(19)
(11)EP 3 273 160 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
23.10.2019 Bulletin 2019/43

(21)Application number: 16861334.7

(22)Date of filing:  20.07.2016
(51)International Patent Classification (IPC): 
F21V 29/503(2015.01)
F21K 9/237(2016.01)
F21V 29/87(2015.01)
F21Y 115/10(2016.01)
F21K 9/235(2016.01)
F21V 29/83(2015.01)
F21V 29/89(2015.01)
(86)International application number:
PCT/CN2016/090579
(87)International publication number:
WO 2017/076064 (11.05.2017 Gazette  2017/19)

(54)

HEAT-DISSIPATION LAMP CUP

WÄRMEABLEITENDER LAMPENBECHER

COUPELLE DE LAMPE À DISSIPATION DE CHALEUR


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 05.11.2015 CN 201510744137

(43)Date of publication of application:
24.01.2018 Bulletin 2018/04

(73)Proprietor: Leedarson Lighting Co., Ltd.
Zhangzhou, Fujian 363999 (CN)

(72)Inventors:
  • ZENG, Maojin
    Xiamen Fujian 361010 (CN)
  • CAO, Liangliang
    Xiamen Fujian 361010 (CN)
  • CHEN, Xiaobo
    Xiamen Fujian 361010 (CN)
  • DONG, Yongzhe
    Xiamen Fujian 361010 (CN)
  • BAO, Yongjun
    Xiamen Fujian 361010 (CN)
  • CHEN, Jinzhui
    Xiamen Fujian 361010 (CN)
  • LIN, Yunnan
    Xiamen Fujian 361010 (CN)

(74)Representative: Office Freylinger 
P.O. Box 48 234, Route d'Arlon,
8001 Strassen
8001 Strassen (LU)


(56)References cited: : 
EP-A1- 2 783 153
CN-A- 102 588 778
CN-A- 105 276 550
CN-U- 203 147 408
CN-U- 204 403 870
CN-Y- 201 420 964
US-A1- 2009 129 102
US-A1- 2013 294 093
WO-A1-2013/183198
CN-A- 104 989 983
CN-U- 202 494 081
CN-U- 203 500 908
CN-U- 205 102 086
JP-A- 2006 313 731
US-A1- 2012 044 680
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description

    Technical Field



    [0001] The present invention relates to the LED lighting field, and particularly to a heat-dissipation lamp cup.

    Background Art



    [0002] At present, LED lights are applied more and more widely. However, considering the overheating phenomena generated during operation of a light emitting diode, a heat-dissipation device needs to be combined to assist in dissipating heat. The LED light source emits a large amount of heat during its operation, and the greater the power is, the more the generated heat is. If the whole heat-dissipation device is made from plastic which has a small thermal conductivity coefficient and a slow heat transferring speed, the speed and efficiency of heat transferring will be affected, and the temperature of the body of the heat-dissipation device rises, which also directly affects the normal operation of the LED light, in particular, the LED is caused to have an over high temperature, which makes the LED liable to failure and affects the service safety of the light.

    [0003] EP 2 783 153 B1 discloses a cooling body for a semiconductor lighting device.

    Disclosure of the Invention



    [0004] In view of this, it is necessary to provide a heat-dissipation lamp cup which enables high-efficiency heat-dissipation.

    [0005] The present invention provides a heat-dissipation lamp cup as claimed in claim 1.

    [0006] Different from the prior art, the heat-dissipation lamp cup is provided with the heat transfer layer, the heat transfer wall in thermal communication with the heat transfer layer, as well as the insulation layer disposed outside of the heat transfer layer and the heat transfer wall. In this way, the heat generated by the light source board can be rapidly transmitted to the insulation layer. Moreover, a connect area between the heat transfer layer and the insulation layer can be effectively increased by providing the heat transfer wall, so that transfer efficiency of the heat transmitted from the light source board to the insulation layer is enhanced, which significantly increases the dissipation efficiency of the heat-dissipation lamp cup and extends the service life of the LED light, with respect to the conventional lamp cup fully made from plastic.

