(19)
(11)EP 3 410 831 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
29.04.2020 Bulletin 2020/18

(21)Application number: 18183914.3

(22)Date of filing:  12.03.2013
(51)International Patent Classification (IPC): 
H05K 7/20(2006.01)

(54)

THERMAL SEPARATION OF ELECTRONIC CONTROL CHASSIS HEATSINKS FINS

THERMISCHE TRENNUNG DER KÜHLKÖRPERRIPPEN EINES ELEKTRONISCHEN STEUERUNGSGEHÄUSES

SÉPARATION THERMIQUE DES AILETTES DE DISSIPATEUR THERMIQUE DE CHÂSSIS DE COMMANDE ÉLECTRONIQUE


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 26.04.2012 US 201213456757

(43)Date of publication of application:
05.12.2018 Bulletin 2018/49

(62)Application number of the earlier application in accordance with Art. 76 EPC:
13158841.0 / 2658359

(73)Proprietor: Hamilton Sundstrand Corporation
Charlotte, NC 28217 (US)

(72)Inventors:
  • KOKAS, Jay W.
    East Granby, CT 06026 (US)
  • QUERNS, Kerry R.
    Durham, CT 06422 (US)
  • MAYNARD, Michael
    Springfield, MA 01118 (US)

(74)Representative: Dehns 
St. Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)


(56)References cited: : 
EP-A1- 1 333 359
US-B1- 6 836 409
DE-A1- 2 757 282
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description

    BACKGROUND



    [0001] This invention relates to chassis for electronic components, and, more specifically, to chassis for electronic components that include heatsinks.

    [0002] When electronic components such as motor controllers are operated, heat is generated. Because these components are designed to operate within certain temperature ranges, this heat must be dissipated from the system in order to promote efficient operation and avoid overheating. Therefore, heatsinks have been used to control the temperature of electronics. Heatsinks are generally comprised of thermally conductive material and are thermally connected to the electronic components. Heatsinks also include features that increase surface area, such as fins, which provide greater heat loss, through convection, to the ambient environment. Thereby, heat can be transferred from the electronic components and dissipated to the atmosphere.

    [0003] It can be beneficial to attach more than one electronic component to a heatsink. Because a heatsink is a good thermal conductor, during operation of the electronic components the bulk of the heatsink, including the portion to which the components are mounted, will be at approximately the same temperature. This can be problematic if one of the electronic components requires a lower operating temperature than the other and/or if this component emits less heat than the other while, at the same time, the other component is dissipating much more heat and driving up the temperature of the heatsink. In this case the ambient temperature of the environment the components are located in can also cause overheating of the lower operating temperature components. US 6 836 409 B1 relates to devices that dissipate heat. DE 2 757 282 A1 relates to a thermal insulation system. EP 1 333 359 A1 relates to a housing for a passively cooled computer.

    SUMMARY



    [0004] According to one embodiment of the present invention, an electronic system is provided as claimed in claim 1 and includes an electronics chassis and two electronic components. The electronics chassis includes two electronic components generating heat that are separated by a thermal isolator, wherein one electronic component is mounted to one heat dissipator and the other electronic component is mounted to the other heat dissipator.

    BRIEF DESCRIPTION OF THE DRAWINGS



    [0005] 

    FIG. 1 is a perspective view of an electronic system including an electronics chassis.

    FIG. 2 is a perspective view of the electronic system with an electronics chassis in shadow.

    FIG. 3 is a bottom view of the electronics chassis including two electronic components.

    FIG. 4 is a cross-section view of the electronic system including a thermal isolator along line 3-3 in FIG. 3.


    DETAILED DESCRIPTION



    [0006] In FIG. 1, a perspective view of electronic system 10 is shown, including electronics chassis 12. In FIG. 2, a perspective view of electronic system 10 with electronics chassis 12 in shadow. In FIG. 3, a bottom view of electronics chassis 12 is shown, including first electronic component 38 and second electronic component 40. FIGS. 1-3 will now be discussed simultaneously.

