(19)
(11)EP 3 089 000 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
03.02.2021 Bulletin 2021/05

(21)Application number: 14875332.0

(22)Date of filing:  23.12.2014
(51)International Patent Classification (IPC): 
H05K 1/18(2006.01)
G06F 3/044(2006.01)
H05K 1/02(2006.01)
H05K 1/14(2006.01)
(86)International application number:
PCT/CN2014/094619
(87)International publication number:
WO 2015/096690 (02.07.2015 Gazette  2015/26)

(54)

FPC OF CAPACITIVE TOUCH SCREEN AND METHOD FOR MOUNTING FPC

FLEXIBLE LEITERPLATTE VON KAPAZITIVEM BERÜHRUNGSBILDSCHIRM UND VERFAHREN ZUR ANORDNUNG VON FLEXIBLER LEITERPLATTE

FPC D'ÉCRAN TACTILE CAPACITIF ET PROCÉDÉ DE MONTAGE DE FPC


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 24.12.2013 CN 201310721854

(43)Date of publication of application:
02.11.2016 Bulletin 2016/44

(73)Proprietor: Kunshan Visionox Display Co., Ltd.
Kunshan Jiangsu 215300 (CN)

(72)Inventors:
  • LIU, Weiwei
    KunShan Jiangsu 215300 (CN)
  • HONG, Yao
    KunShan Jiangsu 215300 (CN)

(74)Representative: Thoma, Michael 
Lorenz Seidler Gossel Rechtsanwälte Patentanwälte Partnerschaft mbB
Widenmayerstraße 23 80538 München
Widenmayerstraße 23 80538 München (DE)


(56)References cited: : 
EP-A1- 2 254 396
CN-A- 102 946 690
CN-U- 202 425 189
CN-Y- 201 234 403
US-A1- 2010 220 496
US-A1- 2012 146 919
EP-A2- 0 735 405
CN-A- 102 968 212
CN-U- 202 617 497
JP-A- H0 643 472
US-A1- 2010 294 556
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description

    FIELD OF THE INVENTION



    [0001] The invention relates to flexible circuit board design field, especially relates to an FPC of a capacitive touchscreen and a method for mounting the FPC.

    BACKGROUND ART



    [0002] The structure of a capacitive touchscreen in prior art shown in Fig.1 mainly comprises a capacitive touchscreen panel 1' and a flexible circuit board 2', the flexible circuit board 2' is covered by a cover board 3' . Wherein, the capacitive touchscreen panel (sensor) comprises an insulating transparent substrate, a sensing circuit layer and a driving circuit layer. The insulating transparent substrate is made of glass or plastic film; the sensing circuit layer is formed by a transparent conductive film having a sensing circuit or glass; the driving circuit layer is formed by transparent conductive film having driving circuit or glass, and the driving circuit layer and the sensing circuit layer are respectively arranged on both sides of the insulating transparent substrate. The flexible circuit board, called soft board or FPC (Flexible Printed Circuit) for short, is a superexcellent flexible printed circuit board produced by polyimide or polyester film as a substrate, which has high reliability and has characteristics of free bending, strong bending performance, free folding, free winding, anti-slitting, high wiring density, light weight, thin thickness, etc.

    [0003] The structure of an FPC of the capacitive touchscreen in prior art is shown in Fig.2, in which the flexible circuit board 2' comprises a sensing circuit 5' and a driving circuit 6' which respectively match a sensing circuit layer and a driving circuit layer of a capacitive touchscreen panel 1', the sensing circuit 5' is arranged perpendicular to the driving circuit 6', the sensing circuit 5' and driving circuit 6' have several contacts 9' for matching the sensing circuit layer and the driving circuit layer for corresponding connection. The sensing circuit 5' and the driving circuit 6' have an IC driving chip 4' disposed therebetween, which has a communication end 8' for communicating with communication devices such as mobile phones. The sensing circuit 5' and the driving circuit 6' are respectively laminated with the sensing circuit layer and the driving circuit layer of a capacitive touchscreen panel 1' and connected therewith, and allow the corresponding contacts to connect with each other. While such an FPC is being cut on the substrate 7', as shown in Fig.3, since the sensing circuit 5' is perpendicular to the driving circuit 6', this arrangement may occupy a large space, which is not in favor of making a compact arrangement and may waste substrate, so as to cause a high cost.