    Brief Description of Drawings



    [0007] 

    Fig. 1 is an exploded view of a heat-dissipation lamp cup provided by a first embodiment of the present invention.

    Fig. 2 is a cross-sectional view of the heat-dissipation lamp cup shown in Fig. 1.


    Detailed Description of Embodiments



    [0008] The present invention will be further described below in conjunction with the attached drawings and particular embodiments.

    [0009] Fig. 1 is an exploded view of a heat-dissipation lamp cup provided by a first embodiment of the present invention. The heat-dissipation lamp cup includes a light source board 10, a heat transfer layer 20 and an insulation layer 30. The insulation layer 30 is disposed on a periphery of the heat transfer layer 20.

    [0010] Referring to Fig. 1 and Fig. 2, the heat transfer layer 20 includes a heat conductive portion 21 and a heat transfer portion 22. A thermal communication is established between the heat conductive portion 21 and the light source board 10, and the heat conductive portion 21 is disposed to be inclined relative to the heat transfer portion 22. The heat transfer portion 22 is disposed on a bottom of the heat conductive portion 21 and is of a hollow cylinder-shaped structure. An LED light source is provided on a top of the light source board 10, and a thermal communication is established between the bottom of the light source board 10 and the heat conductive portion 21.

    [0011] Referring to Fig. 1 to Fig. 2, the heat-dissipation lamp cup further includes a heat transfer wall 40, and the heat transfer wall 40 is of an annular structure. A thermal communication is established between one end of the heat transfer wall 40 and the heat conductive portion 21, and a thermal communication is established between the other end of the heat transfer wall 40 and the heat transfer portion 22. The insulation layer 30 is disposed outside of the heat transfer layer 20 and the heat transfer wall 40. Moreover, the heat transfer layer 20 and the heat transfer wall 40 are both made from a metal sheet. An opening 41 is formed between the heat transfer wall 40 and the heat transfer layer 20. The insulation layer 30, disposed outside of the heat transfer layer 20 and the heat transfer wall 40, extends into the opening 41, so that the insulation layer 30 is filled between the heat transfer layer 20 and the heat transfer wall 40. Specifically, the opening 41 is provided in the heat transfer wall 40. Moreover, the insulation layer 30 is made from heat conductive plastic. In the embodiment, the insulation layer 30 is disposed, by an injection molding process or an extrusion process, outside of the heat transfer layer 20 and the heat transfer wall 40.

    [0012] When the LED light source operates, first, the heat produced by the LED light source on the light source board 10 is transmitted to the heat conductive portion 21 of the heat transfer layer 20; then, a part of the heat is rapidly transmitted to the heat transfer wall 40 via the heat conductive portion 21, and a part of the heat is transmitted to the heat transfer wall 40 after passing through the heat transfer portion 22; subsequently, the heat is transmitted to the insulation layer 30 disposed outside of the heat transfer layer 20 and the heat transfer wall 40, which increases the transferring speed of the heat in the insulation layer 30; finally, the heat may be transferred to external space via the insulation layer 30.

    [0013] In conclusion, the heat-dissipation lamp cup is provided with the heat transfer layer 20, the heat transfer wall 40 in thermal communication with the heat transfer layer 20, as well as the insulation layer 30 disposed outside of the heat transfer layer 20 and the heat transfer wall 40. In this way, the heat generated by the light source board 10 can be rapidly transmitted to the insulation layer 30. Moreover, a connect area between the heat transfer layer 20 and the insulation layer 30 can be effectively increased by providing the heat transfer wall 40, so that transfer efficiency of the heat transmitted from the light source board 10 to the insulation layer 30 is enhanced, which significantly increases the dissipation efficiency of the heat-dissipation lamp cup and extends the service life of the LED light, with respect to the conventional lamp cup fully made from plastic.

    [0014] The foregoing just gives preferable embodiments of the present invention, rather than limiting the present invention. Equivalent embodiments, modified based on the technical contents described above without departing from the technical scope of the present invention, could be adopted by a person skilled in the art. Any modifications, equivalent substations and improvements, made within the principle of the present invention, shall be covered by the scope of protection of the present invention as defined by the appended claims.