    [0007] Electronic system 10 includes electronics chassis 12, first electronic component 38, second electronic component 40, and cover plate 44. In general, electronics chassis 12 is a unitary structure with top side 14, shroud 16, and flange 26, and electronics chassis 12 is comprised of a thermally conductive material, such as aluminum. Top side 14 includes an aperture, into which first heat dissipator 30 is affixed. More specifically, first heat dissipator 30 is bonded to top side 14 by thermal isolator 34. This is possible because thermal isolator 34 comprises a material with structural and adhesive properties, such as a non-thermally conductive elastomer (for example, a polyamide material).

    [0008] In addition, top side 14 includes second heat dissipator 32. Therefore, thermal isolator 34 is positioned between first heat dissipator 30 and second heat dissipator 32. Heat dissipators 30, 32 have increased surface area on their respective top sides (opposite of mounting surface 42,43) because heat dissipators 30, 32 include fins 36. Mounted to mounting surface 42 of top side 14 inside shroud 16 is first electronic component 38. Mounted to mounting surface 43 of top side 14 inside shroud 16 is second electronic component 40. Thereby, electronic components 38, 40 are thermally connected to heat dissipators 30, 32, respectively. One skilled in the art can appreciate that although directional terms such as "top side", "bottom side", "underneath", and "downward" are used to describe this invention, such terms are merely relational descriptors of the illustrated embodiments shown herein.

    [0009] In the illustrated embodiment, shroud 16 extends perpendicularly downward from top side 14, beyond electronic components 38, 40. Shroud 16 comprises first side 18, second side 20 which is adjacent to first side 18, third side 22 which is adjacent to second side 20, and fourth side 24, which is adjacent to third side 22 and first side 18. Attached around shroud 16 is flange 26 which includes a plurality of mounting holes 28. Cover plate 44 is attached to flange 26 through mounting holes 28 to create a bottom side of electronic system 10.

    [0010] During operation of electronic component 38, heat is generated and is transferred to heat dissipator 30 by conduction. During operation of electronic component 40, heat is generated and is transferred to heat dissipator 32 by conduction. This heat is then dissipated to the atmosphere by convection. In the illustrated embodiment, first electronic component 38 is a high heat generating, high operating temperature rated electronic component whereas second electronic component 40 is a lower heat generating, lower operating temperature rated electronic component. Therefore during operation of first electronic component 38 emits more heat than second electronic component 40. In practice, first heat dissipator 30 is at approximately 240°C and second heat dissipator 32 is at approximately 180°C during operation. This also means that first heat dissipator 30 dissipates more heat than second heat dissipator 32.

    [0011] The components and configuration of electronic system 10 as shown in FIGS. 1-3 allow for electronics chassis 12 to be made from two pieces. In addition, heat can be eliminated from electronic components 38, 40 and transferred to the atmosphere. In addition, FIGS. 1 and 2 show one embodiment of the present invention, to which there are alternatives. For example, there can be more than one first electronic component 38 mounted to first heat dissipator 30 and there can be more than one second electronic component 40 mounted to second heat dissipator 32. For another example, the operating temperatures of first heat dissipator 30 and second heat dissipator 32 can vary from the embodiment listed above, in part due to the components used or the application of electronic system 10.

    [0012] In FIG. 4, a cross-section view of electronic system 10 is shown along line 3-3 in FIG. 3, including thermal isolator 34. Shown in FIG. 4 is the same embodiment as shown in FIGS. 1-3 with additional features being visible.

    [0013] As stated previously, during operation of electronic components 38, 40, first heat dissipator 30 is at a greater temperature than second heat dissipator 32. This is possible because thermal isolator 34 substantially prevents heat transfer between first heat dissipator 30 and second heat dissipator 32. This is possible because thermal isolator 34 comprises a material with low thermal conductivity such as a non-thermally conductive elastomer (for example, a polyamide material).

