressure of 200 MPa was applied thereto by using a CIP. Subsequently, the obtained result was put into a quartz tube and vacuum-sintered for 12 hours.

[0138] In regard to the sintered disk, thermal conductivity was measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIGS. 1, 4, 9 to 17 as the Comparative Example. In addition, thermal diffusivity (T.D.) was also measured by using LFA457 (Netzsch, Inc) at predetermined temperature intervals. The measurement result is shown in FIG. 8 as the Comparative Example.

[0139] In regard to the sintered cylinder, electric conductivity and a Seebeck coefficient of the material prepared above were measured by using ZEM-3 (Ulvac-Rico, Inc) at predetermined temperature intervals. At this time, the measurement result of electric conductivity is shown in FIGS. 3 and 6 as the Comparative Example.

[0140] In addition, a ZT value was calculated by using the measured values. The calculation result is shown in FIGS. 2 and 5 as the Comparative Example. Moreover, a power factor value (PF) was calculated by using each measured value. The calculation result is shown in FIG. 7 as the Comparative Example.

[0141] First, referring to the results shown in FIGS. 1, 4, 9 to 17, it could be found that the compound semiconductors according to Examples of the present disclosure have very low thermal conductivity (κ) over the entire temperature measurement region in comparison to the compound semiconductor of the Comparative Example.

[0142] In particular, referring to the results shown in FIG. 8, it could be found that the compound semiconductors according to Examples of the present disclosure have very low thermal diffusivity (T.D.) in comparison to the compound semiconductor of the Comparative Example.

[0143] In addition, referring to the results shown in FIGS. 3 and 6, it could be found that the compound semiconductors according to Examples of the present disclosure have very high electric conductivity (σ) over the entire temperature measurement region in comparison to the compound semiconductor of the Comparative Example.

[0144] As described above, the compound semiconductors according to Examples of the present disclosure have an improved ZT value, which represents a thermoelectric performance index, due to low thermal conductivity and high electric conductivity in comparison to the compound semiconductor of the Comparative Example. This result may also be confirmed by the results shown in FIGS. 2 and 5.

[0145] Moreover, referring to FIG. 7, it could be found that the compound semiconductors according to some examples of the present disclosure have good power factor values in a high-temperature region in comparison to the compound semiconductor of the Comparative Example.

[0146] The present disclosure has been described in detail. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the disclosure, are given by way of illustration only, since various changes and modifications within the spirit and scope of the disclosure will become apparent to those skilled in the art from this detailed description.


Claims

1. A compound semiconductor, represented by Chemical Formula 1 below:

        Chemical Formula 1     InxMyCo4-m-aAmSb12-n-z-bXnQz

where M is at least one selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, A is at least one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt, X is at least one selected from the group consisting of Si, Ga, Ge and Sn, Q is at least one selected from the group consisting of O, S, Se and Te, 0<x<1, 0≤y<1, 0≤m≤1, 0≤a≤1, 0≤n<9, 0≤z≤4, 0≤b≤3 and 0<n+z+b.
 
2. The compound semiconductor according to claim 1, wherein, in Chemical Formula 1, 0<x+y≤1.
 
3. The compound semiconductor according to claim 1, wherein, in Chemical Formula 1, 0<n+z+b≤9.
 
4. The compound semiconductor according to claim 1, wherein, in Chemical Formula 1, 0<x≤0.5.
 
5. The compound semiconductor according to claim 1, wherein, in Chemical Formula 1, 0<z≤2.
 
6. A preparation method of a compound semiconductor, comprising:

forming a mixture containing In and Co; and

thermally treating the mixture, thereby preparing the compound semiconductor defined in claim 1.


 
7. The preparation method of a compound semiconductor according to claim 6, wherein the mixture further includes at least one element selected from the group consisting of O, S, Se, Te and their oxides.
 
8. The preparation method of a compound semiconductor according to claim 6, wherein the mixture further includes at least one element selected from the group consisting of Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and their oxides.
 
9. The preparation method of a compound semiconductor according to claim 6, wherein the mixture further includes at least one element selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir, Pt and their oxides.
 
10. The preparation method of a compound semiconductor according to claim 6, wherein the mixture further includes Sb.
 
11. The preparation method of a compound semiconductor according to claim 6, wherein the mixture further includes at least one element selected from the group consisting of Si, Ga, Ge, Sn and their oxides.
 
12. The preparation method of a compound semiconductor according to claim 6, wherein the thermally treating step is performed at 400°C to 800°C.
 
13. The preparation method of a compound semiconductor according to claim 6, wherein the thermally treating step includes at least two thermal treatment stages.
 
14. A thermoelectric conversion device, which includes the compound semiconductor defined in any one of claims 1 to 5.
 
15. A solar cell, which includes the compound semiconductor defined in any one of claims 1 to 5.
 




Drawing














































REFERENCES CITED IN THE DESCRIPTION



This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

Patent documents cited in the description