(19)
(11)EP 3 444 062 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
13.01.2021 Bulletin 2021/02

(21)Application number: 17782456.2

(22)Date of filing:  13.04.2017
(51)International Patent Classification (IPC): 
B23K 26/38(2014.01)
B23K 101/34(2006.01)
B23K 101/18(2006.01)
(86)International application number:
PCT/JP2017/015075
(87)International publication number:
WO 2017/179643 (19.10.2017 Gazette  2017/42)

(54)

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASERBEARBEITUNGSVORRICHTUNG UND LASERBEARBEITUNGSVERFAHREN

DISPOSITIF DE TRAITEMENT LASER ET PROCÉDÉ DE TRAITEMENT LASER


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 15.04.2016 JP 2016082050
07.04.2017 JP 2017076866

(43)Date of publication of application:
20.02.2019 Bulletin 2019/08

(73)Proprietor: Amada Holdings Co., Ltd.
Isehara-shi, Kanagawa 259-1196 (JP)

(72)Inventors:
  • IMAI Norio
    Isehara-shi Kanagawa 259-1196 (JP)
  • TAKANO Hiroshi
    Isehara-shi Kanagawa 259-1196 (JP)
  • SHIBATA Takahiro
    Isehara-shi Kanagawa 259-1196 (JP)
  • NAKAMURA Ko
    Isehara-shi Kanagawa 259-1196 (JP)

(74)Representative: Grünecker Patent- und Rechtsanwälte PartG mbB 
Leopoldstraße 4
80802 München
80802 München (DE)


(56)References cited: : 
JP-A- H07 241 688
JP-A- 2001 212 681
JP-A- 2013 022 608
JP-A- 2014 097 519
JP-A- 2001 212 681
JP-A- 2010 194 602
JP-A- 2014 097 519
US-A1- 2012 312 481
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description

    [Technical Field]



    [0001] The present invention relates to a laser processing device and a laser processing method that, when processing a workpiece to which a protective film is attached, automatically cut the protective film at a part such as a common part where components come into contact with each other and the protective film must be taken off.

    [Background Art]



    [0002] In recent years, a required quality for a manufacturing process of sheet metal products is getting more, as a result workpiece processing carried out in a state that a protective film is attached to a workpiece such as a stainless material is increased.

    [0003] In a process of sheet metal laser processing, there is a part such as a common part where components come into contact with each other and a protective film must be removed. Conventionally, manual work has been carried out to conduct the partial removal of the protective film.

    [0004] Here, the case that requires a protective film to be partly removed from a workpiece is a case involving a component to which another component is scheduled to be attached, a case involving a component to be hidden by hemming (pressing) bending, or a case involving a part to be burned by welding heat.

    [0005] Patent Literature 2 proposes to provide a laser beam processing method in which a protective sheet is not peeled out from the surface of a processed work during processes for making a piercing hole, and for cutting followed thereafter. While an assisting gas is blowing onto the processed work, a laser beam is first irradiated to a processed work so that an encircled portion surrounding a piercing point of a protective sheet is only cut. Next, the laser beam is irradiated to the piercing point so that a piercing hole is made in a basic material. Then, the laser beam is irradiated to the processed work so that a through hole in an up and down direction to pass through the assisting gas is made at the place of the piercing hole. Patent Literature 2 discloses a laser processing device according to the preamble of independent claim 1 as well as a laser processing method according to the preamble of independent claim 8.

    [0006] Patent Literature 3 proposes to create a working program for performing more accurate working, by managing a material with a protective film. A working condition is added to protective film information corresponding to input predetermined material information. The protective film information is added to the predetermined material information. Component data is created on the basis of the predetermined material information to which the protective film information is added. The created component data is displayed on a display device. A working program giving consideration to a protective film is created on the basis of the component data displayed on the display device.

    [Prior Art Document]


    [Patent Literature]



    [0007] 

    Patent Literature 1: Japanese Unexamined Patent Application Publication No. 2015-104739

    Patent Literature 2: Japanese Unexamined Patent Application Publication No. 2001-212681, which represents the basis for the preamble of claims 1 and 8

    Patent Literature 3: Japanese Unexamined Patent Application Publication No. 2014-097519


    [Summary of the invention]



    [0008] The conventional manual protective film partial removing work partly removes the film, lifts it, and cuts it with a cutter knife or the like so as not to damage a mother material. This causes problems such as taking a long time and increasing labor of a worker.

    [0009] In consideration of the above-mentioned circumstances, an object of the present invention is to provide a laser processing device and a laser processing method, capable of, when laser processing a workpiece attached with a protective film, automatically determining and cutting the protective film at a part such as a common part where components come into contact with each other and the protective film must be removed, thereby improving workability of the partial removal of the protective film.

    [0010] To solve the problems mentioned above, the present invention provides a laser processing device according to independent claim 1, and a laser processing method according to independent claim 8. Preferred embodiments are set out in the dependent claims.

