(19)
(11)EP 2 927 947 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
06.05.2020 Bulletin 2020/19

(21)Application number: 13858965.0

(22)Date of filing:  14.11.2013
(51)Int. Cl.: 
H01L 21/687  (2006.01)
H01L 21/027  (2006.01)
G03F 7/20  (2006.01)
B05D 7/00  (2006.01)
(86)International application number:
PCT/JP2013/080791
(87)International publication number:
WO 2014/084060 (05.06.2014 Gazette  2014/23)

(54)

PLACEMENT MEMBER AND METHOD FOR MANUFACTURING SAME

PLATZIERUNGSELEMENT UND VERFAHREN ZUR HERSTELLUNG DAVON

ELÉMENT DE PLACEMENT ET PROCÉDÉ POUR FABRIQUER CELUI-CI


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 28.11.2012 JP 2012259425

(43)Date of publication of application:
07.10.2015 Bulletin 2015/41

(73)Proprietor: Kyocera Corporation
Kyoto-shi, Kyoto 612-8501 (JP)

(72)Inventor:
  • HORIUCHI, Masahiko
    Kyoto-shi Kyoto 612-8501 (JP)

(74)Representative: Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte 
Am Brauhaus 8
01099 Dresden
01099 Dresden (DE)


(56)References cited: : 
JP-A- H08 139 168
JP-A- 2001 028 333
JP-A- 2009 272 646
JP-A- 2012 119 378
JP-A- H11 163 103
JP-A- 2005 142 566
JP-A- 2010 166 085
US-A1- 2010 096 262
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description

    TECHNICAL FIELD



    [0001] The present invention relates to a vacuum chuck (below also referred to as placement member) on which an object such as a wafer and a glass substrate is placed when the object is subjected to treatment in each of steps of manufacturing a semiconductor integrated circuit and a liquid crystal display, and a method of manufacturing the placement member.

    BACKGROUND ART



    [0002] In a step of manufacturing a semiconductor integrated circuit or a liquid crystal display, an object such as a wafer used to manufacture the semiconductor integrated circuit or a glass substrate used to manufacture the liquid crystal display is placed on a placement member such as an exposure apparatus or an inspection apparatus, and is subjected to treatment.

    [0003] For example US 2009/0060688 discloses a vacuum chuck comprising pin-like protrusions and a surrounding ring-shaped protrusion, these protrusions being covered by a coating.

    [0004] As another example, JP 8-195428 A describes, as the placement member, a vacuum suction device provided with an annular seal section that surrounds a vacuum suction section to form a minute gap between the seal section and a sample.

    [0005] When the surface roughness of the top face of the seal section is large, irregularities on the top face of the seal section become large, generating sites largely separated from the sample on the top face of the seal section. For this reason, for example, in vacuum-sucking the sample, a leakage tends to occur in the seal section. As a result of the leakage, outside air is sucked into the vacuum suction section, decreasing the negative pressure of the vacuum suction section. This lowers the suction force for the sample.

    [0006] Therefore, it is required to provide a placement member having a seal section of reduced leakage.

    SUMMARY OF THE INVENTION



    [0007] The present invention meets the request to provide a placement member having a seal section of reduced leakage.

    [0008] A placement member according to one aspect of the present invention includes a base having a placement section on which an object is placed, and a coating film that coats at least a part of the placement section. The placement section has a bottom face, a plurality of projections protruding from the bottom face, and an annular protrusion that protrudes from the bottom face at the same height as the plurality of projections and surrounds the plurality of projections. The coating film has a first region that coats top faces of the projections, and a second region that coats a top face of the annular protrusion and has a smaller thickness than that of the first region.

    [0009] A placement member according to another aspect of the present invention includes a base having a placement section on which an object is placed, and a coating film that coats at least a part of the placement section. The placement section has a bottom face, a plurality of projections protruding from the bottom face, and an annular protrusion that protrudes from the bottom face at the same height as the plurality of projections and surrounds the plurality of projections. The coating film has a first region that coats top faces of the projections and allows a top face of the annular protrusion to be exposed.

    [0010] A method of manufacturing a placement member according to one aspect of the present invention includes: preparing a base including a placement section on which an object is placed, the placement section having a bottom face, a plurality of projections protruding from the bottom face, and an annular protrusion that surrounds the plurality of projections and protrudes from the bottom face at the same height as the plurality of projections; and forming a coating film having a first region that coats top faces of the projections, and a second region that coats a top face of the annular protrusion and has a smaller thickness than that of the first region on the placement section.

    [0011] According to one aspect of the present invention, the surface roughness of the top face of the seal section can be reduced to provide a placement member having a seal section with reduced leakage.

    [0012] According to the method of manufacturing a placement member from one aspect of the present invention, the seal section having a low surface roughness of the top face can be formed to provide a placement member having a seal section with reduced leakage.

    BRIEF DESCRIPTION OF THE DRAWINGS



    [0013] 

    Fig. 1 is a perspective view illustrating a placement member in accordance with an embodiment of the present invention.

    Fig. 2 is a perspective view illustrating the state where an object is placed on the placement member in Fig. 1.