    [0004] Document US 2010/0220496 A1 discloses a liquid crystal display device having an LCD panel including a first substrate with pixels, a second substrate with RGB color pixels and a liquid crystal layer interposed between said first and second substrates. Printed circuit board is connected to the first substrate through a plurality of tape carrier packages on which a plurality of driving chips are mounted.

    [0005] Furthermore, document EP 2 254 396 A1 discloses a flexible printed circuit board that can be bent for various angles and mounted with light-emitting diode circuits and other circuitery for providing halos for a display.

    [0006] In addition, document US 2012/146919 A1 discloses a flexible circuit board for a capacitive touch screen comprising a plurality of sensing electrodes and an IC driving chip.

    SUMMARY OF THE INVENTION



    [0007] Thus, the present invention is to solve the problem that the FPC of the capacitive touchscreen of prior art may occupy a large space, which is not in favor of making a compact arrangement, so as to waste substrate, lower the utilization rate of a substrate and cause a high cost, thereby providing an FPC of a capacitive touchscreen that is able to be arranged on the substrate in a compact manner, achieve a high utilization rate of a substrate and save the cost, and also provide a method of mounting the FPC,

    [0008] To solve the above mentioned problem, the present invention provides A FPC of a capacitive touchscreen, comprises a sensing circuit and a driving circuit, which respectively match with a sensing circuit layer and a driving circuit layer of a capacitive touchscreen panel and have several contacts for matching the sensing circuit layer and the driving circuit layer for corresponding connection; an IC driving chip, disposed between the sensing circuit and the driving circuit; wherein, the sensing circuit and the driving circuit are disposed in parallel or on the same line; the sensing circuit or the driving circuit is provided with a bending area, and the sensing circuit or the driving circuit is able to be turned towards the driving circuit or the sensing circuit, so as to allow the sensing circuit to match the sensing circuit layer and allow the driving circuit to match the driving circuit layer, a bending portion is located in the bending area after being turned over.

    [0009] Preferably, side lines of the sensing circuit and the driving circuit, where the contacts are provided, are located on the same line.

    [0010] Preferably, the bending area is arranged on the driving circuit and close to the IC driving chip.

    [0011] Preferably, the contacts are not located in the bending area.

    [0012] Preferably, the side lines of the sensing circuit and driving circuit, where no contact is provided, are located on different lines.

    [0013] Preferably, after the sensing circuit or driving circuit are turned over, the sensing circuit is perpendicular to the driving circuit.

    [0014] The present invention also discloses a method for mounting the FPC mentioned above to a capacitive touchscreen, includes

    Step1: laminating the sensing circuit or driving circuit of the FPC together with the corresponding sensing circuit layer or driving circuit layer of a capacitive touchscreen panel of a capacitive touchscreen;

    Step2: turning the driving circuit or sensing circuit which is not laminated in the direction perpendicular to the sensing circuit or driving circuit, and a bending portion generated by turning is located in the bending area;

    Step 3: laminating the turned driving circuit or the sensing circuit together with the corresponding driving circuit layer or sensing circuit layer of capacitive touchscreen panel together, so as to complete assembling of the FPC.



    [0015] Preferably, comprises a step of flattening the sensing circuit and the driving circuit, prior to the step 1.

    [0016] Preferably, side lines of the sensing circuit and the driving circuit, where the contacts are provided, are located on the same line; and side lines of the sensing circuit and driving circuit, where no contact is provided, are located on different lines.

    [0017] Preferably, the bending area is arranged on the driving circuit and close to the IC driving chip.

    [0018] Compared with prior art, the technical proposal of the invention has advantage of that:
    1. (1) According to the FPC of the capacitive touchscreen of the invention, the sensing circuit and the driving circuit are disposed in parallel or located on the same line, the sensing circuit or the driving circuit can be turned towards the driving circuit or the sensing circuit, so that the sensing circuit matches the sensing circuit layer and the driving circuit matches the driving circuit layer. Since the FPC circuit board has characteristics of free bending, folding, wrapping, anti-slitting etc., after lamination, the FPC can be freely arranged according to the internal space of the product, which is like a conducting wire. This will not affect the normal use of the product; meanwhile, the FPC with such arrangement can save space, so as to achieve a compact arrangement on the substrate while being cut, so that the utilization rate of a substrate is greatly increased by approximately 160%, and the cost is greatly reduced.
    2. (2) According to the FPC of a capacitive touchscreen of the invention, the side lines of the sensing circuit and the driving circuit having the contacts are located on the same line, so as to make the structure of the product regular and easy to cut, meet the requirements of the capacitive touchscreen, and ensure reliable contact among the contacts.
    3. (3) According to the FPC of a capacitive touchscreen of the invention, the bending area is arranged on the driving circuit and close to the IC driving chip, the FPC with such arrangement is easy to bend, and the bending FPC can meet the requirements of the product, the product quality is ensured.
    4. (4) According to the FPC of a capacitive touchscreen of the invention, the contacts are not provided in the bending area; on one hand, since the bending area is not necessary to contact the sensing circuit layer and driving circuit layer of the capacitive touchscreen panel, no contact is arranged, which may avoid of wasting of material and save the cost; on the other hand, the bending area without contacts arranged therein is in favor of bending operation.
    5. (5) According to the FPC of a capacitive touchscreen of the invention, simply turning the driving circuit or sensing circuit in the direction perpendicular to the sensing circuit or driving circuit can let the FPC meet the requirements of the capacitive touchscreen products, this turning is easy to operate and the cost is reduced.