    [Brief Description of Drawings]



    [0011] 

    [Fig. 1] Fig. 1 is a general perspective diagram of a laser processing device according to an embodiment of the present invention.

    [Fig. 2] Fig. 2 is a schematic block diagram of a control device 7 shown in Fig. 1.

    [Fig. 3] Fig. 3 is a flowchart of adding laser marking processing executed by the control device 7 to cut a protective film.

    [Fig. 4] Fig. 4 is a flowchart of a process of a step 103 shown in Fig. 3 to determine whether or not there is a common part that requires the laser marking processing and a process of a step 105 to add a laser marking processing process to a processing program.

    [Fig. 5] Fig. 5 is an explanatory diagram of the type of a common part where components come into contact with each other.

    [Fig. 6] Fig. 6 is an explanatory diagram of a common face of a butt joint where an end face A1 of a component A and an end face B1 of a component B come into contact with each other.

    [Fig. 7] Fig. 7 is an explanatory diagram of configuration information of the common face shown in Fig. 6.

    [Fig. 8] Fig. 8 is an explanatory diagram of laser marking processing of a butt joint to attach a separate component to a workpiece W.

    [Fig. 9] Fig. 9 is an explanatory diagram of laser marking processing of a butt joint having a common part where hemming (pressing) bending is carried out.

    [Fig. 10] Fig. 10 is an explanatory diagram of an edge joint having a common part where edge welding is carried out.

    [Fig. 11] Fig. 11 is an explanatory diagram of laser marking processing of an end face joint having a common part where a stud bolt is attached by welding.


    [Description of Embodiments]



    [0012] Hereunder, an embodiment according to the present invention will be explained with reference to the drawings.

    [0013] Figure 1 is a general perspective diagram of a laser processing device according to the embodiment of the present invention.

    [0014] As shown in Fig. 1, the laser processing device 1 emits a laser beam to a workpiece W that is a material to process, carries out laser processing such as opening a hole on the workpiece W, and produces a predetermined component or the like from the workpiece W.

    [0015] The laser processing device 1 has a laser oscillator 3 as a laser light source, a main body unit 5 to irradiate the workpiece W with a laser beam outputted from the laser oscillator 3 and process the workpiece W, and a control device 7 to control an overall operation of the laser processing device 1. To the control device 7, an external data server 9 and the like are connected.

    [0016] The laser oscillator 3 oscillates a laser beam in response to an instruction from the control device 7. The laser beam generated by the laser oscillator 3 is supplied through a process fiber 11 to a processing head 13.

    [0017] The main body unit 5 has a processing table 15 having a mounting plane 15a on which the workpiece W is placed and an X-axis carriage 17 that is arranged on the processing table 15 and is moved in a direction (X-axis direction) along the mounting plane 15a.

    [0018] On the X-axis carriage 17, a Y-axis carriage 19 is arranged to move along the mounting plane 15a in a Y-axis direction orthogonal to the X-axis direction. To the Y-axis carriage 19, the processing head 13 is attached to be movable in a Z-axis direction (a direction orthogonal to the X-axis and Y-axis).

    [0019] The X-axis carriage 17, Y-axis carriage 19, and processing head 13 are set to be independently driven by drive units (not shown) under the control of the control device 7.

    [0020] The processing head 13 is two-dimensionally movable through a cooperation of the X-axis carriage 17 and Y-axis carriage 19 along a surface of the workpiece W within a range facing the workpiece W, irradiates an intended processing point Wp of the workpiece W with a laser beam L having a predetermined focal position, and carries out processing.

    [0021] Figure 2 is a schematic block diagram of the control device 7 shown in Fig. 1.

    [0022] As shown in Fig. 2, the control device 7 consists of a computer having a CPU 27 to which a ROM 23 and a RAM 25 are connected. To the CPU 27, an input device 29 such as a keyboard, a display device 31 such as a display, the external data server 9, and the like are also connected.

    [0023] Further, the control device 7 is supplied with processing information including a processing program from the external data server 9 and the like.

    [0024] Here, the processing information includes, in addition to the processing program, information necessary for processing such as the material, processing dimensions, and 3D model information of the workpiece W to process, as well as processing process information after laser processing of the workpiece W such as welding setting and stud bolt attachment setting and information concerning a protective film attached to the workpiece W.

    [0025] The information concerning the protective film includes the type of the protective film. As will be explained later, the control device 7 refers to the information necessary for processing, the processing process information after laser processing of the workpiece W such as welding setting and stud bolt attachment setting, and the information concerning the protective film attached to the workpiece W, to prepare information concerning a common part of a component to be produced from the workpiece W, and based on the information of the common part, controls laser marking processing to cut the protective film by laser processing.

    [0026] Namely, the common part of a component is a part where components come into contact with each other after processing. On the common part where components come into contact with each other, the laser marking processing is carried out in advance so that the protective film may easily be taken off.