    Fig. 3 is a sectional view illustrating the placement member in Fig. 1 taken along a cross section including an exhaust hole in the thickness direction.

    Fig. 4 is a sectional view illustrating the placement member in Fig. 1 taken along a cross section including an insertion hole in the thickness direction.

    Fig. 5 is a sectional view for describing a method of manufacturing the placement member in Fig. 1 taken in the thickness direction.

    Fig. 6 is a sectional view for describing the method of manufacturing the placement member in Fig. 1 taken in the thickness direction.

    Fig. 7 is a sectional view illustrating a placement member in accordance with another embodiment of the present invention taken in the thickness direction.

    Fig. 8 is a sectional view illustrating a placement member in accordance with another embodiment of the present invention taken in the thickness direction.


    EMBODIMENT FOR CARRYING OUT THE INVENTION



    [0014] A placement member in accordance with an embodiment of the present invention will be described below in detail with reference to Fig. 1 to Fig. 4.

    [0015] A placement member 1 illustrated in Fig. 1 and Fig. 2 is a member on which an object 2 such as a wafer or a glass substrate is placed in an apparatus such as an exposure apparatus and an inspection apparatus for use in a step of manufacturing a semiconductor integrated circuit or a liquid crystal display. The object 2 placed on the placement member 1 is subjected to various types of treatment in various apparatuses. For example, the exposure apparatus includes the placement member 1 and a light source. In the exposure apparatus, the light source irradiates the object 2 sucked onto the placement member 1 with light to expose the object 2, generating a wiring pattern.

    [0016] The placement member 1 in this embodiment is a vacuum chuck that vacuum-sucks the object 2. As illustrated in Fig. 3 and Fig. 4, the placement member 1 includes a base 4 having a placement section 3 on which the object 2 is placed, a coating film 5 that coats at least a part of the placement section 3, an exhaust hole 6 that penetrates the base 4 in the thickness direction and is connected to an exhaust means (not shown), and an insertion hole 7 that penetrates the base 4 in the thickness direction and into which a lift pin (not shown) is inserted.

    [0017] The base 4 of the placement member 1 is made of ceramics, resin, or metal. Due to low coefficient of thermal expansion, high abrasion resistance, and high stiffness, most preferably, the base 4 is made of ceramics. Various ceramic sintered bodies including an alumina sintered body, a silicon nitride sintered body, a cordierite sintered body, or a silicon carbide sintered body (SiC-based or Si-SiC-based) can be used as the ceramics. In terms of prevention of contamination of the wafer, most preferably, the silicon carbide sintered body is used as the ceramics. The base 4 in this embodiment is disc-like. For example, a thickness of the base 4 is within the range of 1 to 50 mm. For example, a width (diameter) of the base 4 is within the range of 25 to 3500 mm.

    [0018] As illustrated in Fig. 3 and Fig. 4, the placement section 3 of the base 4 has a bottom face 8, a plurality of projections 9 protruding from the bottom face 8, and an annular protrusion 10 that surrounds the plurality of projections 9. That is, the bottom face 8 is disposed between the projections 9 and the annular protrusion 10, the projections 9 are disposed inner from the annular protrusion 10, and the annular protrusion 10 is disposed on the outer edge of the placement section 3.

    [0019] The projections 9 each have a top face 11 and a side face 12, and are columnar, for example. For example, a height of each projection 9 is within the range of 3 to 1000 µm, and a width (diameter) of the projection 9 is within the range of 0.01 to 5 mm. The projections 9 each may be shaped like a polygonal pole such as a triangular pole or a square pole.

    [0020] The annular protrusion 10 has a top face 13 and a side face 14, and is annular, for example. The annular protrusion 10 protrudes from the bottom face 8 at the same height as the plurality of projections 9. For example, a width (distance from its outer circumference and its inner circumference) of the annular protrusion 10 is within the range of 0.01 to 5 mm. The width of the annular protrusion 10 may be the same as or different from the width of the projections 9. In this embodiment, the width of the annular protrusion 10 is larger than the width of the projection 9. A part of the annular protrusion 10 may bellow or protrude toward the inner side of the placement section 3 in a plan view. An error between the height of the plurality of projections 9 and the height of the annular protrusion 10 is within ±20%.

    [0021] The coating film 5 is formed of a ceramic film, a metal film, or a resin film. The ceramic film is made of a ceramic material such as silicon oxide, silicon nitride, titanium nitride, titanium carbide, alumina or DLC (Diamond-Like Carbon). The metal film is made of a metal such as aluminum, chromium, or gold. The resin film is made of a resin such as polyimide resin or para-xylene resin. When the coating film 5 is used in the step of manufacturing the semiconductor integrated circuit in the exposure apparatus, to prevent contamination of the wafer, an Si-based material such as silicon oxide and silicon nitride, a Ti-base material such as titanium nitride and titanium carbide, or C-based material such as DLC is desirably adopted. Most desirably, the coating film 5 is made of titanium nitride. Using titanium nitride can improve abrasion resistance to suppress the occurrence of particles. In addition, conductivity can be imparted to the coating film 5.