    [0014] In other words, thermal isolator 34 acts as a thermal isolator to isolate the higher operating temperature component(s) 38 from the lower operating temperature component(s) 40. In the illustrated embodiment, thermal isolator 34 forms a thermal isolation ring around higher operating temperature component 38.

    [0015] The components and configuration of electronic system 10 as shown in FIG. 3 allow for electronic components 38, 40 to be protected by electronics chassis 12. Furthermore, heat transfer can occur from first electronic component 38, through first heat dissipator 30, and to the atmosphere. But heat transfer from first heat dissipator 30 to second heat dissipator 32 is impeded, which prevents first electronic component 38 from heating up (and possibly overheating) second electronic component 40.

    [0016] It should be recognized that the present invention provides numerous benefits and advantages. For example, multiple electronic components with different operating temperatures can be mounted to the same chassis substantially without having heat transfer occur between the electronic components.

    [0017] While the invention has been described with reference to an exemplary embodiment(s), it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment(s) disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.


    Claims

    1. An electronic system (10) comprising:

    an electronics chassis (12) that includes a first heat dissipator (30) and a second heat dissipator (32) that are separated by a thermal isolator (34);

    a first electronic component (38) mounted to the first heat dissipator within the chassis; and

    a second electronic component (40) mounted to the second heat dissipator within the chassis; characterised in that

    the thermal isolator (34) surrounds the first heat dissipator, or wherein the thermal isolator (34) forms a thermal isolation ring around the first heat dissipator (30).


     
    2. The electronic system of claim 1, wherein the chassis (12) includes a top and side walls that enclose the first and second electronic components.
     
    3. The electronic system of claim 1, wherein the first and second heat dissipators (30, 32) are located in the top of the chassis (12) and each include an inner surface to which the first and second electronic components (38, 40) are mounted, respectively, or wherein the first heat dissipator (30) includes fins (16) on an external surface for heat dissipation.
     
    4. The electronic system of claim 1, wherein the second heat dissipator (32) includes fins (16) on an external surface for heat dissipation, or wherein the thermal isolator (34) comprises a non-thermally conductive elastomer.
     
    5. The electronic system of claim 1, and further comprising:

    a mounting flange (26) attached to the side walls; and

    a cover plate (44) attached to the flange (26) to form a bottom side of the electronics chassis.


     
    6. The electronic system of claim 1, wherein during operation of the first and second electronic components, the first electronic component (38) emits substantially more heat than the second electronic component (40).
     
    7. The electronic system of claim 1, wherein during operation of the first and second electronic components (38, 40), the first heat dissipator (30) dissipates more heat that the second heat dissipator (32), or wherein during operation of the first and second electronic components (38, 40), there is a temperature difference between the first heat dissipator (30) and the second heat dissipator (32).
     


    Ansprüche

    1. Elektronisches System (10), Folgendes umfassend:

    ein elektronisches Gehäuse (12), das einen ersten Wärmeableiter (30) und einen zweiten Wärmeableiter (32) beinhaltet, die durch einen thermischen Isolator (34) voneinander getrennt sind;

    eine erste elektronische Komponente (38), die an dem ersten Wärmeableiter innerhalb des Gehäuses montiert ist; und

    eine zweite elektronische Komponente (40), die an dem zweiten Wärmeableiter innerhalb des Gehäuses montiert ist; dadurch gekennzeichnet, dass

    der thermische Isolator (34) den ersten Wärmeableiter umgibt, oder

    wobei der thermische Isolator (34) einen thermischen Isolierring um den ersten Wärmeableiter (30) bildet.


     
    2. Elektronisches System nach Anspruch 1, wobei das Gehäuse (12) einen oberen Teil und Seitenwände beinhaltet, die die erste und die zweite elektronische Komponente einschließen.
     
    3. Elektronisches System nach Anspruch 1, wobei sich der erste und der zweite Wärmeableiter (30, 32) in dem oberen Teil des Gehäuses (12) befinden und jeder eine innere Oberfläche beinhaltet, an der jeweils die erste und die zweite elektronisches Komponente (38, 40) montiert sind, oder wobei der erste Wärmeableiter (30) auf einer äußeren Oberfläche Rippen (16) zum Ableiten von Wärme beinhaltet.
     