    [0027] By the way, the above-mentioned information necessary for processing includes drawing information such as a development diagram. The laser marking processing cuts a protective film made of vinyl chloride or the like.

    [0028] Namely, in the control device 7, the CPU 27 follows an instruction from an operator through the input device 29, to control the laser processing device 1 in accordance with the processing information including the processing program and carry out laser processing including the laser marking processing on the workpiece W.

    [0029] Next, the laser marking processing executed by the control device 7 to cut a protective film will be explained. In this case, a determination whether or not there is a protective film is achieved in advance, and when there is a protective film, the process is carried out.

    [0030] Figure 3 is a flowchart executed by the control device 7 to add the laser marking processing to cut the protective film.

    [0031] In a step 101 of Fig. 3, the control device 7 takes processing information including a processing program from the external data server 9 and the like.

    [0032]  Here, the processing information includes, in addition to the processing program, information necessary for processing such as the material, processing dimensions, and 3D model information of a workpiece W to process, as well as processing process information after laser processing of the workpiece W such as welding setting and stud bolt attachment setting and information concerning the protective film attached to the workpiece W, the information concerning the protective film including the type of the protective film.

    [0033] Then, in a step 103, the control device 7 determines, based on the processing information, whether or not there is a common part that requires the laser marking processing to cut the protective film. When there is the common part that requires the laser marking processing to cut the protective film, the control device 7 adds in a step 105 a process of carrying out the laser marking processing along a periphery of the common part to the processing program.

    [0034] Although the above-mentioned laser marking processing is set to be carried out after regular laser processing, it may be set to be carried out before the regular laser processing.

    [0035] Next, the details of the above-mentioned steps 103 and 105 will be explained.

    [0036] Figure 4 is a flowchart of the step 103 to determine whether or not there is the common part that requires the laser marking processing and the step 105 to add the process of carrying out the laser marking processing to the processing program.

    [0037] In a step 201 of Fig. 4, the control device 7 detects, based on the fetched processing information including the processing program, the common part that requires the laser marking processing to cut the protective film.

    [0038] Namely, since the processing information includes, in addition to the processing program, the information necessary for processing such as the material, processing dimensions, and 3D model information of the workpiece W to process, as well as the processing process information after laser processing of the workpiece W such as welding setting and stud bolt attachment setting and the information concerning the protective film attached to the workpiece W, the control device 7 detects, based on the processing information, the common part where components come into contact with each other after processing and welding or the like is carried out.

    [0039] By the way, types of the common part where components come into contact with each other are as shown in Fig. 5. Namely, there are a butt joint shown in Fig. 5(a) in which an end face A1 of a component A and an end face B1 of a component B come into contact with each other to form a common part, a corner joint shown in Fig. 5(b) in which a corner part A2a of a flat face A2 of a component A and an end face B1 of a component B come into contact with each other to form a common part, a T-joint shown in Fig. 5 (c) in which a central part A2b of a flat face A2 of a component A and an end face B1 of a component B come into contact with each other to form a common part, a lap joint shown in Fig. 5(d) in which a portion A2c of a flat face A2 of a component A and a portion B2a of a flat face B2 of a component B come into contact with each other to form a common part, and an edge joint shown in Fig. 5(e) in which an edge portion A1a of an end face A1 of a component A and an edge portion B1a of an end face B1 of a component B come into contact with each other to form a common part.

    [0040] Next, in a step 203, the CPU 27 of the control device 7 generates, as a joint pattern, configuration information of the common part detected in the above-mentioned step 201 and stores it in the RAM 25.

    [0041] Figure 5 is an explanatory diagram of the types of a common part where components come into contact with each other, and in Figs. 5(a) to 5(d), the common part is indicated with diagonal lines. Since Fig. 5(e) is an edge joint, the common part is indicated with a continuous line.

    [0042] Here, the but joint as shown in Fig. 5(a) will be explained as an example. As shown in Fig. 6, the but joint involves the end face A1 of the component A and the end face B1 of the component B that come into contact with each other to form a common face for which configuration information as shown in Fig. 7 is obtained.

    [0043] The end face A1 of the component A shown in Fig. 6 is provided with a protective film.

    [0044] Namely, a first edge A1c surrounding a common face Alb of the end face A1 of the component A and a first edge B1c surrounding a common face B1b of the end face B1 of the component B shown in Fig. 6 are obtained as a Local Edge ID=1 of a Butt Joint Feature shown in Fig. 7.

    [0045] In the Local Edge ID=1, a parameter GeomAttr1 of the first edge A1c has an attribute Flange Edge and a parameter GeomAttr2 of the first edge B1c has an attribute Flange Edge.

    [0046] Similarly, parameters and attributes of second edges A1d and B1d, third edges A1e and B1e, and fourth edges Alf and B1f, i.e., Local Edge ID=2 to Local Edge ID=4 are obtained as common-face configuration information as shown in Fig. 7. Based on these information pieces, the type of the common part is determined.

