(19)
(11)EP 3 396 931 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
17.06.2020 Bulletin 2020/25

(21)Application number: 17747712.2

(22)Date of filing:  01.02.2017
(51)International Patent Classification (IPC): 
H04M 1/02(2006.01)
G06F 1/16(2006.01)
H05K 5/04(2006.01)
H04M 1/18(2006.01)
(86)International application number:
PCT/KR2017/001068
(87)International publication number:
WO 2017/135667 (10.08.2017 Gazette  2017/32)

(54)

ELECTRONIC DEVICE INCLUDING METAL HOUSING

ELEKTRONISCHE VORRICHTUNG MIT METALLGEHÄUSE

DISPOSITIF ÉLECTRONIQUE COMPRENANT UN BOÎTIER MÉTALLIQUE


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 04.02.2016 KR 20160013899

(43)Date of publication of application:
31.10.2018 Bulletin 2018/44

(73)Proprietor: Samsung Electronics Co., Ltd.
Suwon-si, Gyeonggi-do 16677 (KR)

(72)Inventors:
  • HWANG, Yongwook
    Suwon-si Gyeonggi-do (KR)
  • NOH, Daeyoung
    Suwon-si Gyeonggi-do (KR)
  • BAEK, Seungchang
    Suwon-si Gyeonggi-do (KR)
  • SON, Hyeongsam
    Suwon-si-si Gyeonggi-do (KR)
  • YANG, Soonwoong
    Suwon-si Gyeonggi-do (KR)
  • CHOI, Byounghee
    Suwon-si Gyeonggi-do (KR)
  • HWANG, Changyoun
    Suwon-si Gyeonggi-do (KR)
  • YOO, Minwoo
    Suwon-si Gyeonggi-do (KR)

(74)Representative: HGF Limited 
Saviour House 9 St. Saviourgate
York YO1 8NQ
York YO1 8NQ (GB)


(56)References cited: : 
EP-A2- 2 755 367
KR-B1- 100 761 087
KR-B1- 101 443 565
US-A1- 2013 155 627
US-A1- 2015 155 614
JP-A- 2014 187 526
KR-B1- 101 443 563
KR-B1- 101 571 288
US-A1- 2015 043 141
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description

    [Technical Field]



    [0001] Various embodiments of the present invention relate to a metal housing and a method for providing the metal housing.

    [Background Art]



    [0002] According to the recent development of digital technologies, various electronic devices enabling mobile communication and personal information processing, such as a mobile terminal, PDA (personal digital assistant), electronic organizer, smartphone, and tablet PC (personal computer), are being introduced into the market. Such electronic devices do not remain in their own traditional areas and a mobile convergence step has been reached by each of them merging into the areas of other terminals. Typically, an electronic device can provide functions of voice communication and video communication, message transmission functions of SMS (short message service) and MMS (multimedia message service), email function, electronic organizer function, camera function, broadcasting play function, video play function, music play function, internet function, messenger function, and SNS (social networking service) function. As described above, the trend of electronic devices is one of expanding functions, and it is also of improving an aesthetic impression by reducing thickness and increasing a display size.

    [0003] US 2015/043141 A1 relates to a mobile device comprising a plate; the plate being adapted to accommodate a printed circuit board; a ring bonded to the plate; a seal disposed between the ring and the plate, the plate and ring and seal forming a mid-plate structure; wherein the seal comprises a platform; and a housing unit bonded to the platform.

    [0004] EP2755367 A2 relates to an electronic device including a main frame, an opening portion formed in the main frame, a recess portion formed along a frame of the opening portion lower than a surface of the main frame, and a plate having frames seated on the recess portion, wherein at least one of the frames of the plate is formed of a curved portion that is curved inwardly. Accordingly, it is possible to absorb an external impact and prevent deformation just by a simple structure change of the plate.

    [0005] US 2013/155627 A1 relates to electronic devices with support frames and mechanically-bonded plastic and methods for forming such electronic devices. A representative electronic device includes: a housing that incorporates: a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the chassis having an opening extending there through; a plastic part mechanically bonded to the metal of the chassis, the plastic part spanning the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing.

    [0006] US 2015/155614 A1 relates to a mobile terminal including a metal frame including a base portion and an edge portion formed along the outer edge of the base portion, first and second cases bonded to the front and back sides of the metal frame so as to expose the edge portion to the outside, first and second waterproof layers formed between the cases and the metal frame, conductive members that operate a radiator for antennas, together with the edge portion, and are formed on one side of the second case, and feeding portions for feeding the conductive members, the feeding portions being disposed in an enclosed space formed by the waterproof layers.

    [0007] KR 101 571 288 B1 relates to a metal case for a mobile terminal. More specifically, a method for manufacturing a metal case for a mobile terminal is presented, which can allegedly enhance the productivity and processability regarding the production of the mobile terminal case made of metal. According to KR 101 571 288, the method for manufacturing a metal case for a mobile terminal having a metal frame on the outer rim thereof, includes: a frame forming step of forming a hollow frame with metal; a bracket forming step of forming a plate-shaped bracket made of a metal material; an injection-bonding step of arranging the bracket on the inside of the frame to fix and couple the bracket and the frame with an injection-molded article; and a post-processing step of processing the surface of the frame. The frame forms the rim of the mobile terminal, and the bracket supports inner components of the mobile terminal.

    [0008] KR 101 443 565 B1 relates to a frame structure of a mobile device applying a metal frame and, more particularly, to a frame structure of a mobile device applying a frame which is made of metal on the rear and lateral sides of a mobile phone. For this, provided is the frame structure of the mobile device applying the metal frame which includes a main frame which mounts a circuit board and a display device and is made of synthetic resin materials, a lateral frame which is combined with the lateral side of the main frame and is made of the metal, and a rear frame which is closely attached to the lower end of the lateral frame, is combined by including the rear and lateral lower sides of the main frame, and is made of the metal.

    [Disclosure of Invention]


    [Technical Problem]



    [0009] As the thickness of the electronic device becomes slimmer and the screen size becomes greater, a rigid case is required. A housing of the electronic device can be provided by using a metal in order to secure the rigidity of the electronic device and improve an aesthetic impression of an exterior.

    [0010] In case of providing a housing of an electronic device by using a metal, manufacturing costs of the electronic device increase because expensive processing equipment must be used and a user may experience electric shock problems because the housing is configured with a metal.

    [0011] An object of an electronic device and a method for providing a metal housing according to various embodiments of the present invention is to integrate the metal housing and a bracket supporting a display.

    [Solution to Problem]



    [0012] The invention is set out in the appended claims.

    [0013] The description relating to figures 3a to 3d, 4a to 4c, 5a to 5c and 6a to 6b concerns embodiments of the invention. References to an embodiment at other passages of the description are to be understood as references to illustrative examples for understanding the invention.