    [0022] The coating film 5 has a first region 15 that coats the top faces 11 of the projections 9 and a second region 16 that coats the top face 13 of the annular protrusion 10. The coating film 5 allows the side faces 12 of the projections 9 and the side face 14 of the annular protrusion 10 to be exposed. The projections 9 and the first region 15 constitute a support section 17 that supports the object 2, and the annular protrusion 10 and the second region 16 constitute a seal section 19 that seals a space 18 between the object 2 and the placement section 3.

    [0023] The placement and suction of the object 2 on the placement member 1 are performed as follows, for example. First, a top face of the lift pin inserted into the insertion hole 7 is moved above the placement section 3 and then, the object 2 is placed on the lift pin. Next, the top faces of the lift pin is moved below the placement section 3, and the object 2 is supported by a top face 20 of the support section 17. The object 2 is placed on the placement section 3 in this manner. At this time, the space 18 between the object 2 and the placement section 3 is sealed with the seal section 19. This prevents movement of fluid such as air between the space 18 and the outside. Next, air in the space 18 sealed with the seal section 19 is exhausted through the exhaust hole 6 by using the exhaust means. Then, the space 18 is put into the vacuum state, thereby vacuum-sucking the object 2 onto the placement section 3.

    [0024] A height of the seal section 19 is smaller than a height of the support section 17. A difference between the support section 17 and the seal section 19 in height is minute. A minute gap 22 is generated between the object 2 placed on the placement section 3 and a top face 21 of the seal section 19 depending on the difference in height. The minute gap 22 lets only an extremely small amount of fluid such as air through and thus, functions as a static seal to seal the space 18 between the object 2 and the placement section 3. Further, the minute gap 22 suppresses contact of the object 2 with the top face 21 of the seal section 19. This can prevent the flatness of the object 2 from lowering due to the contact, improving the treatment accuracy of the object 2.

    [0025] For example, the difference between the support section 17 and the seal section 19 in height, that is, the distance of the minute gap 22 in the vertical direction (Z direction) is within the range of 0.5 to 20 µm. The difference in height is desirably within the range of 1 to 3 µm. The difference in height of 1 µm or more can further suppress the contact of the object 2 with the seal section 19. The difference in height of 3 µm or less can further seal the space 18 between the object 2 and the placement section 3.

    [0026] When the difference between the support section 17 and the seal section 19 in height generates a difference between the projections 9 and the annular protrusion 10 in height, it is necessary to make the height of the annular protrusion 10 smaller than the height of the projections 9 by processing the top face 13 of the annular protrusion 10 by blasting or the like. Thus, the surface roughness of the top face 13 of the annular protrusion 10, in turn, the surface roughness of the top face 21 of the seal section 19 tends to increase.

    [0027] In the placement member 1 in this embodiment, a height of the plurality of projections 9 is equal to a height of the annular protrusion 10, and a thickness of the second region 16, which coats the top face 13 of the annular protrusion 10, is smaller than a thickness of the first region 15 of the coating film 5, which coats the top faces 11 of the protrusions 9. That is, the difference between the first region 15 and the second region 16 in thickness rather than the difference between the projections 9 and the annular protrusion 10 in height generates the difference between the support section 17 and the seal section 19 in height.

    [0028] Thus, it is not necessary to process the top face 13 of the annular protrusion 10 to make the height of the annular protrusion 10 smaller than the height of the projections 9. Accordingly, the surface roughness of the top face 13 of the annular protrusion 10 can be reduced to suppress leakage of fluid such as air from the seal section 19. This can realize the placement member 1 as a vacuum chuck having a good absorbability.

    [0029] The top face 21 of the seal section 19 is coated with the first region 15 of the coating film 5. Thus, since the first region 15 of the coating film 5 weakens the effect of irregularities on the top face 13 of the annular protrusion 10, as compared to the case where the top face 21 of the seal section 19 is formed of the top face 13 of the annular protrusion 10, the surface roughness of the top face 21 of the seal section 19 can be decreased. The surface roughness may be an arithmetic average roughness (Ra). For example, an arithmetic average roughness (Ra) of the top face 21 of the seal section 19 is within the range of 0. 003 to 0.02 µm. The arithmetic average roughness (Ra) is defined according to JISB0601:2001.

    [0030] In the placement member 1 in this embodiment, the coating film 5 includes a first film 23 that coats at least a part of the placement section 3 and a second film 24 that coats a part of the first film 23. The first region 15 includes the first film 23 that coats the top faces 11 of the protrusions 9 and the second film 24 that coats the first film 23. The second region 16 consists of the first film 23 that coats the top face 13 of the annular protrusion 10.

    [0031] Due to the presence/absence of the second film 24, a thickness of the second region 16 can be made smaller than a thickness of the first region 15. Thus, the thickness of the second film 24 can be adjusted to adjust the difference between the support section 17 and the seal section 19 in height with high accuracy, and the distance of the minute gap 22 in the vertical direction with high accuracy.

    [0032] A thickness of the first film 23 is desirably smaller than a thickness of the second film 24. By decreasing the thickness of the first region 15 that coats the top face 21 of the seal section 19, partial variation of the first region 15 in thickness can be reduced to make the first region 15 smoother. This can adjust the distance of the minute gap 22 with high accuracy. For example, the thickness of the first film 23 is within the range of 0.01 to 50 µm. The thickness of the second film 24 is equal to the distance of the minute gap 22 in the vertical direction.