    [0047] Figure 6 is an explanatory diagram of the common face where the end face A1 of the component A and the end face B1 of the component B come into contact with each other and Fig. 7 is an explanatory diagram of the configuration information of the common face shown in Fig. 6.

    [0048] Next, in a step 205, the CPU 27 of the control device 7 adds a laser marking processing process to the processing program according to the configuration information of the common part generated and stored in the RAM 25 in the step 203.

    [0049] Namely, based on the above-mentioned configuration information of the common part, a process program of carrying out the laser marking processing along a periphery of the common part is added to the processing program.

    [0050]  The laser marking processing may be added to be carried out after regular laser processing or before the regular laser processing.

    [0051] In the case of the common face shown in Fig. 6 where the end face A1 of the component A and the end face B1 of the component B come into contact with each other, the first edge A1c to the third edge Ale among the edges along the periphery of the common face are edges of the component A, and therefore, the laser marking processing is set to be carried out along the fourth edge A1f.

    [0052] Also, in consideration of a fitting error of the components A and B, the laser marking processing may be carried out on slightly outside of the fourth edge A1f.

    [0053] Next, concrete examples of the laser marking processing on a common part will be explained.

    [0054] Figures 8 to 11 are explanatory diagrams of concrete examples of the laser marking processing on common parts.

    [0055] Figure 8 is an explanatory diagram of a but joint having a common part to which another component is scheduled to be attached.

    [0056] As shown in Fig. 8(a), in a processing process of a workpiece W after laser processing, a different component 33 is attached to the workpiece W. In this case, the control device 7 generates, from processing process information after laser processing of the workpiece W, configuration information of a common part where the different component is going to be attached, and based on the configuration information, the laser marking processing is added to a processing program. As a result, as shown in Fig. 8(b), the laser marking processing is carried out along a periphery W1a of the common part W1 where the different component 33 is scheduled to be attached.

    [0057] With this, after laser processing, a protective film of the common part along which the laser marking processing was carried out can easily be removed, and as shown in Fig. 8(a), the different component 33 can be attached to the common part 37 from which the protective film 35 was removed.

    [0058] Namely, it is possible to avoid trouble to be caused when the different component 33 is attached to a part where the protective film 35 is still attached.

    [0059] Figure 9 is an explanatory diagram of a butt joint having a common part where hemming (pressing) bending is carried out.

    [0060] As shown in Fig. 9 (a), when there is a common part where hemming (pressing) bending is carried out, the control device 7 generates configuration information of the common part where the hemming (pressing) bending is scheduled to be carried out, and based on the configuration information, adds the laser marking processing to a processing program. As a result, as shown in Fig. 9(b), the laser marking processing is carried out along a periphery W2a of an overlapping area W2 of the common part 39 where the hemming (pressing) bending is carried out.

    [0061]  With this, after laser processing, a protective film of the common part where the laser marking processing was carried out can easily be removed, and as shown in Fig. 9(b), the hemming (pressing) bending can be carried out in a state that the protective film 35 was removed from the overlapping area W2.

    [0062] Namely, it is possible to avoid trouble to be caused by the protective film 35 left on the common part 39 when the hemming (pressing) bending is carried out on the common part 39.

    [0063] Figure 10 is an explanatory diagram of an edge joint having a common part where edge welding is carried out.

    [0064] As shown in Fig. 10(a), when there is a common part where edge welding is carried out, the control device 7 generates, from welding setting information, configuration information of the common part where welding is carried out, and based on the configuration information, adds the laser marking processing to a processing program. As a result, as shown in Fig. 10(b), the laser marking processing is carried out along a periphery W3a of the common part 41 where welding is carried out.

    [0065] Here, determination of the periphery W3a of the common part 41 where welding is carried out is made according to a below-explained process of setting a removing width L of the protective film 35 on the part 41 where welding is carried out.

    [0066] Namely, the process of setting a removing width of the protective film 35 on the common part 41 where welding is carried out includes that, when setting a welding operation based on the welding setting information, the control device 7 estimates a heat gain (directivity) from a welding head 43 and unevenly sets minimum removing widths L with respect to a weld line 45.

    [0067] More precisely, as shown in Fig. 10(a), a heat diffusion quantity from the weld line 45 of the common part 41 where welding is carried out differs depending on an irradiation direction of the welding head 43 at the time of welding. As shown in Fig. 10(b), when the irradiation direction of a laser beam or the like from the welding head 43 is made incident to the right side of the weld line 45, a heat diffusion quantity on the left side of the weld line 45 will be greater than that on the right side of the weld line 45.

    [0068] Accordingly, the control device 7 refers to the welding setting information, determines, as shown in Fig. 10(b), the periphery W3a of the common part 41 where welding is carried out such that a removing width L1 on the left side of the weld line 45 is greater than a removing width L2 on the right side of the weld line 45, and carries out the laser marking processing.