    [Advantageous Effects of Invention]



    [0014] An electronic device including a metal housing and a method for providing the metal housing according to various embodiments of the present invention can save manufacturing costs of the electronic device by integrating a bracket supporting the metal housing and a display, and it can protect a user from an electric shock by separating electrically the metal housing and the bracket.

    [Brief Description of Drawings]



    [0015] 

    Figures 1a to 1g illustrate an electronic device according to various embodiments of the present invention.

    Figure 2 is an exploded perspective view illustrating an electronic device according to various embodiments of the present invention.

    Figures 3a to 3d illustrate a metal housing of an electronic device according to various embodiments of the present invention.

    Figures 4a to 4b are cross-sectional views illustrating a metal housing cut along the direction A-A' of Figure 3a according to various embodiments of the present invention.

    Figure 4c is an exploded view illustrating a partial area B in the cross-sectional view of the metal housing according to various embodiments of the present invention.

    Figures 5a to 5c illustrate structures of a bonding member extruded in a metal housing according to various embodiments of the present invention.

    Figures 6a to 6c illustrate structures of a bonding member extruded in a metal housing according to various embodiments of the present invention.

    Figure 7 illustrates a metal housing of an electronic device according to various embodiments of the present invention.

    Figure 8 is a flowchart illustrating a manufacturing process of a metal housing according to various embodiments of the present invention.

    Figure 9 illustrates a manufacturing process of a metal housing according to various embodiments of the present invention.

    Figure 10 illustrates a manufacturing process of a metal housing according to various embodiments of the present invention.


    [Mode for the Invention]



    [0016] Hereinafter, embodiments of the present invention are described in detail with reference to the accompanying drawings. The same reference numbers are used throughout the accompanying drawings to refer to the same or like parts.

    [0017] The expressions "having", "may have","comprising", and "may comprise" used in the present disclosure indicate the presence of a corresponding characteristic (e.g., numerical value, function, operation, or element) and do not limit any additional at least one function, operation, or element.

    [0018] In the present disclosure, expressions "A or B", "at least one of A and/or B", and "one or more A and/or B" may include one of the listed words and their combinations. For example, "A or B", "at least one of A and B", and "at least one A or B" may mean all the cases of (1) including at least one A, (2) including at least one B, and (3) including at least one A and at least one B.

    [0019] The expressions "first" and "second" used in the present disclosure may represent various elements of the present invention, but they do not limit corresponding elements. For example, the expressions do not limit an order and/or importance of corresponding elements. The expressions may be used for distinguishing one element from another element. For example, both a first user device and a second user device are user devices and represent different user devices. For example, a first element may be referred to as a second element without deviating from the scope of the present invention and, similarly, a second element may be referred to as a first element.

    [0020] When it is described that an element (e.g., first element) is opreratively or communicatively "connected" with/to another element (e.g., scond element), the element may be directly connected to the other element or connected through a further other element (e.g., third element). However, when it is described that an element (e.g., first element) is "directly coupled" to another element (e.g., second element), no element (e.g., third element) may exist between the element and the other element.

    [0021] An expression "configured to" used in the present disclosure may be interchangeably used, according to the situation, with "suitable for", "having the capacity to", "designed to", "adapted to", "made to", or "capable of'. The term "configure to" may not always mean "specially designed to" in hardware. Instead, in a certain situation, an expression "device configured to" may mean that the device is "capable of' some functions together with other devices or components. For example, the wording "a processor configured to perform A, B, and C " may mean a dedicated processor (e.g., imbedded processor) for performing a corresponding operation or a generic-purpose processor (e.g., CPU or application processor) that can perform corresponding operations by executing at least one software program stored in a memory device.

    [0022] Terms used in the present disclosure are not intended to limit the present invention, and they merely illustrate embodiments of the present invention. When used in a description of the present invention, a singular form includes a plurality of forms unless it is explicitly represented differently. Unless the context clearly dictates otherwise, all the terms including a technical or scientific term used in the present disclosure will have the same meaning generally understood by those skilled in the art. It should be understood that terms defined in a generally used dictionary have the same meaning as in a related technical context, and they are not to be interpreted in an abnormal or excessively formal meaning unless clearly indicated in the present disclosure. In some cases, the term defined in the present disclosure may not be interpreted to exclude embodiments of the present disclosure.

    [0023] For example, the electronic device according to various embodiments of the present disclosure may include at least one of a smartphone, tablet PC (tablet personal computer), mobile phone, video phone, e-book reader, desktop PC (desktop personal computer), laptop PC, netbook computer, workstation, server, PDA (personal digital assistant), PMP (portable multimedia player), MP3 player, mobile medical equipment, camera, or wearable device. According to various embodiments, the wearable device may include at least one of an accessory type (e.g., watch, ring, bracelet, anklet, necklace, glasses, contact lenses, or head-mounted-device (HMD)), fabric or cloth integrated type (e.g., electronic clothing), body attaching type (e.g., skin pad or tattoo), or bio-implant type (e.g., implantable circuit).

    [0024] In an embodiment, the electronic device may be a home appliance. The home appliance may include at least one of a television, DVD (digital video disk) player, audio device, refrigerator, air conditioner, vacuum cleaner, oven, microwave, washing machine, air cleaner, set-top box, home automation control panel, security control panel, TV box (e.g., Samsung HomeSync™, Apple TV™, or Google TV™), game console (e.g., Xbox™ or PlayStation™), electronic dictionary, electronic key, camcorder, or electronic picture frame.

    [0025] In another embodiment, the electronic device may include at least one of various pieces of medical equipment (e.g., various portable medical measurement equipment (blood glucose monitor, heartrate monitor, blood pressure measuring device, or clinical thermometer), MRA (magnetic resonance angiography) device, MRI (magnetic resonance imaging) device, CT (computed tomography) device, movie camera, or ultrasonic device), navigation device, GNSS (global navigation satellite system), EDR (event data recorder), FDR (flight data recorder), automobile infotainment device, electronic device for a ship (e.g., navigation equipment for a ship and gyro compass), avionics, security device, head unit for automobile, industrial or home robot, ATM (automatic teller machine) in a financial institution, POS (point of sales) in a shop, or internet of things (e.g., electric bulb, various sensors, electric or gas meter, spring cooler, fire alarm, thermostat, streetlight, toaster, fitness equipment, hot-water tank, heater, and boiler).

    [0026] According to an embodiment, the electronic device may include at least one piece of furniture, part of a building/structure, electronic board, electronic signature receiving device, projector, or various meters (e.g., water, electricity, gas, or radio measuring equipment). In various embodiments, the electronic device may include at least one of the aforementioned devices or their combinations. An electronic device according to an embodiment may be a flexible electronic device. Further, the electronic device according to an embodiment of the present disclosure is not limited to the aforementioned equipment and may include a new electronic device according to a technical development.

