(19)
(11)EP 2 762 272 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
06.12.2017 Bulletin 2017/49

(43)Date of publication A2:
06.08.2014 Bulletin 2014/32

(21)Application number: 14020009.8

(22)Date of filing:  28.01.2014
(51)International Patent Classification (IPC): 
B24B 9/06(2006.01)
B24B 21/06(2006.01)
B24B 21/00(2006.01)
(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30)Priority: 30.01.2013 JP 2013015937

(71)Applicant: EBARA CORPORATION
Ohta-ku, Tokyo (JP)

(72)Inventors:
  • Togawa, Tetsuji
    Tokyo (JP)
  • Yoshida, Atsushi
    Tokyo (JP)
  • Watanabe, Toshifumi
    Tokyo (JP)

(74)Representative: Klang, Alexander H. 
Wagner & Geyer Gewürzmühlstrasse 5
80538 München
80538 München (DE)

  


(54)Wafer polishing apparatus and method


(57) An apparatus and method of polishing a substrate (W) is described. The polishing includes: rotating a substrate (W); pressing a first polishing tool (2A) against an edge portion of the substrate (W) to polish the edge portion; and pressing a second polishing tool (2B) against the edge portion of the substrate (W) to polish the edge portion. The second polishing tool (2B) is located more inwardly than the first polishing tool (2A) with respect to a radial direction of the substrate (W). The first polishing tool (2A) has a polishing surface rougher than a polishing surface of the second polishing tool (2B).







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