    [0069] With this, it is possible, after laser processing, to easily remove the protective film of the common part where the laser marking processing was carried out, and as shown in Fig. 10(b), it is possible to remove the protective film 35 such that the removing width L1 on the left side of the weld line 45 is greater than the removing width L2 on the right side of the weld line 45. Therefore, the protective film 35 will never been burned nor leave a remnant.

    [0070]  It must be noted that the removing width L of the protective film 35 may be determined according to the plate thickness and material of a workpiece W. Namely, when the plate thickness and material of the workpiece W need a large amount of heat for welding, the removing width L may be set wider, and when only a small heat quantity is needed for welding, the removing width L may be set smaller.

    [0071] Figure 11 is an explanatory diagram of a butt joint having a common part where a stud bolt is attached by welding.

    [0072] As shown in Fig. 11, when there is a common part where a stud bolt is attached by welding, the control device 7 generates, from 3D model information, configuration information of the common part where the stud bolt 47 is attached by welding, and based on the configuration information, adds the laser marking processing to a processing program.

    [0073] As a result, as shown in Fig. 11, the laser marking processing is carried out along a periphery W4a of the common part 49 where the stud bolt 47 is attached by welding.

    [0074] With this, it is possible, after laser processing, to easily remove the protective film of the common part where the laser marking processing was carried out, and as shown in Fig. 11, it is possible to weld the stud bolt 47 in a state that the protective film 35 is removed from the periphery W4a of the common part 49 where the stud bolt 47 is attached by welding.

    [0075] As a result, the protective film 35 will never been burned nor leave a remnant.

    [0076] Further, in a determination process of the common part 49 where the stud bolt 47 is attached by welding, the control device 7 may estimate a heat gain (directivity) of a welding head and unevenly set minimum removing widths L with respect to the stud bolt 47.

    [0077] Also, in Fig. 11, W4b is a mark to indicate a welding position of the stud bolt 47.

    [0078] According to the above-mentioned embodiment, the laser marking processing is carried out in advance on a common part from which a protective film must be removed, to make the protective film easily removable, thereby remarkably improving the workability of common-part removal of the protective film.

    [0079] The present invention is not limited to the above-mentioned embodiment, and through proper modifications, is achievable in other forms.

    [Industrial Applicability]



    [0080] According to the present invention, when processing a workpiece attached with a protective film, the protective film to be removed from a common part is automatically determined and cut off to greatly improve the workability of common-part removal of the protective film.


    Claims

    1. A laser processing device (1) for carrying out laser processing on a workpiece (W) attached with a protective film (35), comprising:

    a control device (7) consisting of a computer having a CPU (27) to which a ROM (23) and a RAM (25) are connected;

    a laser oscillator (3), such that the laser oscillator oscillates a laser beam in response to instruction from the control device (7);
    being characterised by

    an external data server (9) connected to the CPU (27), such that the control device (7) is supplied with processing information including a processing program from the external data server (9),

    and further characterised in that the control device (7) is configured to determine, based on the processing information including the processing program, whether or not there is a common part (37,39,41,49) that requires laser processing to cut the protective film (35), the common part (37,39,41,49) being a part (37,41,49) of the workpiece (W) where, in a processing process of the workpiece (W) after laser processing, a different component comes into contact with the workpiece (W) or a part (39) of the workpiece (W) where, in the processing process of the workpiece (W) after laser processing, another part of the workpiece (W) comes into contact with the workpiece (W), and to add a laser processing process for the common part (37,39,41,49) that requires the laser processing to cut the protective film (35) to the processing program, when there is the common part (37,39,41,49) that requires the laser processing to cut the protective film (35).


     
    2. The laser processing device (1) according to Claim 1, wherein the laser processing to cut the protective film (35) is laser marking processing.
     
    3. The laser processing device (1) according to Claim 1, wherein the common part (37) that requires the laser processing to cut the protective film (35) is a part to which another component (33) is scheduled to be attached.
     
    4. The laser processing device (1) according to Claim 1, wherein the common part (39) that requires the laser processing to cut the protective film (35) is a part on which hemming bending is carried out.
     
    5. The laser processing device (1) according to Claim 1, wherein the common part (41) that requires the laser processing to cut the protective film (35) is a part on which welding is carried out.
     
    6. The laser processing device (1) according to Claim 1, wherein the common part (49) that requires the laser processing to cut the protective film (35) is a part to which a stud bolt (47) is attached by welding.
     
    7. The laser processing device (1) according to Claim 3, wherein the processing information includes, in addition to the processing program, information necessary for processing such as the material, processing dimensions, and 3D model information of a workpiece (W) to process, as well as processing process information after laser processing of the workpiece (W) such as welding setting and stud bolt attachment setting and information concerning the protective film (35) attached to the workpiece (W), the information concerning the protective film (35) including the type of the protective film (35).
     