    [0027] Hereinafter, the electronic device according to various embodiments will be described with reference to the accompanying drawings. In the present disclosure, a term "user" may indicate a person using an electronic device or a device using an electronic device (e.g., artificial intelligence electronic device).

    [0028] Figures 1a to 1g illustrate an electronic device according to various embodiments of the present invention.

    [0029] Figure 1a is perspective view illustrating the electronic device 101 according to various embodiments of the present invention. The electronic device 101 may include a display 160 and a metal frame 220 configuring an exterior of the electronic device 101. The electronic device 101 can expose at least one part of the display 160 in a first direction such as a front direction. The metal frame 220 can configure a housing of the electronic device 101 together with the display 160 included at the front surface of the electronic device 101 and a rear case included at the rear side of the electronic device 101. The metal frame 220 can form a space in the electronic device 101 as an internal space, together with the display 160 included at the front surface of the electronic device 101 and the rear case included at the rear side of the electronic device 101. Electronic components of the electronic device 101 such as a printed circuit board or a battery electronic device 101 can be installed in the internal space. The metal frame 220 can include an opening, and a metal plate can be disposed in the opening by electrically displacing from the metal frame 220. At least one of an insulating material or a non-metallic material is disposed between the metal frame 220 and the metal plate, and the insulating material or the non-metallic material can be integrated by electrically separating the metal frame 220 and the metal plate.

    [0030] The display 160 may include a panel, hologram device, or projector. The panel can be provided in a flexible, transparent, or wearable form. The panel may be configured with a touch panel in a module. The hologram device can show a 3D image in the air by using light interference. The projector can display an image by projecting light on a screen. The screen may be located inside or outside of the electronic device 101. According to an embodiment, the display 160 may further include a control circuit for controlling the panel, hologram device, or projector.

    [0031] According to various embodiments, the electronic device 101 may include a power management module. The power management module may manage an electric power of the electronic device 101. According to an embodiment, the power management module may include a PMIC (power management integrated circuit), charger IC (charger integrated circuit), or battery or fuel gauge. The PMIC may use a wired and/or wireless charging method. The wireless charging method may include a magnetic resonance method, magnetic induction, or electromagnetic wave method, and it may further include an additional circuit for wireless charging such as a coil loop, resonance circuit, or rectifier. The battery gauge can measure a residual amount, voltage, current, or temperature of a battery while charging the battery. The battery may include a rechargeable battery and/or a solar battery.

    [0032] Figure 1b is a front view illustrating an electronic device 101 according to various embodiments of the present invention. The electronic device 101 may can expose at least one part of the display 160 in a first direction such as a front direction. The display 160 may include a component such as a window and a display device (e.g., display panel). The window of the display 160 may be configured with tempered glass and exposed in a first direction such as a front direction of the electronic device 101. The window of the display 160 may configure a housing of the electronic device 101 together with a metal frame 201 and a rear cover of the electronic device 101. The housing of the electronic device 101 may include the window as a first plate and the rear cover as a second plate.

    [0033] At least one part of the front surface of the electronic device 101 may include a key 156, camera window 191a, and first speaker hole 202a. The key 156, camera window 191a, and first speaker hole 202a included in the at least one part of the front surface of the electronic device 101 may be exposed to the outside. The key 156 included in the at least one part of the electronic device 101 may be a physical key such as a home key. The first speaker hole 202a of the electronic device 101 can transmit a sound output by a speaker 182 to the outside. In order to help photographing such as taking a selfie, at least one camera module 191 may be disposed at the front surface of the electronic device 101. The camera window 191a can protect the at least one camera module 191 disposed at the front surface.

    [0034] According to various embodiments, the key 156 may include a physical button, optical key, or keypad.

    [0035] According to various embodiments, the electronic device 101 may include an audio module. The audio module can convert a sound and an electric signal bilaterally. The audio module can process sound information input or output through a speaker 182, earphone, or microphone.

    [0036] According to various embodiments, the camera module 191 is a device for photographing a still image or a moving image. According to an embodiment, the camera module may include at least one image sensor (e.g., front sensor or rear sensor), lens, ISP (image signal processor), or flashlight (e.g., LED or xenon lamp).

    [0037] Figure 1c is a rear view illustrating an electronic device 101 according to various embodiments of the present invention. At least one part of the rear surface of the electronic device 101 may include a camera module 191. At least one part of a side surface of the electronic device 101 may include a key 156. The key 156 included in the at least one part of the side surface of the electronic device 101 may be a volume key. The rear surface of the electronic device 101 may expose a rear cover. The rear cover may be configured with various materials such as tempered glass, metal, synthetic resin (e.g., plastic), wood, fabric, or leather.

    [0038] Figure 1d is a left side view illustrating an electronic device 101 according to various embodiments of the present invention, and Figure 1e is a right side view illustrating an electronic device 101 according to various embodiments of the present invention. At least one part of a rear surface of the electronic device 101 may include a camera module 191. At least one part of a side surface of the electronic device 101 may include a key 156. The key 156 included in the at least one part of the side surface of the electronic device 101 may be a volume key or a power key.

    [0039] Figure If is an upper side view illustrating an electronic device 101 according to various embodiments of the present invention, and Figure 1g is a lower side view illustrating an electronic device 101 according to various embodiments of the present invention. At least one part of the lower side of the electronic device 101 may include a second speaker hole 202b, earphone hole 203, or interface 170. The earphone hole 203 may be docked or connected by an external earphone.

    [0040] The interface 170 may include a HDMI (high-definition multimedia interface), USB (universal serial bus), optical interface, or D-sub (D-subminiature). Additionally or and alternatively, the interface 170 may include an MHL (mobile high-definition link) interface, SD (secure digital) card/MMC (multi-media card) interface, or IrDA (infrared data association) specification interface.

    [0041] Figure 2 is an exploded perspective view illustrating an electronic device according to various embodiments of the present invention.

    [0042] According to various embodiments, the electronic device 101 may combine the display 160, metal plate 210, metal frame 220, printed circuit board 230, and rear cover 240 in order. The metal plate 210 can take a role of a bracket for the display 160. The metal plate 210 can fix the display 160 to the electronic device 101. A printed circuit board 230 may be disposed in the metal plate 210. The display 160 can expose a window 160a to the outside. The window of the display 160 may configure a front external surface of the electronic device 101, and the rear cover 240 may configure a rear external surface of the electronic device 101. The window of the display 160 may configure a first external surface of the electronic device 101, and the rear cover 240 may configure a second external surface of the electronic device 101. The metal frame 220 may configure a side member of the electronic device 101. The window of the display 160, rear cover 240, and metal frame 220 may configure an external housing of the electronic device 101. The metal plate 210 and metal frame 220 can be configured in an integral form. At least one part of the metal frame 220 may include a second speaker hole 202b, earphone hole 203, or interface 170. The earphone hole 203 can be docked or connected by an external earphone. A battery 196 or an antenna may be disposed in at least one part of the printed circuit board 230.