    [0033] Materials for the first film 23 and the second film 24 are appropriately selected from among materials for the coating film 5. The first film 23 and the second film 24 may be made of the same material. In this case, the top face 21 of the seal section 19, which is coated with the first film 23, and the top face 20 of the support section 17, which is coated with the second film 24, may have the same property. For example, both of the first film 23 and the second film 24 may be made of titanium nitride.

    [0034] The first film 23 and the second film 24 may be made of different materials. In this case, the top face 21 of the seal section 19, which is coated with the first film 23, and the top face 20 of the support section 17, which is coated with the second film 24, may have different properties. For example, the first film 23 may be made of silicon oxide, and the second film 24 may be made of titanium nitride. As a result, the top face 21 of the seal section 19 may have water repellency and insulation property, and the top face 20 of the support section 17 may have conductivity.

    [0035] The first film 23 and the second film 24 each may be formed of one layer or a plurality of layers. In the multilayer case, the layers may be made of different materials.

    [0036] In the placement member 1 in this embodiment, the top face 13 of the annular protrusion 10 is a ground face which has been subjected to the grinding processing. Thus, the surface roughness of the top face 13 of the annular protrusion 10, in turn, the surface roughness of the top face 21 of the seal section 19 can be reduced. For example, an arithmetic average roughness (Ra) of the top face 13 of the annular protrusion 10 is within the range of 0.003 to 0.02 µm.

    [0037] The top faces 11 of the protrusions 9 are ground faces which have been subjected to the grinding processing. Thus, the surface roughness of the top faces 11 of the protrusions 9, in turn, the surface roughness of the top face 20 of the support section 17 can be reduced. An arithmetic average roughness (Ra) of the top faces 11 of the protrusions 9 is the same as an arithmetic average roughness (Ra) of the top face 13 of the annular protrusion 10. An error between the arithmetic average roughness (Ra) of the top face 13 of the annular protrusion 10 and the arithmetic average roughness (Ra) of the top faces 11 of the protrusions 9 is within ±30%.

    [0038] The bottom face 8 disposed between the plurality of projections 9 and the annular protrusion 10 is a ground face, a blasted face, or a laser machined face. A surface roughness of the bottom face 8 is larger than the surface roughness of the top faces 11 of the protrusions 9 and the surface roughness of the top face 13 of the annular protrusion 10 as ground faces. For example, an arithmetic average roughness (Ra) of the bottom face 8 is within the range of 0.3 to 6.3 µm.

    [0039] Using the case where the base 4 is made of ceramics, a method of manufacturing the placement member 1 will be described below in detail with reference to Fig. 5 and Fig. 6.

    [0040] 
    1. (1) As illustrated in Fig. 5(a), the base 4 is prepared. Specifically, the preparation is made as follows.
      First, pure water and an organic binder are added to ceramic powders and then, they are wet-blended in a ball mill to produce a slurry. Next, the slurry is granulated by spry drying. Next, the granulated ceramic powders are molded into a body by various molding methods, and the molded body is cut into a predetermined shape. Next, the molded body is sintered, for example, under the temperature of 1000 to 2300°C to produce a sintered body, and the sintered body is cut into a predetermined shape to form the placement section 3 having the bottom face 8, the projections 9, and the annular protrusion 10. The placement section 3 may be formed by blasting or laser machining after cutting. In the placement section 3, the projections 9 and the annular protrusion 10 have the same height. Next, the top faces 11 of the protrusions 9 and the top face 13 of the annular protrusion 10 of the sintered body are simultaneously ground to make the top faces 11 of the protrusions 9 and the top face 13 of the annular protrusion 10 into ground faces. Examples of the grinding include lapping and polishing. For example, lapping can be performed by using an abrasive made of any suitable material such as diamond or alumina, and a lapping machine made of any suitable material such as cast iron or tin.
      The base 4 can be manufactured as described above.
      After the height of the projections 9 is made larger than the height of the annular protrusion 10, it is difficult to grind the top face 13 of the annular protrusion 10. Especially when a part of the annular protrusion 10 bellows or protrudes toward the inner side of the placement section 3 in a plan view, it is more difficult to grind the top face 13.
      On the contrary, in this embodiment, because the height of the projections 9 is made equal to the height of the annular protrusion 10 and then, the top faces 11 of the protrusions 9 and the top face 13 of the annular protrusion 10 are simultaneously ground, the top face 13 of the annular protrusion 10 can be readily ground.
    2. (2) As illustrated in Fig. 5 (b) to Fig. 6(c), the coating film 5 is formed on the base 4 to produce the placement member 1. Specifically, the placement member 1 is produced as follows.