    BRIEF DESCRIPTION OF THE DRAWINGS



    [0019] To be easier to clearly understand, the specific embodiments of the present invention will be further described in details with figures, wherein

    Fig.1 is a schematic diagram of the capacitive touchscreen of prior art;

    Fig.2 is a structural schematic diagram of the FPC of a capacitive touchscreen in prior art;

    Fig.3 is a schematic diagram showing the arrangement of the FPC of a capacitive touchscreen on the substrate of prior art;

    Fig.4 is a structural schematic diagram of the FPC of a capacitive touchscreen of the invention;

    Fig.5 is a structural schematic diagram of the bending FPC of a capacitive touchscreen of the invention;

    Fig.6 is a schematic diagram showing the arrangement of the FPC of a capacitive touchscreen on the substrate of the invention.



    [0020] Numeral reference in figures is as follows:
    1'- capacitive touchscreen, 2, 2'- FPC (flexible circuit board), 3, 3'- cover board, 4, 4' - IC driving chip, 5, 5' - sensing circuit, 6, 6' - driving circuit, 7- substrate , 8 - communication end, 9, 9' - contacts, 10- bending area, 11- bending portion.

    DETAILED DESCRIPTION



    [0021] A preferable embodiment of the FPC of a capacitive touchscreen of the invention is shown in Fig.4, FPC (Flexible Printed Circuit), i.e. flexible circuit board, is called soft board for short.

    [0022] The FPC 2 comprises a sensing circuit 5 and a driving circuit 6 which respectively matches with a sensing circuit layer and a driving circuit layer of a capacitive touchscreen panel and have several contacts 9 for matching the sensing circuit layer and the driving circuit layer for corresponding connection; an IC driving chip 4 disposed between the sensing circuit 5 and the driving circuit 6, which has a communication end 8 for communicating with communication devices such as mobile phones.

    [0023] The sensing circuit 5 and the driving circuit 6 are disposed in parallel or on the same line. The sensing circuit 5 or the driving circuit 6 is provided with a bending area 10 arranged in a position near the IC driving chip 4 on the driving circuit 6. The contacts 9 are not in the bending area 10. The sensing circuit 5 or the driving circuit 6 is able to be turned towards the driving circuit 6 or the sensing circuit 5, so as to allow the sensing circuit 5 to match the sensing circuit layer and allow the driving circuit 6 to match the driving circuit layer, a bending portion 11 is located in the bending area 10 after being turned over, as shown in Fig.5. In the present embodiment, the bending sensing circuit 5 arranged in Y direction is perpendicular to the driving circuit 6 arranged in X direction.

    [0024] In the present embodiment, side lines of the sensing circuit 5 and driving circuit 6 where all contacts 9 are provided, are located on the same line, and side lines where no contacts 9 are provided are located on different lines. As shown in Fig.6, when being cut, the FPC of capacitive touchscreen of the invention occupies little space and is arranged compactly on the substrate 7, so that the utilization rate of the substrate is greatly increased and the cost is reduced.

    [0025] The method for mounting the FPC to a capacitive touchscreen includes

    Step 1: laminating the sensing circuit 5 or driving circuit 6 of the FPC together with the corresponding sensing circuit layer or driving circuit layer of the capacitive touchscreen panel of the capacitive touchscreen, wherein, the driving circuit 6 and the sending circuit layer of the capacitive touchscreen are preferably firstly laminated together;

    step 2: turning over the driving circuit 6 or sensing circuit 5 which is not laminated in the direction perpendicular to the sensing circuit 5 or driving circuit 6, and a bending portion 11 is located in the bending area 10 after being turned over; wherein, in the present embodiment, preferably, the sensing circuit 5 and the driving circuit 6 is flat enough, the sensing circuit 5 which has not been laminated is turned towards the direction perpendicular to the driving circuit 6 and the bending portion 11 is located in the bending area 10 after being turned over.