    [0043] Figures 3a to 3d illustrate a metal housing 300 of an electronic device 101 according to various embodiments of the present invention.

    [0044] Figure 3a is a perspective view illustrating a metal housing 300 of an electronic device 101 according to various embodiments of the present invention, Figure 3b is a front view illustrating a metal housing 300 of the electronic device 101 according to various embodiments of the present invention, Figure 3c is a rear view illustrating a metal housing 300 of the electronic device 101 according to various embodiments of the present invention, and Figure 3d is an exploded perspective view illustrating a metal housing 300 of the electronic device 101 according to various embodiments of the present invention.

    [0045] With reference to Figures 3a to 3d, the metal housing 300 of the electronic device 101 may include a metal frame 310, metal plate 320, and non-conductive bonding member 330.

    [0046] According to various embodiments, the metal frame 310 may be a metal frame 220 of Figure 2 or a metal frame 220 of Figure 1a.

    [0047] According to various embodiments, the material of the metal frame 310 may be at least one of an aluminum alloy, stainless steel, titanium alloy, or non-crystalline metal. The metal frame 310 can be formed by processing (e.g., CNC (computer numerical control) process) after primarily forming with at least one manufacturing method of extrusion, forging, pressing, and casting.

    [0048] According to various embodiments, the material of the metal plate 320 may be at least one of an aluminum alloy, stainless steel, titanium alloy, or non-crystalline metal. The metal plate 320 can be formed by at least one manufacturing method of die casting, forging, extrusion, or pressing.

    [0049] According to various embodiments, the material of the metal frame 310 and the material of the metal plate 320 may include at least one different metallic material. According to various embodiments, the material of the metal frame 310 and the material of the metal plate 320 may include identical metallic materials but having different compositions.

    [0050] According to various embodiments, the metal plate 320 can take a role of bracket of the display 160. The metal plate 320 can fix the display 160 to the electronic device 101. A printed circuit board may be disposed in the metal plate 320. The printed circuit board may install or include at least one of a communication module and a processor electrically connected to at least one part of the metal frame 310. The metal frame 310 can take a role of an antenna by electrically connecting to the communication module. The printed circuit board can be disposed by contacting with a side of the metal plate 320 or adjacent to the metal plate 320. The display 160 can be disposed by contacting with a side or another side of the metal plate 320, or adjacent to a side or another side of the metal plate 320. At least one part of the metal plate 320 may include a combining structure to dispose the printed circuit board. At least one part of the metal plate 320 may include a support structure in order to fix the display 160 to the electronic device 101.

    [0051] The processor can control a plurality of hardware or software components by driving an operating system or an application program and perform various data processing and operations. The processor may be configured with an SoC (system on chip). According to an embodiment, the processor may further include a GPU (graphic processing unit) and/or an image signal processor. The processor may include at least one of the components of the electronic device 101 (e.g., communication module). The processor can process commands or data received from other components (e.g., non-volatile memory) by loading into a volatile memory and store various data in the non-volatile memory.

    [0052] The communication module may include a cellular module, WiFi module, Bluetooth module, GNSS module (e.g., GPS module, Glonass module, Beidou module, or Galileo module), NFC module, and RF (radio frequency) module.

    [0053] The cellular module can provide a voice communication, video communication, text messaging service, or internet service through a communication network. According to an embodiment, the cellular module can perform identification or authentication of the electronic device 101 in a communication network by using a subscriber identification module (e.g., SIM card). According to an embodiment, the cellular module can perform at least one of functions provided by the processor. According to an embodiment, the cellular module may include a CP (communication processor).

    [0054] Each of the WiFi module, Bluetooth module, GNSS module, and NFC module may include a processor for processing data transmitted by a corresponding module. According to an embodiment, at least one (i.e.., more than one) of the cellular module, WiFi module, Bluetooth module, GNSS module, or NFC module can be included in an integrated chip (IC) or an IC package.

    [0055] The RF module can transmit or receive a communication signal (e.g., RF signal). The RF module may include a transceiver, PAM (power amp module), frequency filter, LNA (low noise amplifier), or antenna. According to another embodiment, at least one of the cellular module, WiFi module, Bluetooth module, GNSS module, or NFC module may transmit or receive an RF signal through a separate RF module.

    [0056] According to various embodiments, a material of a non-conductive bonding member 330 may be at least one of polymer resins such as polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyimide (PI), polycarbonate (PC), and acrylonitrile butadiene styrene (ABS), and it may include proper mineral particles (ceramic or glass fiber) to reinforce a mechanical property.

    [0057] According to various embodiments, the metal plate 320 may be disposed in a state of displacing from an opening 340 of the metal frame 310, and if a non-conductive bonding member 330 is molded by an extruder through insert injection molding, the non-conductive bonding member 330 can physically or chemically combine and electrically separate the metal frame 310 and the metal plate 320.

    [0058] Figures 4a to 4b are cross-sectional views illustrating a metal housing 300 cut along the direction A-A' of Figure 3a according to various embodiments of the present invention.

    [0059] Figure 4a is a cross-sectional view illustrating an electronic device 101 including a metal housing 300 according to various embodiments of the present invention. The display 160 may be disposed in a first direction such as a front direction of the electronic device 101. A rear cover may be disposed in a second direction opposite to the first direction such as a rear direction of the electronic device 101. The metal frame 310, display 160, and rear cover may form a housing or an exterior of the electronic device 101. The metal plate 320 disposed at the opening 340 of the metal frame 310 and displaced from the metal frame 310 may be combined with the metal frame 310 physically or chemically by the non-conductive bonding member 330.

    [0060] Figure 4c is an exploded view illustrating a partial area in the cross sectional view of the metal housing according to various embodiments of the present invention.

    [0061] According to various embodiments, the metal frame 310, metal plate 320, and non-conductive bonding member 330 may include at least one of an interlacing structure, staggering structure, and extrusion-dent structure for a rigid bonding.

    [0062] With reference to the exploded view of the partial area in the cross section view of the metal housing, a partial area of the metal plate 320, for example, an area extended to the outside of the metal housing 300, can protrude in a longitudinal direction. A partial area of the metal frame 310, for example, an area extended into the metal housing 300, may form a dent in the longitudinal direction. The non-conductive bonding member 330 can be formed with insert extrusion molding by filling an extrusion-dent structure of the metal frame 310 and the metal plate 320.