    Reference signs:



    [0015] 
    10
    light source board
    20
    heat transfer layer
    30
    insulation layer
    40
    heat transfer wall
    21
    heat conductive portion
    22
    heat transfer portion
    41
    opening



    Claims

    1. A heat-dissipation lamp cup, comprising a light source board (10), a heat transfer layer (20) and an insulation layer (30) made from heat conductive plastic, the insulation layer (30) being disposed on a periphery of the heat transfer layer (20), the heat transfer layer (20) comprises a heat conductive portion (21) and a heat transfer portion (22), a thermal communication is established between the heat conductive portion (21) and the light source board (10), and the heat conductive portion (21) is disposed to be inclined relative to the heat transfer portion (22); wherein the heat-dissipation lamp cup further comprises a heat transfer wall (40), a thermal communication is established between one end of the heat transfer wall (40) and the heat conductive portion (21), and a thermal communication is established between the other end of the heat transfer wall (40) and the heat transfer portion (22), and the insulation layer (30) is disposed outside of the heat transfer layer (20) and heat transfer wall (40), characterized in that an opening (41) is provided in the heat transfer wall (40), and the insulation layer (30), disposed outside of the heat transfer layer (20) and the heat transfer wall (40), extends into the opening (41).
     
    2. The heat-dissipation lamp cup according to claim 1, characterized in that the insulation layer (30) is disposed, by an injection molding process or an extrusion process, outside of the heat transfer layer (20) and the heat transfer wall (40).
     
    3. The heat-dissipation lamp cup according to claim 1 or 2, characterized in that the heat transfer layer (20) and the heat transfer wall (40) are both made from a metal sheet.
     
    4. The heat-dissipation lamp cup according to any one of claims 1 to 3, characterized in that the heat transfer portion (22) is disposed on a bottom of the heat conductive portion (21) and is of a hollow cylinder-shaped structure, and the heat transfer wall (40) is of an annular structure.
     
    5. The heat-dissipation lamp cup according to any one of claims 1 to 4, characterized in that an LED light source is provided on a top of the light source board (10), and a thermal communication is established between a bottom of the light source board (10) and the heat conductive portion (21).
     


    Ansprüche

    1. Ein wärmeableitender Lampenbecher, aufweisend eine Lichtquellenplatte (10), eine Wärmeübertragungsschicht (20) und eine Isolierschicht (30), die aus wärmeleitfähigem Kunststoff besteht, wobei die Isolierschicht (30) an einem Umfang der Wärmeübertragungsschicht (20) angebracht ist, die Wärmeübertragungsschicht (20) einen wärmeleitfähigen Abschnitt (21) und einen Wärmeübertragungsabschnitt (22) aufweist, eine thermische Verbindung zwischen dem wärmeleitfähigen Abschnitt (21) und der Lichtquellenplatte (10) gebildet ist, und der wärmeleitfähige Abschnitt (21) so angeordnet ist, dass er in Bezug zum Wärmeübertragungsabschnitt (22) geneigt ist; wobei
    der wärmeableitende Lampenbecher ferner eine Wärmeübertragungswand (40) aufweist, eine thermische Verbindung zwischen dem einen Ende der Wärmeübertragungswand (40) und dem wärmeleitfähigen Abschnitt (21) gebildet ist, und eine thermische Verbindung zwischen dem anderen Ende der Wärmeübertragungswand (40) und dem Wärmeübertragungsabschnitt (22) gebildet ist, und die Isolierschicht (30) außerhalb der Wärmeübertragungsschicht (20) und der Wärmeübertragungswand (40) angeordnet ist, dadurch gekennzeichnet, dass eine Öffnung (41) in der Wärmeübertragungswand (40) vorgesehen ist, und die außerhalb der Wärmeübertragungsschicht (20) und der Wärmeübertragungswand (40) angeordnete Isolierschicht (30) sich in die Öffnung (41) erstreckt.
     