    Step 3: laminating the turned driving circuit 6 or the sensing circuit 5 together with the corresponding driving circuit layer or sensing circuit layer of capacitive touchscreen panel, so as to complete assembling of the FPC, wherein, in the present embodiment, preferably, the turned sensing circuit 5 and the corresponding driving circuit layer of capacitive touchscreen panel are laminated together, so as to complete assembling of the FPC.



    [0026] As alternative embodiments, the method further comprises a step of flattening the sensing circuit 5 and the driving circuit 6 prior to the step 1, so as to try to locate the sensing circuit 5 and the driving circuit 6 on the same surface.

    [0027] In other embodiments, the location of the sensing circuit 5 and the driving circuit 6 is determined by the sample figure of the sensor panel design of different products, in other words, after being bent, the sensing circuit 5 also can be arranged in X direction as required, and the driving circuit 6 also can be arranged in Y direction.

    [0028] In other embodiments, according to the actual requirements of the products, bending area 10 also can be arranged on the sensing circuit 5 and close to the IC driving chip 4, as long as the actual requirements of the products can be met.

    [0029] Obviously, the above-described embodiments are only examples for clear description, and are not restriction of the mode of enforcement. For ordinary skill men in the field, other changes can be made in different forms on the basis of the above description. There is no need to explain all embodiments here. And the apparent changes or variations still drop the protection scope of the invention.


    Claims

    1. A FPC of a capacitive touchscreen, comprising

    a sensing circuit (5) and a driving circuit (6), which respectively matches with a sensing circuit layer and a driving circuit layer of a capacitive touchscreen panel and have several contacts (9) for matching the sensing circuit layer and the driving circuit layer for corresponding connection;

    an IC driving chip (4), disposed between the sensing circuit (5) and the driving circuit (6);

    wherein, the sensing circuit (5) and the driving circuit (6) are disposed in parallel or on the same line; the sensing circuit (5) or the driving circuit (6) is provided with a bending area (10), and the sensing circuit (5) or the driving circuit (6) is able to be turned towards the driving circuit (6) or the sensing circuit (5), so as to allow the sensing circuit (5) to match the sensing circuit layer and allow the driving circuit (6) to match the driving circuit layer, a bending portion (11) is located in the bending area (10) after being turned over.


     
    2. The FPC of a capacitive touchscreen according to claim 1, wherein, side lines of the sensing circuit (5) and the driving circuit (6), where the contacts (9) are provided, are located on the same line.
     
    3. The FPC of a capacitive touchscreen according to claim 2, wherein, the bending area (10) is arranged on the driving circuit (6) and close to the IC driving chip (4).
     
    4. The FPC of a capacitive touchscreen according to claim 3, wherein, the contacts (9) are not located in the bending area (10).
     
    5. The FPC of a capacitive touchscreen according to claim 4, wherein, the side lines of the sensing circuit (5) and driving circuit (6), where no contact (9) is provided, are located on different lines.
     
    6. The FPC of a capacitive touchscreen according to any of claim 1-5, wherein, after the sensing circuit (5) or driving circuit (6) are turned over, the sensing circuit (5) is perpendicular to the driving circuit (6).
     
    7. A method for mounting the FPC of any of claims 1-6 to a capacitive touchscreen, including the following steps

    Step1: laminating the sensing circuit (5) or driving circuit (6) of the FPC together with the corresponding sensing circuit layer or driving circuit layer of a capacitive touchscreen panel of a capacitive touchscreen;

    Step2: turning the driving circuit (6) or sensing circuit (5) which is not laminated in the direction perpendicular to the sensing circuit (5) or driving circuit (6), and a bending portion (11) generated by turning is located in the bending area (10);

    Step 3: laminating the turned driving circuit (6) or the sensing circuit (5) together with the corresponding driving circuit layer or sensing circuit layer of capacitive touchscreen panel together, so as to complete assembling of the FPC.


     
    8. The method for mounting according to claim 7, comprising a step of flattening the sensing circuit (5) and the driving circuit (6), prior to the step 1.
     
    9. The method for mounting according to claim 8, wherein, side lines of the sensing circuit (5) and the driving circuit (6), where the contacts (9) are provided, are located on the same line; and side lines of the sensing circuit (5) and driving circuit (6), where no contact (9) is provided, are located on different lines.
     