    [0063] Figures 5a to 5c illustrate structures of a non-conductive bonding member 330 extruded in a metal housing 300 according to various embodiments of the present invention.

    [0064] Figure 5a is a perspective view illustrating a bonding structure of the non-conductive bonding member 330 extruded into the metal housing 300 according to various embodiments of the present invention, Figure 5b is a cross sectional view illustrating a bonding structure of the non-conductive bonding member 330 extruded into the metal housing 300 according to various embodiments of the present invention, and Figure 5c is a plane view illustrating a bonding structure of the non-conductive bonding member 330 extruded into the metal housing 300 according to various embodiments of the present invention.

    [0065] According to various embodiments, the metal plate 320 may include at least one interlacing structure 321 having a toothed shape, and the non-conductive bonding member 330 can fill at least one interlacing structure 321 of the metal plate 320 having a toothed shape and form at least one interlacing structure 331 having a toothed shape.

    [0066] According to various embodiments, the metal plate 320 may form a protrusion 322 longitudinally in a partial area, for example, an area extended to the outside of the metal housing 300. A partial area of the metal frame 310 may form a dent 311 longitudinally in an area extended into the metal housing 300. The non-conductive bonding member 330 may be extruded by insert extrusion molding and may fill an extrusion-dent structure of the metal frame 310 and the metal plate 320. The non-conductive bonding member 330 may form a dent 332 and protrusion 333 structure by filling the extrusion-dent structure of the metal frame 310 and the metal plate 320.

    [0067] Figures 6a to 6c illustrate structures of a non-conductive bonding member 330 extruded in a metal housing 300 according to various embodiments of the present invention.

    [0068] Figure 6a is a perspective view illustrating a bonding structure of the non-conductive bonding member 330 extruded into the metal housing 300 according to various embodiments of the present invention, Figure 6b is a cross sectional view illustrating a bonding structure of the non-conductive bonding member 330 extruded into the metal housing 300 according to various embodiments of the present invention, and Figure 6c is a plane view illustrating a bonding structure of the non-conductive bonding member 330 extruded into the metal housing 300 according to various embodiments of the present invention.

    [0069] According to various embodiments, the metal plate 320 may include at least one dented interlacing structure 323, and the non-conductive bonding member 330 may form a T-shaped interlacing structure 334 by filling the at least one interlacing structure 321 of the metal plate 320.

    [0070] According to various embodiments, the metal plate 320 may form a protrusion 322 in a partial area such as an area extended to the outside of the metal housing 300. A partial area of the metal frame 310 such as an area extended into the metal housing 300 may form a dent 311 longitudinally. The non-conductive bonding member 330 may be extruded by filling an extrusion-dent structure of the metal frame 310 and the metal plate 320. The non-conductive bonding member 330 may form a dent 332 and protrusion 333 structure by filling the extrusion-dent structure of the metal frame 310 and the metal plate 320.

    [0071] Figure 7 illustrates a metal housing 300 of an electronic device 101 according to various embodiments of the present invention.

    [0072] According to various embodiments, the metal frame 310 may be a metal frame 220 of Figure 2 or a metal frame 220 of Figure 1a. The metal plate 320 may be a metal plate 210 of Figure 2.

    [0073] According to various embodiments, the metal frame 310 can be formed by processing (e.g., CNC (computer numerical control) process) after primarily forming with one method of extrusion, forging, pressing, and casting.

    [0074] According to various embodiments, the metal plate 320 can be formed with at least one method of die casting or pressing. The metal plate 320 according to various embodiments can be formed with the pressing method as shown in Figure 7.

    [0075] According to various embodiments, the metal plate 320 is disposed at an opening 340 of the metal frame 310, and if the non-conductive bonding member 330 is extruded by an extruder with an insert injection molding method, the non-conductive bonding member 330 can electrically separate and physically or chemically combine the metal frame 310 and the metal plate 320.

    [0076] Figure 8 is a flowchart illustrating a manufacturing process of a metal housing 300 according to various embodiments of the present invention.

    [0077] At operation 801, a metal frame 310 having a first surface and a second surface opposite to the first surface and a metal plate 320 are formed.

    [0078] According to various embodiments, the metal frame 310 can be formed to include an opening 340 penetrating the first surface and the second surface in a center part of the metal frame 310. At least one though hole smaller than the opening 340 can be formed at the periphery of the metal frame 310. The metal plate 320 may be formed smaller than the metal frame 310 so that the metal plate can be disposed at the opening 340 and displaced from the metal frame 310. The metal plate 320 may be formed to include a through hole in order to fix to an extruder.

    [0079] According to various embodiments, the metal frame 310 can be formed with at least one manufacturing method of extrusion, forging, pressing, and casting.

    [0080] According to various embodiments, the metal plate 320 can be formed with at least one manufacturing method of die casting or pressing.

    [0081] At operation 803, at least one of the formed metal frame 310 and the formed metal plate 320 is processed. The operation of processing the at least one of the formed metal frame 310 and the formed metal plate 320 may be an operation of finishing the surfaces of the formed metal frame 310 and the formed metal plate 320 so that the formed metal frame 310 and the formed metal plate 320 can bond to each other while the bonding member 330 is extruded in the insert extrusion molding. The operation of processing the at least one of the formed metal frame 310 and the formed metal plate 320 may be a process of trimming an exterior (e.g., CNC process or casting product process).

    [0082] At operation 805, a bonding member 330 is extruded by using an extruder. The operation of extruding a non-conductive bonding member 330 by using an extruder may include the operations of fixing a processed metal frame 310 in an extruder by using at least one part of a through hole, disposing a processed metal plate 320 in an opening 340 displacing at least one part of the metal plate 320 from the processed metal frame 310, filling the non-conductive bonding member 330 between the processed metal frame 310 and the processed metal plate 320 by using the extruder, and taking out a structure including the metal frame 310, metal plate 320, and non-conductive bonding member 330 from the extruder.

    [0083] At operation 807, the structure taken out from the extruder is post-processed. The operation of post-processing the structure taken out from the extruder may include the operations of cutting at least one part of the periphery of the structure including a through hole and forming a metal frame 310 having no through hole. The operation of post-processing the structure taken out from the extruder may include a diamond-cutting operation for the metal frame 310 in order to give a metallic feeling to the metal frame 310.

    [0084] Figure 9 illustrates a manufacturing process of a metal housing 300 according to various embodiments of the present invention.