    [0041] First, as illustrated in Fig. 5(b), a first resist 25 made of photosetting resin or the like is formed in the placement section 3 of the base 4 by photolithography. The first resist 25 coats the bottom face 8, and allows the top faces 11 of the protrusions 9 and the top face 13 of the annular protrusion 10 to be exposed. Next, as illustrated in Fig. 5(c), the first film 23 that coats the top faces 11 of the protrusions 9 and the top face 13 of the annular protrusion 10 is formed by any suitable film formation method such as PVD, CVD, deposition, ion plating, or sputtering. Next, as illustrated in Fig. 5(d), the first resist 25 is removed from the placement section 3 on the base 4. Next, as illustrated in Fig. 6 (a), a second resist 26 made of photosetting resin or the like is formed in the placement section 3 of the base 4 by photolithography. The second resist 26 coats the first film 23 on the bottom face 8 and the top face 13 of the annular protrusion 10, and allows the first film 23 on the top faces 11 of the protrusions 9 to be exposed. Next, as illustrated in Fig. 6(b), the second film 24 that coats only the first film 23 on the top faces 11 of the protrusions 9, out of the top faces 11 of the protrusions 9 and the top face 13 of the annular protrusion 10, is formed by any suitable film formation method such as PVD, CVD, deposition, ion plating, or sputtering. Next, as illustrated in Fig. 6(c), the second resist 26 is removed from the placement section 3 on the base 4.

    [0042] In this manner, the coating film 5 can be formed on the base 4 to manufacture the placement member 1 in this embodiment as illustrated in Fig. 1 to Fig. 4.

    [0043] As a result, the surface roughness of the top face 21 of the seal section 19, height of which is smaller than the height of the support section 17, can be lowered to form the seal section 19 with reduced leakage. The height of the support section 17 and the seal section 19 as well as the distance of the minute gap 22 in the vertical direction can be adjusted with high accuracy.

    [0044] The present invention is not limited to the above embodiment, and various changes, modifications, and combinations may be made so as not to deviate from the subject matter of the present invention.

    [0045] Although the coating film 5 allows the side faces 12 of the projections 9 and the side face 14 of the annular protrusion 10 to be exposed in the above description, as illustrated in Fig. 7, the coating film 5 may include a third region 27 that coats the side face 14 of the annular protrusion 10, and a fourth region 28 that coats the side faces 12 of the projections 9. In this case, by appropriately selecting the material for the coating film 5, desired characteristics including insulation property and conductivity can be imparted to the side faces of the seal section 19 and the support section 17. For example, the third region 27 and the fourth region 28 are composed of the first film 23 and the second film 24. The coating film 5 can be formed by exposing the side faces 12 of the projections 9 and the side face 14 of the annular protrusion 10 from the first resist 25 and the second resist 26 in the step (2) in the embodiment.

    [0046] Although the coating film 5 has the first region 15 that coats the top faces 11 of the protrusions 9 and the second region 16 that coats the top face 13 of the annular protrusion 10, as illustrated in Fig. 8, the coating film 5 may have the first region 15 and allow the top face 13 of the annular protrusion 10 to be exposed. In this case, since the projections 9 and the annular protrusion 10 have the same height, due to the presence/absence of the coating film 5, the difference between the support section 17 and the seal section 19 in height is generated to form the minute gap 22. Moreover, since the projections 9 and the annular protrusion 10 have the same height, the top face 13 of the annular protrusion 10 can be formed without performing treatment for increasing the surface roughness, such as blasting, and thus, the surface roughness of the top face 21 of the seal section 19 can be reduced. The top face 13 of the annular protrusion 10 is desirably a ground face. The coating film 5 can be formed by coating the top faces 11 of the protrusions 9 with the first resist 25 in the step (2) in the embodiment. Although the coating film 5 in Fig. 8 is formed of the first film 23 and the second film 24, the coating film 5 may be formed of only the first film 23. In this case, since the coating film 5 is formed of one film, the coating film 5 can be readily formed, and peeling in the coating film 5 can be reduced.

    [0047] Although the first resist 25 and the second resist 26 are formed by photolithography to form the coating film 5 in the above description, a mask may be used in place of the first resist 25 and the second resist 26. A patterned metal plate (ex. stainless plate) or resin plate may be used as the mask.

    Reference Signs List



    [0048] 
    1:
    placement member
    2:
    object
    3:
    placement section
    4:
    base
    5:
    coating film
    6:
    exhaust hole
    7:
    insertion hole
    8:
    bottom face
    9:
    projection
    10:
    annular protrusion
    11
    top face of projection
    12:
    side face of projection
    13:
    top face of annular protrusion
    14:
    side face of annular protrusion
    15:
    first region of coating film
    16:
    second region of coating film
    17:
    support section
    18:
    space between object and placement section
    19:
    seal section
    20:
    top face of support section
    21
    top face of the seal section
    22:
    minute gap
    23:
    first film
    24:
    second film
    25:
    first resist
    26:
    second resist
    27:
    third region
    28:
    fourth region



    Claims

    1. A vacuum chuck (1) comprising:

    a base (4) including a placement section (3) on which an object (2) is placed, and a coating film (5) that coats at least a part of the placement section (3), wherein

    the placement section (3) has a bottom face (8), a plurality of projections (9) protruding from the bottom face (8), and an annular protrusion (10) that protrudes from the bottom face (8) at the same height as the plurality of projections (9) and surrounds the plurality of projections (9),

    characterized in that

    the coating film (5) has a first region (15) that coats top faces (11) of the projections (9), and a second region (16) that coats a top face (13) of the annular protrusion (10) and has a smaller thickness than that of the first region (15).