    2. Wärmeableitender Lampenbecher gemäß Anspruch 1, dadurch gekennzeichnet, dass die Isolierschicht (30) mittels eines Spritzgussverfahrens oder eines Extrusionsverfahrens außerhalb der Wärmeübertragungsschicht (20) und der Wärmeübertragungswand (40) angeordnet ist.
     
    3. Wärmeableitender Lampenbecher gemäß Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Wärmeübertragungsschicht (20) und die Wärmeübertragungswand (40) beide aus einem Metallblech hergestellt sind.
     
    4. Wärmeableitender Lampenbecher gemäß einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass der Wärmeübertragungsabschnitt (22) an einem Boden des wärmeleitfähigen Abschnitts (21) angeordnet ist und aus einer hohlen zylinderförmigen Struktur besteht, und die Wärmeübertragungswand (40) aus einer ringförmigen Struktur besteht.
     
    5. Wärmeableitender Lampenbecher gemäß einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass eine LED-Lichtquelle an einer Oberseite der Lichtquellenplatte (10) vorgesehen ist, und eine thermische Verbindung zwischen einem Boden der Lichtquellenplatte (10) und dem wärmeleitfähigen Abschnitt (21) gebildet ist.
     


    Revendications

    1. Une coupelle de lampe à dissipation thermique, comprenant une carte de sources lumineuses (10), une couche de transfert thermique (20) et une couche d'isolation (30) composée à partir d'un plastique conducteur thermique, la couche d'isolation (30) étant disposée sur une périphérie de la couche de transfert thermique (20), la couche de transfert thermique (20) comprend une partie conductrice thermique (21) et une partie de transfert thermique (22), une communication thermique est établie entre la partie conductrice thermique (21) et la carte de sources lumineuses (10), et la partie conductrice thermique (21) est disposée de façon à être inclinée par rapport à la partie de transfert thermique (22),
    dans laquelle la coupelle de lampe à dissipation thermique comprend en outre une paroi de transfert thermique (40), une communication thermique est établie entre une extrémité de la paroi de transfert thermique (40) et la partie conductrice thermique (21), et une communication thermique est établie entre l'autre extrémité de la paroi de transfert thermique (40) et la partie de transfert thermique (22), et la couche d'isolation (30) est disposée à l'extérieur de la couche de transfert thermique (20) et de la paroi de transfert thermique (40), caractérisée en ce que une ouverture (41) est placée dans la paroi de transfert thermique (40), et la couche d'isolation (30), disposée à l'extérieur de la couche de transfert thermique (20) et de la paroi de transfert thermique (40), s'étend dans l'ouverture (41).
     
    2. La coupelle de lampe à dissipation thermique selon la revendication 1, caractérisée en ce que la couche d'isolation (30) est disposée, par un processus de moulage par injection ou un processus d'extrusion, à l'extérieur de la couche de transfert thermique (20) et de la paroi de transfert thermique (40).
     
    3. La coupelle de lampe à dissipation thermique selon la revendication 1 ou 2, caractérisée en ce que la couche de transfert thermique (20) et la paroi de transfert thermique (40) sont toutes les deux fabriquées à partir d'une feuille métallique.
     
    4. La coupelle de lampe à dissipation thermique selon l'une quelconque des revendications 1 à 3, caractérisée en ce que la partie de transfert thermique (22) est disposée sur une partie inférieure de la partie conductrice thermique (21) et est d'une structure creuse en forme de cylindre, et la paroi de transfert thermique (40) est d'une structure annulaire.
     
    5. La coupelle de lampe à dissipation thermique selon l'une quelconque des revendications 1 à 4, caractérisée en ce qu'une source lumineuse LED est placée sur une partie supérieure de la carte de sources lumineuses (10), et une communication thermique est établie entre une partie inférieure de la carte de sources lumineuses (10) et la partie conductrice thermique (21).
     




    Drawing











    Cited references

    REFERENCES CITED IN THE DESCRIPTION



    This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

    Patent documents cited in the description