    [0085] At operation 901, at least one part of the center of the metal frame 310 is formed to include an opening 340 penetrating a first surface and a second surface. At least one through hole 950 smaller than the opening 340 may be formed and additionally processed at the periphery of the metal frame 310. At operation 903, the metal plate 320 is formed smaller than the metal frame 310 so that the metal plate 320 can be disposed at the opening 340 displaced from the metal frame 310. Here, the metal plate 320 can be formed with a casting method. At least one part of the metal plate 320 can be formed or additionally processed to include at least one through hole 950 smaller than the opening 340.

    [0086] According to various embodiments, the through hole 950 is used for fixing the metal frame 310 and the metal plate 320 to an extrusion mold, and it may be formed by an additional process (e.g., CNC process or punching process) after primarily forming the metal frame 310 or the metal plate 320.

    [0087] According to various embodiments, the through hole 950 can be formed by an additional process (e.g., CNC process or punching process) after marking a location of the through hole on the metal frame 310 in the extrusion mold.

    [0088] At operation 905, the processed metal frame 310 is fixed in the extruder by using at least one part of the through hole 950, the processed metal plate 320 is disposed in the opening 340 by displacing at least one part of the processed metal plate 320 from the processed metal frame 310, a non-conductive bonding member 330 is filled between the processed metal plate 320 and the processed metal frame 310 by using the extruder, and a structure including the metal frame 310, metal plate 320, and non-conductive bonding member 330 is taken out from the extruder.

    [0089] At operation 907, the structure taken out from the extruder is post-processed by cutting at least one part of the periphery including the through hole 950 and forming a metal frame 310 having no through hole 950.

    [0090] At operation 909, a diamond-cutting is performed to esthetically vitalize a metallic feeling of the metal frame 310.

    [0091] Figure 10 illustrates a manufacturing process of a metal housing 300 according to various embodiments of the present invention.

    [0092] At operation 1001, at least one part of the center of the metal frame 310 is formed to include an opening 340 penetrating a first surface and a second surface. At least one through hole 1050 smaller than the opening 340 may be formed and additionally processed at the periphery of the metal frame 310.

    [0093] At operation 1003, the metal plate 320 is formed smaller than the metal frame 310 so that the metal plate 320 can be disposed at the opening 340 displacing from the metal frame 310. Here, the metal plate 320 can be formed with a pressing method. At least one part of the metal plate 320 can be formed or additionally processed to include at least one through hole 1050 smaller than the opening 340.

    [0094] According to various embodiments, the through hole 1050 is used for fixing the metal frame 310 and the metal plate 320 to an extrusion mold, and it may be formed by an additional process (e.g., CNC process or punching process) after primarily forming the metal frame 310 or the metal plate 320.

    [0095] According to various embodiments, the through hole 1050 can be formed by an additional process (e.g., CNC process or punching process) after marking a location of the through hole on the metal frame 310 in the extrusion mold.

    [0096] At operation 1005, the processed metal frame 310 is fixed in the extruder by using at least one part of the through hole 1050, the processed metal plate 320 is disposed in the opening 340 by displacing at least one part of the processed metal plate 320 from the processed metal frame 310, a non-conductive bonding member 330 is filled between the processed metal plate 320 and the processed metal frame 310 by using the extruder, and a structure including the metal frame 310, metal plate 320, and non-conductive bonding member 330 is taken out from the extruder.

    [0097] At operation 1007, the structure taken out from the extruder is post-processed by cutting at least one part of the periphery including the through hole 1050 and forming a metal frame 310 having no through hole 1050.

    [0098] At operation 1009, diamond cutting is performed for the metal frame 310 to esthetically vitalize a metallic feeling of the metal frame 310.

    [0099] Examples of non-transitory computer-readable media include magnetic media such as a hard disk, floppy disk, and magnetic tape; optical media such as a compact disc read only memory (CD-ROM) disk and a digital versatile disc (DVD); magneto-optical media such as a floptical disk; and hardware devices that are configured to store and perform program instructions (e.g., programming modules) such as a ROM, a RAM, and a flash memory. Examples of program instructions include machine code instructions generated using assembly languages, such as by a compiler, and code instructions created using a high-level programming language executable in computers using an interpreter, etc. The hardware devices described above may be configured to act as one or more software modules in order to perform the operations and methods described above, or vice versa.

    [0100] A module or programming module according to various embodiments may include at least one of the above-mentioned components, may not include some of the above-mentioned components, or may further include other components. Operations performed by a module, programming module, or other components according to various embodiments of the present disclosure may be executed through a sequential, parallel, repetitive, or heuristic method. Additionally, some operations may be executed in different orders or may be omitted, and other operations may be added.


    Claims

    1. An electronic device (101) comprising:

    a metal frame (310) including an opening at a center part of the metal frame;

    a metal plate (320) included in the opening and having at least one part displaced from the metal frame;

    a bonding member (330) configured to fix the metal plate to the metal frame and fill a gap between the metal frame and the metal plate;

    a printed circuit board configured to contact with or disposed adjacent to a surface of the metal plate;

    a communication module mounted on the printed circuit board and electrically connected to at least one part of the metal frame;

    a display configured to contact with or disposed adjacent to said surface of the metal plate or another surface of the metal plate;

    a first plate configured to cover at least one part of the display while forming a part of an external housing together with the metal frame; and

    a second plate configured to cover the opposite side of the display and form a part of the external housing together with the metal frame, wherein:
    the metal plate comprises at least one of an interlacing structure, a staggering structure, and an extrusion-dent structure.


     
    2. The electronic device of claim 1, wherein the metal plate and the bonding member are combined with each other through a physical or chemical bonding.
     
    3. The electronic device of claim 1, wherein the metal frame and the bonding member are combined with each other through a physical or chemical bonding.
     
    4. The electronic device of claim 1, wherein the first plate is a display window.
     
    5. The electronic device of claim 1, wherein the second plate is a rear cover.
     
    6. The electronic device of claim 1, wherein the bonding member is formed with an insulating material or a non-metallic material.
     
    7. The electronic device of claim 1, wherein at least one of the metal frame and the bonding member comprises at least one of an interlacing structure, a staggering structure, and an extrusion-dent structure.
     
    8. The electronic device of claim 7, wherein the interlacing structure is a toothed structure or a T-shaped structure.
     
    9. A method for manufacturing an electronic device (101), the method comprising:

    fixing a metal frame (310) having a first surface and a second surface opposite to the first surface, and including an opening piercing the second surface from the first surface at the center part of the metal frame and at least one through hole smaller than the opening at the periphery of the metal frame, in an extruder by using at least one part of the through hole;

    disposing at least one part of a metal plate (320) in the opening by displacing from the metal frame;

    filling a bonding member (330) between the metal frame and the metal plate by using the extruder;

    taking out a structure including the metal frame, the metal plate, and the bonding member from the extruder; and

    forming the metal frame having no through hole by cutting off at least one part of the periphery including the through hole, wherein:

    the metal plate comprises at least one of an interlacing structure, a staggering structure, and an extrusion-dent structure.
     