    4. Elektronisches System nach Anspruch 1, wobei der zweite Wärmeableiter (32) auf einer äußeren Oberfläche Rippen (16) zum Ableiten von Wärme beinhaltet oder wobei der thermische Isolator (34) ein nicht wärmeleitendes Elastomer umfasst.
     
    5. Elektronisches System nach Anspruch 1, ferner Folgendes umfassend:

    einen Montageflansch (26), der an den Seitenwänden angebracht ist; und

    eine Abdeckplatte (44), die an dem Flansch (26) angebracht ist, um eine Unterseite des elektronischen Gehäuses zu bilden.


     
    6. Elektronisches System nach Anspruch 1, wobei während des Betriebs der ersten und der zweiten elektronischen Komponente die erste elektronische Komponente (38) wesentlich mehr Wärme emittiert als die zweite elektronische Komponente (40).
     
    7. Elektronisches System nach Anspruch 1, wobei während des Betriebs der ersten und der zweiten elektronischen Komponente (38, 40) der erste Wärmeableiter (30) mehr Wärme ableitet als der zweite Wärmeableiter (32) oder wobei während des Betriebs der ersten und der zweiten elektronischen Komponente (38, 40) eine Temperaturdifferenz zwischen dem ersten Wärmeableiter (30) und dem zweiten Wärmeableiter (32) vorliegt.
     


    Revendications

    1. Système électronique (10) comprenant :

    un châssis électronique (12) qui comporte un premier dissipateur thermique (30) et un second dissipateur thermique (32) qui sont séparés par un isolateur thermique (34) ;

    un premier composant électronique (38) monté sur le premier dissipateur thermique à l'intérieur du châssis ; et

    un second composant électronique (40) monté sur le second dissipateur thermique à l'intérieur du châssis ; caractérisé en ce que

    l'isolateur thermique (34) entoure le premier dissipateur thermique, ou
    dans lequel l'isolateur thermique (34) forme un anneau d'isolation thermique autour du premier dissipateur thermique (30) .


     
    2. Système électronique selon la revendication 1, dans lequel le châssis (12) comporte des parois supérieures et latérales qui renferment les premier et second composants électroniques.
     
    3. Système électronique selon la revendication 1, dans lequel les premier et second dissipateurs thermiques (30, 32) sont situés dans la partie supérieure du châssis (12) et comportent chacun une surface intérieure sur laquelle les premier et second composants électroniques (38, 40) sont montés, respectivement, ou dans lequel le premier dissipateur thermique (30) comporte des ailettes (16) sur une surface externe pour la dissipation thermique.
     
    4. Système électronique selon la revendication 1, dans lequel le second dissipateur thermique (32) comporte des ailettes (16) sur une surface externe pour la dissipation thermique, ou dans lequel l'isolateur thermique (34) comprend un élastomère non thermiquement conducteur.
     
    5. Système électronique selon la revendication 1, et comprenant en outre :

    une bride de montage (26) fixée aux parois latérales ; et

    une plaque de couverture (44) fixée à la bride (26) pour former un côté inférieur du châssis électronique.


     
    6. Système électronique selon la revendication 1, dans lequel pendant le fonctionnement des premier et second composants électroniques, le premier composant électronique (38) émet sensiblement plus de chaleur que le second composant électronique (40).
     
    7. Système électronique selon la revendication 1, dans lequel, pendant le fonctionnement des premier et second composants électroniques (38, 40), le premier dissipateur thermique (30) dissipe plus de chaleur que le second dissipateur thermique (32), ou dans lequel, pendant le fonctionnement des premier et second composants électroniques (38, 40), il y a une différence de température entre le premier dissipateur thermique (30) et le second dissipateur thermique (32).
     




    Drawing

















    Cited references

    REFERENCES CITED IN THE DESCRIPTION



    This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

    Patent documents cited in the description