     
    2. The vacuum chuck (1) according to claim 1, wherein
    the coating film (5) includes a first film (23) that coats at least a part of the placement section (3), and a second film (24) that coats a part of the first film (23),
    the first region (15) includes the first film (23) that coats the top faces (11) of the projections (9), and the second film (24) that coats the first film (23), and
    the second region (16) is composed of the first film (23) that coats the top face (13) of the annular protrusion (10).
     
    3. The vacuum chuck (1) according to claim 2, wherein
    a thickness of the first film (23) is smaller than a thickness of the second film (24).
     
    4. The vacuum chuck (1) according to claim 1, wherein
    the coating film (5) coats a side face (14) of the annular protrusion (10), and further has a third region (27) having a larger thickness than that of the second region (16).
     
    5. The vacuum chuck (1) according to claim 1, wherein
    a difference between the first region (15) and the second region (16) in thickness is within the range of 1 to 3 µm.
     
    6. The vacuum chuck (1) according to claim 1, wherein
    the projections (9) and the first region (15) constitute a support section (17) that supports the object (2), and
    the annular protrusion (10) and the second region (16) constitutes a seal section (19) that seals a space (18) between the object (2) and the placement section (3).
     
    7. A vacuum chuck (1) comprising:

    a base (4) including a placement section (3) on which an object (2) is placed, and a coating film (5) that coats at least a part of the placement section (3), wherein

    the placement section (3) has a bottom face (8), a plurality of projections (9) protruding from the bottom face (8), and an annular protrusion (10) that protrudes from the bottom face (8) at the same height as the plurality of projections (9) and surrounds the plurality of projections (9),

    characterized in that

    the coating film (5) has a first region (15) that coats top faces (11) of the projections (9), and allows a top face (13) of the annular protrusion (10) to be exposed.


     
    8. A method of manufacturing a vacuum chuck (1), the method comprising:

    preparing a base (4) including a placement section (3) on which an object (2) is placed, the placement section (3) having a bottom face (8), a plurality of projections (9) protruding from the bottom face (8), and an annular protrusion (10) that surrounds the plurality of projections (9) and protrudes from the bottom face (8) at the same height as the plurality of projections (9); the method being characterized by

    forming a coating film (5) having a first region (15) that coats top faces (11) of the projections (9), and a second region (16) that coats a top face (13) of the annular protrusion (10) and has a smaller thickness than that of the first region (15) on the placement section (3).


     
    9. The method of manufacturing the vacuum chuck (1) according to claim 8, wherein
    the forming the coating film (5) on the placement section (3) includes
    forming a first film (23) that coats the top faces (11) of the projections (9) and the top face (13) of the annular protrusion (10) and then, forming a second film (24) that coats only the first film (23) coating the top faces (11) of the projections (9) out of the projections (9) and the annular protrusion (10), thereby forming the coating film (5) having the first region (15) that includes the first film (23) and the second film (24), and the second region (16) being composed of the first film (23).
     
    10. The method of manufacturing the vacuum chuck (1) according to claim 8, wherein
    the preparing the base (4) includes
    simultaneously grinding the top faces (11) of the plurality of projections (9) and the top face (13) of the annular protrusion (10), thereby making the height of the plurality of projections (9) equal to the height of the annular protrusion (10) .
     


    Ansprüche

    1. Vakuumspannvorrichtung (1), aufweisend:

    eine Basis (4), die einen Platzierungsabschnitt (3), auf dem ein Objekt (2) platziert wird, und einen Beschichtungsfilm (5) aufweist, der mindestens einen Teil des Platzierungsabschnitts (3) beschichtet, wobei

    der Platzierungsabschnitt (3) eine untere Fläche (8), eine Mehrzahl von Vorsprüngen (9), die von der unteren Fläche (8) hervorstehen, und einen ringförmigen Vorsprung (10) aufweist, der von der unteren Fläche (8) auf der gleichen Höhe wie die Mehrzahl von Vorsprüngen (9) hervorsteht und die Mehrzahl von Vorsprüngen (9) umgibt,

    dadurch gekennzeichnet, dass,

    der Beschichtungsfilm (5) einen ersten Bereich (15), der obere Flächen (11) der Vorsprünge (9) beschichtet, und einen zweiten Bereich (16) aufweist, der eine obere Fläche (13) des ringförmigen Vorsprungs (10) beschichtet und eine geringere Dicke als die des ersten Bereichs (15) hat.


     
    2. Vakuumspannvorrichtung (1) gemäß Anspruch 1, wobei
    der Beschichtungsfilm (5) einen ersten Film (23), der mindestens einen Teil des Platzierungsabschnitts (3) beschichtet, und einen zweiten Film (24), der einen Teil des ersten Films (23) beschichtet, aufweist,
    der erste Bereich (15) den ersten Film (23), der die oberen Flächen (11) der Vorsprünge (9) beschichtet, und den zweiten Film (24), der den ersten Film (23) beschichtet, aufweist, und
    der zweite Bereich (16) aus dem ersten Bereich (23), der die obere Fläche (13) des ringförmigen Vorsprungs (10) beschichtet, zusammengesetzt ist.
     