    10. The method for mounting according to claim 9, wherein, the bending area (10) is arranged on the driving circuit (6) and close to the IC driving chip (4).
     


    Ansprüche

    1. Flexible Leiterplatte eines kapazitiven Touchscreens, aufweisend:

    eine Abtastschaltung (5) und eine Treiberschaltung (6), die auf eine Abtastschaltungsschicht bzw. eine Treiberschaltungsschicht eines kapazitiven Touchscreen-Panels abgestimmt sind und mehrere Kontakte (9) zum Abstimmen auf die Abtastschaltungsschicht und die Treiberschaltungsschicht zum entsprechenden Verbinden haben;

    einen IC-Treiber-Chip (4), der zwischen der Abtastschaltung (5) und der Treiberschaltung (6) angeordnet ist;

    wobei die Abtastschaltung (5) und die Treiberschaltung (6) parallel oder auf der gleichen Leitung angeordnet sind; die Abtastschaltung (5) oder die Treiberschaltung (6) mit einem Biegebereich (10) versehen ist und die Abtastschaltung (5) oder die Treiberschaltung (6) in der Lage ist, zu der Treiberschaltung (6) oder der Abtastschaltung (5) gedreht zu werden, um zu ermöglichen, dass die Abtastschaltung (5) auf die Abtastschaltungsschicht abgestimmt ist, und zu ermöglichen, dass die Treiberschaltung (6) auf die Treiberschaltungsschicht abgestimmt ist, wobei sich nach dem Drehen ein Biegeabschnitt (11) im Biegebereich (10) befindet.


     
    2. Flexible Leiterplatte eines kapazitiven Touchscreens nach Anspruch 1, wobei sich Seitenleitungen der Abtastschaltung (5) und der Treiberschaltung (6), wo die Kontakte (9) bereitgestellt sind, auf der gleichen Leitung befinden.
     
    3. Flexible Leiterplatte eines kapazitiven Touchscreens nach Anspruch 2, wobei der Biegebereich (10) auf der Treiberschaltung (6) und nahe dem IC-Treiber-Chip (4) angeordnet ist.
     
    4. Flexible Leiterplatte eines kapazitiven Touchscreens nach Anspruch 3, wobei sich die Kontakte (9) nicht im Biegebereich (10) befinden.
     
    5. Flexible Leiterplatte eines kapazitiven Touchscreens nach Anspruch 4, wobei sich die Seitenleitungen der Abtastschaltung (5) und der Treiberschaltung (6), wo kein Kontakt (9) bereitgestellt ist, auf verschiedenen Leitungen befinden.
     
    6. Flexible Leiterplatte eines kapazitiven Touchscreens nach einem der Ansprüche 1-5, wobei nach dem Umdrehen der Abtastschaltung (5) oder der Treiberschaltung (6) die Abtastschaltung (5) senkrecht zur Treiberschaltung (6) ist.
     
    7. Verfahren zum Montieren der flexiblen Leiterplatte nach einem der Ansprüche 1-6 an einen kapazitiven Touchscreen, das die folgenden Schritte aufweist:

    Schritt 1: Laminieren der Abtastschaltung (5) oder der Treiberschaltung (6) der flexiblen Leiterplatte zusammen mit der entsprechenden Abtastschaltungsschicht oder Treiberschaltungsschicht eines kapazitiven Touchscreen-Panels eines kapazitiven Touchscreens;

    Schritt 2: Drehen der Treiberschaltung (6) oder der Abtastschaltung (5), die nicht laminiert ist, in die Richtung senkrecht zu der Abtastschaltung (5) oder der Treiberschaltung (6) und ein durch Drehen erzeugter Biegeabschnitt (11) befindet sich im Biegebereich (10);

    Schritt 3: Laminieren der gedrehten Treiberschaltung (6) oder der Abtastschaltung (5) zusammen mit der entsprechenden Treiberschaltungsschicht oder der Abtastschaltungsschicht des kapazitiven Touchscreen-Panels zusammen, um das Zusammenbauen der flexiblen Leiterplatte fertigzustellen.


     
    8. Verfahren zum Montieren nach Anspruch 7, das einen Schritt zum Abflachen der Abtastschaltung (5) und der Treiberschaltung (6) vor dem Schritt 1 aufweist.
     