    8. A laser processing method for carrying out laser processing on a workpiece (W) attached with the protective film (35), characterized by providing a control device (7) consisting of a computer having a CPU (27), a ROM (23) and a RAM (25), both being connected to the CPU (27), the control device (7) achieving the following steps:

    a step of determining, based on processing information including a processing program, whether or not there is a common part (37,39,41,49) that requires laser processing to cut the protective film (35), the common part (37,39,41,49) being a part (37,41,49) of the workpiece (W) where, in a processing process of the workpiece (W) after laser processing, a different component comes into contact with the workpiece (W) or a part (39) of the workpiece (W) where, in the processing process of the workpiece (W) after laser processing, another part of the workpiece (W) comes into contact with the workpiece (W), and

    a step of adding to the processing program a laser processing process for the common part (37,39,41,49) that requires the laser processing to cut the protective film (35) when there is the common part (37,39,41,49) that requires the laser processing to cut the protective film (35).


     
    9. The laser processing method according to Claim 8, wherein when the common part (41) that requires the laser processing to cut the protective film (35) is a common part (41) on which welding is carried out, the shape (W3b) of the common part (41) that requires the laser processing to cut the protective film (35) is adjusted according to a heat diffusing range (L,L1,L2) from a weld line (45).
     
    10. The laser processing method according to Claim 9, wherein when the common part (41) that requires the laser processing to cut the protective film (35) is a common part (41) on which welding is carried out, the shape (W3a) of the common part (41) that requires the laser processing to cut the protective film (35) is changed according to an irradiation direction of a laser beam from a welding head (43).
     


    Ansprüche

    1. Laserbearbeitungsvorrichtung (1) zum Ausführen einer Laserbearbeitung an einem Werkstück (W), das mit einem Schutzfilm (35) versehen ist, umfassend:

    eine Steuervorrichtung (7), die aus einem Computer mit einer CPU (27) besteht, an die ein ROM (23) und ein RAM (25) angeschlossen sind;

    einen Laseroszillator (3) derart, dass der Laseroszillator einen Laserstrahl als Reaktion auf eine Anweisung von der Steuervorrichtung (7) oszillieren lässt;

    gekennzeichnet durch:

    einen externen Datenserver (9), der mit der CPU (27) verbunden ist, so dass die Steuervorrichtung (7) mit Bearbeitungsinformationen einschließlich eines Bearbeitungsprogramms von dem externen Datenserver (9) versorgt wird,

    und weiter dadurch gekennzeichnet, dass

    die Steuervorrichtung (7) dazu eingerichtet ist, basierend auf Informationen der Bearbeitung einschließlich des Bearbeitungsprogramms zu bestimmen, ob es einen gemeinsamen Teil (37, 39, 41, 49) gibt, der eine Laserbearbeitung erfordert, um den Schutzfilm (35) zu schneiden, wobei der gemeinsame Teil (37, 39, 41, 49) ein Teil (37, 41, 49) des Werkstücks (W) ist, bei dem bei einem Bearbeitungsvorgang des Werkstücks (W) nach der Laserbearbeitung eine andere Komponente mit dem Werkstück (W) in Kontakt gelangt oder ein Teil (39) des Werkstücks (W) ist, bei dem bei dem Bearbeitungsvorgang des Werkstücks (W) nach der Laserbearbeitung ein anderer Teil des Werkstücks (W) in Kontakt mit dem Werkstück (W) kommt, und einen Laserbearbeitungsvorgang für den gemeinsamen Teil (37, 39, 41, 49), bei dem die Laserbearbeitung den Schutzfilm (35) schneiden muss, zu dem Bearbeitungsprogramm hinzufügt, wenn der gemeinsame Teil (37, 39, 41, 49) vorhanden ist, bei dem die Laserbearbeitung den Schutzfilm (35) schneiden muss.


     
    2. Laserbearbeitungsvorrichtung (1) nach Anspruch 1, bei der die Laserbearbeitung zum Schneiden des Schutzfilms (35) eine Lasermarkierungsbearbeitung ist.
     
    3. Laserbearbeitungsvorrichtung (1) nach Anspruch 1, bei der der gemeinsame Teil (37), der die Laserbearbeitung zum Schneiden des Schutzfilms (35) erfordert, ein Teil ist, an dem eine andere Komponente (33) angebracht werden soll.
     
    4. Laserbearbeitungsvorrichtung (1) nach Anspruch 1, bei der der gemeinsame Teil (39), der die Laserbearbeitung zum Schneiden des Schutzfilms (35) erfordert, ein Teil ist, an dem ein Falzbiegen ausgeführt wird.
     
    5. Laserbearbeitungsvorrichtung (1) nach Anspruch 1, bei der der gemeinsame Teil (41), der die Laserbearbeitung zum Schneiden des Schutzfilms (35) erfordert, ein Teil ist, an dem geschweißt wird.
     