    3. Vakuumspannvorrichtung (1) gemäß Anspruch 2, wobei
    eine Dicke des ersten Films (23) kleiner als eine Dicke des zweiten Films (24) ist.
     
    4. Vakuumspannvorrichtung (1) gemäß Anspruch 1, wobei
    der Beschichtungsfilm (5) eine Seitenfläche (14) des ringförmigen Vorsprungs (10) beschichtet und ferner einen dritten Bereich (27) mit einer größeren Dicke als die des zweiten Bereichs (16) aufweist.
     
    5. Vakuumspannvorrichtung (1) gemäß Anspruch 1, wobei
    ein Dickenunterschied zwischen dem ersten Bereich (15) und dem zweiten Bereich (16) im Bereich von 1 bis 3 µm liegt.
     
    6. Vakuumspannvorrichtung (1) gemäß Anspruch 1, wobei
    die Vorsprünge (9) und der erste Bereich (15) einen Stützabschnitt (17) ausbilden, der das Objekt (2) abstützt, und
    der ringförmige Vorsprung (10) und der zweite Bereich (16) einen Dichtungsabschnitt (19) ausbilden, der einen Raum (18) zwischen dem Objekt (2) und dem Platzierungsabschnitt (3) abdichtet.
     
    7. Vakuumspannvorrichtung (1), aufweisend:

    eine Basis (4), die einen Platzierungsabschnitt (3), auf dem ein Objekt (2) platziert wird, und einen Beschichtungsfilm (5) aufweist, der mindestens einen Teil des Platzierungsabschnitts (3) beschichtet, wobei

    der Platzierungsabschnitt (3) eine untere Fläche (8), eine Mehrzahl von Vorsprüngen (9), die von der unteren Fläche (8) aus hervorstehen, und einen ringförmigen Vorsprung (10) aufweist, der von der unteren Fläche (8) aus auf der gleichen Höhe wie die Mehrzahl von Vorsprüngen (9) hervorsteht und die Mehrzahl von Vorsprüngen (9) umgibt, dadurch gekennzeichnet, dass

    der Beschichtungsfilm (5) einen ersten Bereich (15) aufweist, der obere Flächen (11) der Vorsprünge (9) beschichtet, und ein Freilegen einer oberen Fläche (13) des ringförmigen Vorsprungs (10) ermöglicht.


     
    8. Verfahren zum Herstellen einer Vakuumspannvorrichtung (1), wobei das Verfahren aufweist:
    Bereitstellen einer Basis (4), die einen Platzierungsabschnitt (3) aufweist, auf dem ein Objekt (2) platziert wird, wobei der Platzierungsabschnitt (3) eine untere Fläche (8), eine Mehrzahl von Vorsprüngen (9), die von der unteren Fläche (8) aus hervorstehen, und einen ringförmigen Vorsprung (10) aufweist, der die Mehrzahl von Vorsprüngen (9) umgibt und von der unteren Fläche (8) aus auf der gleichen Höhe wie die Mehrzahl von Vorsprüngen (9) hervorsteht, wobei das Verfahren gekennzeichnet ist durch:
    Ausbilden eines Beschichtungsfilms (5), der einen ersten Bereich (15), der obere Flächen (11) der Vorsprünge (9) beschichtet, und einen zweiten Bereich (16) aufweist, der eine obere Fläche (13) des ringförmigen Vorsprungs (10) beschichtet und eine geringere Dicke als die des ersten Bereichs (15) auf dem Platzierungsabschnitt (3) aufweist.
     
    9. Verfahren zum Herstellen der Vakuumspannvorrichtung (1) gemäß Anspruch 8, wobei
    das Ausbilden des Beschichtungsfilms (5) auf dem Platzierungsabschnitt (3) aufweist:
    Ausbilden eines ersten Films (23), der die oberen Flächen (11) der Vorsprünge (9) und die obere Fläche (13) des ringförmigen Vorsprungs (10) beschichtet, und dann Ausbilden eines zweiten Films (24), der nur den ersten Film (23) beschichtet, der die oberen Flächen (11) der Vorsprünge (9) aus den Vorsprüngen (9) und dem ringförmigen Vorsprung (10) beschichtet, wodurch der Beschichtungsfilm (5) ausgebildet wird, der den ersten Bereich (15), der den ersten Film (23) und den zweiten Film (24) aufweist, und den zweiten Bereich (16) aufweist, der aus dem ersten Film (23) zusammengesetzt ist.
     
    10. Verfahren zum Herstellen der Vakuumspannvorrichtung (1) gemäß Anspruch 8, wobei
    das Bereitstellen der Basis (4) aufweist:
    gleichzeitiges Schleifen der oberen Flächen (11) der Mehrzahl von Vorsprüngen (9) und der oberen Fläche (13) des ringförmigen Vorsprungs (10), wodurch die Höhe der Mehrzahl von Vorsprüngen (9) gleich der Höhe des ringförmigen Vorsprungs (10) gemacht wird.
     