    10. The method of claim 9, further comprising:
    performing a diamond cutting for at least one part of the metal frame having no through hole.
     
    11. The method of claim 9, further comprising:

    forming the metal frame including the through hole and the opening from a basic material; and

    forming the metal plate from the basic material.


     
    12. The method of claim 9, further comprising:
    performing a surface treatment of the metal frame and the metal plate by using the extruder before the bonding member is completely filled.
     
    13. The method of claim 9, wherein the metal frame comprises at least one metallic material different from the metal plate,
    wherein the metallic material is at least one of an aluminum alloy, a stainless steel, a titanium alloy, or an amorphous metal, and
    wherein the metal frame is formed from a basic material by using at least of extruding, forging, pressing, and casting.
     
    14. The method of claim 9, wherein the metal plate comprises at least one through hole,
    wherein the metal plate is formed with at least one of a magnesium alloy, an aluminum alloy, a zinc alloy, a copper alloy, an amorphous alloy, a stainless steel, and a titanium ally, and
    wherein the metal plate is formed from a basic material by using at least one method of die casting or pressing.
     
    15. The method of claim 9, wherein the bonding member is formed with at least one of a polyphenylene sulfide 'PPS' resin, a polybutylene terephthalate 'PBT' resin, a polyamide 'PI' resin, a polycarbonate 'PC' resin, or an acrylonitrile butadiene styrene 'ABS' resin.
     


    Ansprüche

    1. Elektronische Vorrichtung (101), umfassend:

    einen Metallrahmen (310), enthaltend eine Öffnung an einem mittleren Teil des Metallrahmens; eine in der Öffnung enthaltene Metallplatte (320), bei der mindestens ein Teil vom Metallrahmen verschoben ist;

    ein Verbindungselement (330), das konfiguriert ist, um die Metallplatte an den Metallrahmen zu befestigen und einen Spalt zwischen dem Metallrahmen und der Metallplatte zu füllen;

    eine Leiterplatte, die konfiguriert ist, um eine Oberfläche der Metallplatte zu kontaktieren oder angrenzend dazu angeordnet zu sein;

    ein auf der Leiterplatte montiertes und elektrisch mit mindestens einem Teil des Metallrahmens verbundenes Kommunikationsmodul;

    eine Anzeige, die konfiguriert ist, um die Oberfläche der Metallplatte oder eine andere Oberfläche der Metallplatte

    zu kontaktieren oder angrenzend dazu angeordnet zu sein;

    eine erste Platte, die konfiguriert ist, um mindestens ein Teil der Anzeige abzudecken, während sie ein Teil eines externen Gehäuses zusammen mit dem Metallrahmen bildet; und

    eine zweite Platte, die konfiguriert ist, um die gegenüberliegende Seite der Anzeige abzudecken und einen Teil des externen Gehäuses zusammen mit dem Metallrahmen zu bilden, wobei:
    die Metallplatte mindestens eine einer Verflechtungsstruktur, einer Staffelungsstruktur und einer Extrusionsvertiefungsstruktur umfasst.


     
    2. Elektronische Vorrichtung nach Anspruch 1, wobei die Metallplatte und das Verbindungselement durch eine physische oder chemische Verbindung miteinander kombiniert sind.
     
    3. Elektronische Vorrichtung nach Anspruch 1, wobei der Metallrahmen und das Verbindungselement durch eine physische oder chemische Verbindung miteinander kombiniert sind.
     
    4. Elektronische Vorrichtung nach Anspruch 1, wobei die erste Platte ein Anzeigefenster ist.
     
    5. Elektronische Vorrichtung nach Anspruch 1, wobei die zweite Platte eine hintere Abdeckung ist.
     
    6. Elektronische Vorrichtung nach Anspruch 1, wobei das Verbindungselement mit einem Isoliermaterial oder einem nicht-metallischen Material geformt ist.
     
    7. Elektronische Vorrichtung nach Anspruch 1, wobei mindestens eines des Metallrahmens und des Verbindungselements mindestens eine einer Verflechtungsstruktur, einer Staffelungsstruktur und einer Extrusionsvertiefungsstruktur umfasst.
     
    8. Elektronische Vorrichtung nach Anspruch 7, wobei die die Verflechtungsstruktur eine gezahnte Struktur oder eine T-förmige Struktur ist.
     
    9. Verfahren zum Herstellen einer elektronischen Vorrichtung (101), wobei das Verfahren umfasst:

    ein Befestigen eines Metallrahmens (310) mit einer ersten Oberfläche und einer zweiten Oberfläche gegenüber der ersten Oberfläche und enthaltend eine die zweite Oberfläche von der ersten Oberfläche an einem mittleren Teil des Metallrahmens durchquerende Öffnung und mindestens ein Durchgangsloch, das kleiner als die Öffnung an der Peripherie des Metallrahmens ist, in einen Extruder mithilfe mindestens eines Teils des Durchgangslochs;

    ein Anordnen mindestens eines Teils einer Metallplatte (320) in der Öffnung durch Verschieben vom Metallrahmen;

    ein Füllen eines Verbindungselemetns (330) zwischen den Metallrahmen und die Metallplatte mithilfe des Extruders;

    ein Herausnehmen einer Struktur, die den Metallrahmen beinhaltet, und des Verbindungselements aus dem Extruder; und

    ein Formen des Metallrahmens, der kein Durchgangsloch aufweist, durch Abschneiden mindestens eines Teils der Peripherie, der das Durchgangsloch beinhaltet, wobei:
    die Metallplatte mindestens eine einer Verflechtungsstruktur, einer Staffelungsstruktur und einer Extrusionsvertiefungsstruktur umfasst.


     
    10. Verfahren nach Anspruch 9, ferner umfassend:
    ein Ausführen eines Diamantschnitts für mindestens einen Teil des Metallrahmens ohne Durchgangsloch.
     
    11. Verfahren nach Anspruch 9, ferner umfassend:
    ein Formen des Metallrahmens mit dem Durchgangsloch und der Öffnung aus einem Basismaterial; und ein Formen der Metallplatte aus dem Basismaterial.
     
    12. Verfahren nach Anspruch 9, ferner umfassend:
    ein Ausführen einer Oberflächenbehandlung des Metallrahmens und der Metallplatte mithilfe des Extruders, bevor das Verbindungselement vollständig gefüllt ist.
     
    13. Verfahren nach Anspruch 9, wobei der Metallrahmen mindestens ein Metallmaterial umfasst, das sich von der Metallplatte unterscheidet,
    wobei das Metallmaterial mindestens eines einer Aluminiumlegierung, eines Edelstahls, einer Titanlegierung oder eines amorphen Metalls ist, und
    wobei der Metallrahmen aus einem Basismaterial mithilfe mindestens eines aus Extrudieren, Schmieden, Pressen und Gießen geformt wird.
     