    9. Verfahren zum Montieren nach Anspruch 8, wobei sich Seitenleitungen der Abtastschaltung (5) und der Treiberschaltung (6), wo die Kontakte (9) bereitgestellt sind, auf der gleichen Leitung befinden; und sich Seitenleitungen der Abtastschaltung (5) und der Treiberschaltung (6), wo kein Kontakt (9) bereitgestellt ist, auf verschiedenen Leitungen befinden.
     
    10. Verfahren zum Montieren nach Anspruch 9, wobei der Biegebereich (10) auf der Treiberschaltung (6) und nahe dem IC-Treiber-Chip (4) angeordnet ist.
     


    Revendications

    1. FPC d'un écran tactile capacitif, comprenant
    un circuit de détection (5) et un circuit de commande (6), qui correspondent respectivement à une couche de circuit de détection et à une couche de circuit de commande d'un panneau d'écran tactile capacitif et présentent plusieurs contacts (9) destinés à correspondre à la couche de circuit de détection et à la couche de circuit de commande pour une connexion correspondante ;
    une puce de commande de CI (4), disposée entre le circuit de détection (5) et le circuit de commande (6) ;
    dans lequel le circuit de détection (5) et le circuit de commande (6) sont disposés en parallèle ou sur la même ligne ; le circuit de détection (5) ou le circuit de commande (6) est doté d'une zone de pliage (10), et le circuit de détection (5) ou le circuit de commande (6) peut être tourné en direction du circuit de commande (6) ou du circuit de détection (5), de manière à permettre au circuit de détection (5) de correspondre à la couche de circuit de détection et à permettre au circuit de commande (6) de correspondre à la couche de circuit de commande, une partie de pliage (11) est située dans la zone de pliage (10) après avoir été retournée.
     
    2. FPC d'un écran tactile capacitif selon la revendication 1, dans lequel des lignes latérales du circuit de détection (5) et du circuit de commande (6), où les contacts (9) sont fournis, sont situées sur la même ligne.
     
    3. FPC d'un écran tactile capacitif selon la revendication 2, dans lequel la zone de pliage (10) est agencée sur le circuit de commande (6) et près de la puce de commande de CI (4).
     
    4. FPC d'un écran tactile capacitif selon la revendication 3, dans lequel les contacts (9) ne sont pas situés dans la zone de pliage (10).
     
    5. FPC d'un écran tactile capacitif selon la revendication 4, dans lequel les lignes latérales du circuit de détection (5) et du circuit de commande (6), où aucun contact (9) n'est fourni, sont situées sur différentes lignes.
     
    6. FPC d'un écran tactile capacitif selon l'une quelconque des revendications 1-5, dans lequel, une fois que le circuit de détection (5) ou le circuit de commande (6) est retourné, le circuit de détection (5) est perpendiculaire au circuit de commande (6).
     
    7. Procédé de montage du FPC selon l'une quelconque des revendications 1-6 sur un écran tactile capacitif incluant les étapes suivantes :

    Étape 1 : stratification du circuit de détection (5) ou circuit de commande (6) du FPC conjointement avec la couche de circuit de détection ou couche de circuit de commande correspondante d'un panneau d'écran tactile capacitif d'un écran tactile capacitif ;

    Étape 2 : rotation du circuit de commande (6) ou circuit de détection (5) qui n'est pas stratifié dans la direction perpendiculaire au circuit de détection (5) ou circuit de commande (6), et une partie de pliage (11) générée par rotation est située dans la zone de pliage (10) ;

    Étape 3 : stratification du circuit de commande (6) ou circuit de détection (5) tourné conjointement avec la couche de circuit de commande ou couche de circuit de détection correspondante du panneau d'écran tactile capacitif ensemble, de manière à réaliser un assemblage du FPC.


     
    8. Procédé de montage selon la revendication 7, comprenant une étape d'aplatissement du circuit de détection (5) et du circuit de commande (6), avant l'étape 1.
     
    9. Procédé de montage selon la revendication 8, dans lequel des lignes latérales du circuit de détection (5) et du circuit de commande (6), où les contacts (9) sont fournis, sont situées sur la même ligne ; et des lignes latérales du circuit de détection (5) et du circuit de commande (6), où aucun contact (9) n'est fourni, sont situées sur des lignes différentes.
     
    10. Procédé de montage selon la revendication 9, dans lequel la zone de pliage (10) est agencée sur le circuit de commande (6) et près de la puce de commande de CI (4).
     




    Drawing




















    Cited references

    REFERENCES CITED IN THE DESCRIPTION



    This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

    Patent documents cited in the description