    6. Laserbearbeitungsvorrichtung (1) nach Anspruch 1, bei der der gemeinsame Teil (49), der die Laserbearbeitung zum Schneiden des Schutzfilms (35) erfordert, ein Teil ist, an dem eine Stiftschraube (47) durch Schweißen befestigt ist.
     
    7. Laserbearbeitungsvorrichtung (1) nach Anspruch 3, bei der die Bearbeitungsinformationen zusätzlich zu dem Bearbeitungsprogramm Informationen enthalten, die zur Bearbeitung erforderlich sind, wie etwa das Material, die Bearbeitungsabmessungen und 3D-Modellinformationen eines zu bearbeitenden Werkstücks (W), wie auch Bearbeitungsinformationen nach der Laserbearbeitung des Werkstücks (W), wie etwa Schweißeinstellung und Einstellung der Stiftschraubenanbringung sowie Informationen zu dem am Werkstück (W) angebrachten Schutzfilm (35), wobei die Informationen, die den Schutzfilm (35) betreffen, den Typ des Schutzfilms (35) einschließen.
     
    8. Laserbearbeitungsverfahren zum Ausführen einer Laserbearbeitung an einem Werkstück (W), das mit einem Schutzfilm (35) versehen ist, gekennzeichnet durch Bereitstellen einer Steuervorrichtung (7), die aus einem Computer besteht, der über eine CPU (27), einen ROM (23) und einen RAM (25) verfügt, die beide mit der CPU (27) verbunden sind, wobei die Steuervorrichtung (7) die folgenden Schritte ausführt:

    einen Schritt des Bestimmens, ob es einen gemeinsamen Teil (37, 39, 41, 49) gibt, der eine Laserbearbeitung erfordert, um den Schutzfilm (35) zu schneiden, auf der Basis der Bearbeitungsinformationen einschließlich einem Verarbeitungsprogramm, wobei der gemeinsame Teil (37, 39, 41, 49) ein Teil (37, 41, 49) des Werkstücks (W) ist, bei dem bei einem Bearbeitungsvorgang des Werkstücks (W) nach der Laserbearbeitung eine andere Komponente mit dem Werkstück (W) in Kontakt gelangt oder ein Teil (39) des Werkstücks (W) ist, bei dem bei dem Bearbeitungsvorgang des Werkstücks (W) nach der Laserbearbeitung ein anderer Teil des Werkstücks (W) in Kontakt mit dem Werkstück (W) kommt, und

    einen Schritt des Hinzufügens eines Laserbearbeitungsvorgangs für den gemeinsamen Teil (37, 39, 41, 49) zu dem Bearbeitungsprogramm, bei dem die Laserbearbeitung den Schutzfilm (35) schneiden muss, wenn der gemeinsame Teil (37, 39, 41, 49) vorhanden ist, für die die Laserbearbeitung erforderlich ist, um den Schutzfilm (35) zu schneiden.


     
    9. Laserbearbeitungsverfahren nach Anspruch 8, bei dem, wenn der gemeinsame Teil (41), der die Laserbearbeitung zum Schneiden des Schutzfilms (35) erfordert, ein gemeinsamer Teil (41) ist, an dem geschweißt wird, die Form (W3b) des gemeinsamen Teils (41), bei dem die Laserbearbeitung zum Schneiden des Schutzfilms (35) erforderlich ist, gemäß einem Wärmediffusionsbereich (L, L1, L2) von einer Schweißnaht (45) eingestellt wird.
     
    10. Laserbearbeitungsverfahren nach Anspruch 9, bei dem, wenn der gemeinsame Teil (41), der die Laserbearbeitung zum Schneiden des Schutzfilms (35) erfordert, ein gemeinsamer Teil (41) ist, an dem geschweißt wird, die Form (W3a) des gemeinsamen Teils (41), bei dem die Laserbearbeitung zum Schneiden des Schutzfilms (35) erforderlich ist, gemäß einer Bestrahlungsrichtung eines Laserstrahls von einem Schweißkopf (43) geändert wird.
     


    Revendications

    1. Dispositif de traitement laser (1) pour effectuer un traitement laser sur une pièce à usiner (W) à laquelle est fixé un film protecteur (35), comprenant :

    un dispositif de commande (7) constitué d'un ordinateur ayant une CPU (27) à laquelle une mémoire ROM (23) et une mémoire RAM (25) sont connectées ;

    un oscillateur laser (3), de sorte que l'oscillateur laser fait osciller un faisceau laser en réponse à une instruction provenant du dispositif de commande (7) ;