    14. Verfahren nach Anspruch 9, wobei die Metallplatte mindestens ein Durchgangsloch umfasst,
    wobei die Metallplatte mit mindestens einer einer Magnesiumlegierung, einer Aluminiumlegierung, einer Zinklegierung, einer Kupferlegierung, einer amorphen Legierung, eines Edelstahls und einer Titanlegierung geformt ist, und
    wobei die Metallplatte aus einem Basismaterial mithilfe mindestens eines Verfahrens aus Druckguss oder Pressen geformt wird.
     
    15. Verfahren nach Anspruch 9, wobei das Verbindungselement mit mindestens einem aus einem Polyphenylensulfid-'PPS'-Harz, einem Polybutylenterephthalat-'PBT'-Harz, einem Polyamid-'PI'-Harz, einem Polycarbonat-'PC'-Harz oder einem Acrylonitrilbutadienstyrol-'ABS'-Harz geformt wird.
     


    Revendications

    1. Dispositif électronique (101) comprenant :

    un cadre métallique (310) comprenant une ouverture au niveau d'une partie centrale du cadre métallique ;

    une plaque métallique (320) comprise dans l'ouverture et possédant au moins une partie décalée du cadre métallique ;

    un élément de liaison (330) conçu pour fixer la plaque métallique au cadre métallique et combler un espace entre le cadre métallique et la plaque métallique ;

    une carte de circuit imprimé conçue pour être mise en contact avec une surface de la plaque métallique ou être disposée adjacente à celle-ci ;

    un module de communication monté sur la carte de circuit imprimé et connecté électriquement à au moins une partie du cadre métallique ;

    un dispositif d'affichage conçu pour être mis en contact avec ladite surface

    de la plaque métallique ou autre surface de la plaque métallique ou être adjacente à celle-ci ;

    une première plaque configurée pour couvrir au moins une partie du dispositif d'affichage tout en formant une partie d'un boîtier externe ensemble avec le cadre métallique ; et

    une seconde plaque configurée pour couvrir le côté opposé du dispositif d'affichage et former une partie du boîtier externe ensemble avec le cadre métallique,

    ladite plaque métallique comprenant au moins l'une d'une structure d'entrelacement, d'une structure en quinconce et d'une structure dentée par extrusion.


     
    2. Dispositif électronique selon la revendication 1, ladite plaque métallique et ledit élément de liaison étant unis l'un à l'autre par une liaison physique ou chimique.
     
    3. Dispositif électronique selon la revendication 1, ledit cadre métallique et ledit élément de liaison étant unis l'un à l'autre par une liaison physique ou chimique.
     
    4. Dispositif électronique selon la revendication 1, ladite première plaque étant une fenêtre de dispositif d'affichage.
     
    5. Dispositif électronique selon la revendication 1, ladite seconde plaque étant un couvercle arrière.
     
    6. Dispositif électronique selon la revendication 1, ledit élément de liaison étant formé avec un matériau isolant ou un matériau non métallique.
     
    7. Dispositif électronique selon la revendication 1, au moins l'un du cadre métallique et de l'élément de liaison comprenant au moins l'une d'une structure d'entrelacement, d'une structure en quinconce et d'une structure dentée par extrusion.
     
    8. Dispositif électronique selon la revendication 7, ladite structure d'entrelacement étant une structure dentelée ou une structure en forme de T.
     
    9. Procédé permettant la fabrication d'un dispositif électronique (101), ledit procédé comprenant :

    la fixation d'un cadre métallique (310) possédant une première surface et une seconde surface opposée à la première surface, et comprenant une ouverture perçant la seconde surface à partir de la première surface au niveau de la partie centrale du cadre métallique et au moins un trou traversant plus petit que l'ouverture au niveau de la périphérie du cadre métallique, dans une extrudeuse à l'aide d'au moins une partie du trou traversant ;

    la mise en place d'au moins une partie d'une plaque métallique (320) dans l'ouverture en la décalant du cadre métallique ;

    le remplissage d'un élément de liaison (330) entre le cadre métallique et la plaque métallique à l'aide de l'extrudeuse;

    le retrait d'une structure comprenant le cadre métallique, la plaque métallique et l'élément de liaison de l'extrudeuse ; et

    la formation du cadre métallique ne possédant pas de trou traversant en coupant au moins une partie de la périphérie comprenant le trou traversant,

    ladite plaque métallique comprenant au moins l'une d'une structure d'entrelacement, d'une structure en quinconce et d'une structure dentée par extrusion.


     
    10. Procédé selon la revendication 9, comprenant en outre :
    la réalisation d'une coupe au diamant pour au moins une partie du cadre métallique ne possédant pas de trou traversant.
     
    11. Procédé selon la revendication 9, comprenant en outre :
    la formation du cadre métallique comprenant le trou traversant et l'ouverture à partir d'un matériau de base ; et la formation de la plaque métallique à partir du matériau de base.
     
    12. Procédé selon la revendication 9, comprenant en outre :
    la réalisation d'un traitement de surface du cadre métallique et de la plaque métallique à l'aide de l'extrudeuse avant que l'élément de liaison ne soit complètement rempli.
     
    13. Procédé selon la revendication 9, ledit cadre métallique comprenant au moins un matériau métallique différent de la plaque métallique,
    ledit matériau métallique étant au moins l'un d'un alliage d'aluminium, d'un acier inoxydable, d'un alliage de titane ou d'un métal amorphe, et
    ledit cadre métallique étant formé d'un matériau de base à l'aide d'au moins l'un de l'extrusion, du forgeage, du pressage et du moulage.
     
    14. Procédé selon la revendication 9, ladite plaque métallique comprenant au moins un trou traversant,
    ladite plaque métallique étant formée avec au moins l'un d'un alliage de magnésium, d'un alliage d'aluminium, d'un alliage de zinc, d'un alliage de cuivre, d'un alliage amorphe, d'un acier inoxydable et d'un alliage de titane, et
    ladite plaque métallique étant formée à partir d'un matériau de base à l'aide d'au moins un procédé de moulage sous pression ou de pressage.
     
    15. Procédé selon la revendication 9, ledit élément de liaison étant formé avec au moins l'une d'une résine de sulfure de polyphénylène (PPS), d'une résine de poly téréphtalate de butylène (PBT), d'une résine de polyamide (PI), d'une résine de polycarbonate (PC) ou d'une résine d'acrylonitrile butadiène styrène (ABS).
     




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    Cited references

    REFERENCES CITED IN THE DESCRIPTION



    This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

    Patent documents cited in the description