    Revendications

    1. Dispositif de serrage à vide (1), comprenant :

    une base (4) comprenant une partie de placement (3) sur laquelle un objet (2) est placé et un film de revêtement (5) recouvrant au moins une partie de la partie de placement (3), où

    la partie de placement (3) présente une surface inférieure (8), une pluralité de saillies (9) faisant saillie de la surface inférieure (8), et une saillie annulaire (10) faisant saillie de la surface inférieure (8) au même niveau que la pluralité de saillies (9) et entourant la pluralité de saillies (9),

    caractérisé en ce que

    le film de revêtement (5) comprend une première région (15) revêtant des surfaces supérieures (11) des saillies (9) et une deuxième région (16) revêtant une surface supérieure (13) de la saillie annulaire (10) et présentant une épaisseur inférieure à celle de la première région (15).


     
    2. Dispositif de serrage à vide (1) selon la revendication 1, dans lequel
    le film de revêtement (5) comprend un premier film (23) recouvrant au moins une partie de la partie de placement (3) et un deuxième film (24) revêtant une partie du premier film (23),
    la première région (15) comprend le premier film (23) recouvrant les surfaces supérieures (11) des saillies (9) et le deuxième film (24) recouvrant le premier film (23), et
    la deuxième région (16) est composée de la première partie (23) qui recouvre la surface supérieure (13) de la saillie annulaire (10).
     
    3. Dispositif de serrage à vide (1) selon la revendication 2, dans lequel
    une épaisseur du premier film (23) est inférieure à une épaisseur du deuxième film (24).
     
    4. Dispositif de serrage à vide (1) selon la revendication 1, dans lequel
    le film de revêtement (5) recouvre une surface latérale (14) de la saillie annulaire (10) et comprend en outre une troisième partie (27) présentant une épaisseur supérieure à celle de la deuxième région (16).
     
    5. Dispositif de serrage à vide (1) selon la revendication 1, dans lequel
    une différence d'épaisseur entre la première région (15) et la deuxième région (16) est de l'ordre de 1 à 3 µm.
     
    6. Dispositif de serrage à vide (1) selon la revendication 1, dans lequel
    les saillies (9) et la première région (15) constituent une partie de support (17) qui supporte l'objet (2), et
    la saillie annulaire (10) et la deuxième région (16) constituent une partie de scellement (19) qui scelle un espace (18) entre l'objet (2) et la partie de placement (3).
     
    7. Dispositif de serrage à vide (1), comprenant :

    une base (4) comprenant une partie de placement (3) sur laquelle un objet (2) est placé et un film de revêtement (5) recouvrant au moins une partie de la partie de placement (3), où

    la partie de placement (3) présente une surface inférieure (8), une pluralité de saillies (9) faisant saillie de la surface inférieure (8), et une saillie annulaire (10) faisant saillie de la surface inférieure (8) au même niveau que la pluralité de saillies (9) et entourant la pluralité de saillies (9),

    caractérisé en ce que

    le film de revêtement (5) présente une première région (15) recouvrant les surfaces supérieures (11) des saillies (9) et permet d'exposer une surface supérieure (13) de la saillie annulaire (10).


     
    8. Procédé de fabrication d'un dispositif de serrage à vide (1), le procédé comprenant :

    la mise à disposition d'une base (4) comprenant une partie de placement (3) sur laquelle un objet (2) est placé, la partie de placement (3) présentant une surface inférieure (8), une pluralité de saillies (9) faisant saillie de la surface inférieure (8), et une saillie annulaire (10) entourant la pluralité de saillies (9) et faisant saillie de la surface inférieure (8) au même niveau que la pluralité de saillies (9), le procédé étant caractérisé par

    la formation d'un film de revêtement (5) présentant une première région (15) recouvrant des surfaces supérieures (11) des saillies (9) et une deuxième région (16) recouvrant une surface supérieure (13) de la saillie annulaire (10) et présentant une épaisseur inférieure à celle de la première région (15) sur la partie de placement (3).


     
    9. Procédé de fabrication du dispositif de serrage à vide (1) selon la revendication 8, dans lequel
    la formation du film de revêtement (5) sur la partie de placement (3) comprend :
    la formation d'un premier film (23) recouvrant les surfaces supérieures (11) des saillies (9) et la surface supérieure (13) de la saillie annulaire (10), et puis la formation d'un deuxième film (24) recouvrant uniquement le premier film (23), recouvrant les surfaces supérieures (11) des saillies (9) parmi les saillies (9) et de la saillie annulaire (10), formant ainsi le film de revêtement (5) comprenant la première région (15) comprenant le premier film (23) et le deuxième film (24) et la deuxième région (16) composée du premier film (23).
     
    10. Procédé de fabrication du dispositif de serrage à vide (1) selon la revendication 8, dans lequel
    la mise à disposition de la base (4) comprend :
    meulage simultané des surfaces supérieures (11) de la pluralité de saillies (9) et la surface supérieure (13) de la saillie annulaire (10), rendant ainsi la hauteur de la pluralité de saillies (9) égale à la hauteur de la saillie annulaire (10).
     




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    REFERENCES CITED IN THE DESCRIPTION



    This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

    Patent documents cited in the description