    étant caractérisé par

    un serveur de données externe (9) connecté à la CPU (27), de sorte que le dispositif de commande (7) est approvisionné en informations de traitement comprenant un programme de traitement à partir du serveur de données externe (9),

    et caractérisé en outre en ce que le dispositif de commande (7) est configuré pour déterminer, sur la base des informations de traitement comprenant le programme de traitement, s'il existe ou non une partie commune (37, 39, 41, 49) qui nécessite un traitement laser pour couper le film protecteur (35), la partie commune (37, 39, 41, 49) étant une partie (37, 41, 49) de la pièce à usiner (W) où, lors du processus de traitement de la pièce à usiner (W) après traitement laser, un composant différent entre en contact avec la pièce à usiner (W) ou une partie (39) de la pièce à usiner (W) où, lors du processus de traitement de la pièce à usiner (W) après traitement laser, une autre partie de la pièce à usiner (W) entre en contact avec la pièce à usiner (W), et pour ajouter un processus de traitement laser pour la partie commune (37, 39, 41, 49) qui nécessite le traitement laser pour couper le film protecteur (35) au programme de traitement, lorsqu'il existe la partie commune (37, 39, 41, 49) qui nécessite le traitement laser pour couper le film protecteur (35).


     
    2. Dispositif de traitement laser (1) selon la revendication 1, dans lequel le traitement laser pour couper le film protecteur (35) est un traitement de marquage laser.
     
    3. Dispositif de traitement laser (1) selon la revendication 1, dans lequel la partie commune (37) qui nécessite le traitement laser pour couper le film protecteur (35) est une partie à laquelle il est programmé de fixer un autre composant (33).
     
    4. Dispositif de traitement laser (1) selon la revendication 1, dans lequel la partie commune (39) qui nécessite le traitement laser pour couper le film protecteur (35) est une partie sur laquelle un pliage en ourlet est effectué.
     
    5. Dispositif de traitement laser (1) selon la revendication 1, dans lequel la partie commune (41) qui nécessite le traitement laser pour couper le film protecteur (35) est une partie sur laquelle un soudage est effectué.
     
    6. Dispositif de traitement laser (1) selon la revendication 1, dans lequel la partie commune (49) qui nécessite le traitement laser pour couper le film protecteur (35) est une partie à laquelle un goujon (47) est fixé par soudage.
     
    7. Dispositif de traitement laser (1) selon la revendication 3, dans lequel les informations de traitement comprennent, en plus du programme de traitement, des informations nécessaires au traitement telles que le matériau, les dimensions de traitement, et les informations de modèle 3D d'une pièce à usiner (W) à traiter, ainsi que des informations de processus de traitement après traitement laser de la pièce à usiner (W) telles qu'un réglage de soudage et réglage de fixation de goujon et des informations concernant le film protecteur (35) fixé à la pièce à usiner (W), les informations concernant le film protecteur (35) comprenant le type du film protecteur (35).
     
    8. Procédé de traitement laser pour effectuer un traitement laser sur une pièce à usiner (W) à la quelle est fixé le film protecteur (35), caractérisé par la fourniture d'un dispositif de commande (7) constitué d'un ordinateur ayant une CPU (27), une ROM (23) et une RAM (25), les deux étant connectées à la CPU (27), le dispositif de commande (7) réalisant les étapes suivantes :

    une étape pour déterminer, sur la base d'informations de traitement comprenant un programme de traitement, s'il existe ou non une partie commune (37, 39, 41, 49) qui nécessite un traitement laser pour couper le film protecteur (35), la partie commune (37, 39, 41, 49) étant une partie (37, 41, 49) de la pièce à usiner (W) où, lors d'un processus de traitement de la pièce à usiner (W) après traitement laser, un composant différent entre en contact avec la pièce à usiner (W) ou une partie (39) de la pièce à usiner (W) où, lors du processus de traitement de la pièce à usiner (W) après traitement laser, une autre partie de la pièce à usiner (W) entre en contact avec la pièce à usiner (W), et

    une étape pour ajouter au programme de traitement un processus de traitement laser pour la partie commune (37, 39, 41, 49) qui nécessite le traitement laser pour couper le film protecteur (35) lorsqu'il existe la partie commune (37, 39, 41, 49) qui nécessite le traitement laser pour couper le film protecteur (35).


     
    9. Procédé de traitement laser selon la revendication 8, dans lequel lorsque la partie commune (41) qui nécessite le traitement laser pour couper le film protecteur (35) est une partie commune (41) sur laquelle un soudage est effectué, la forme (W3b) de la partie commune (41) qui nécessite le traitement laser pour couper le film protecteur (35) est ajustée en fonction d'une portée de diffusion de chaleur (L, L1, L2) à partir d'une ligne de soudure (45).
     
    10. Procédé de traitement laser selon la revendication 9, dans lequel lorsque la partie commune (41) qui nécessite le traitement laser pour couper le film protecteur (35) est une partie commune (41) sur laquelle un soudage est effectué, la forme (W3a) de la partie commune (41) qui nécessite le traitement laser pour couper le film protecteur (35) est modifiée en fonction d'une direction d'irradiation d'un faisceau laser provenant d'une tête de soudage (43).
     




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    Cited references

    REFERENCES CITED IN THE DESCRIPTION



    This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

    Patent documents cited in the description