(19)
(11)EP 3 462 816 B1

(12)EUROPEAN PATENT SPECIFICATION

(45)Mention of the grant of the patent:
17.06.2020 Bulletin 2020/25

(21)Application number: 18196543.5

(22)Date of filing:  25.09.2018
(51)Int. Cl.: 
H05B 6/12  (2006.01)

(54)

SUPPORT STRUCTURE FOR OBJECT TO BE HEATED

TRAGSTRUKTUR FÜR EIN ZU ERWÄRMENDES OBJEKT

STRUCTURE DE SUPPORT POUR UN OBJET À CHAUFFER


(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 29.09.2017 KR 20170128282

(43)Date of publication of application:
03.04.2019 Bulletin 2019/14

(73)Proprietor: LG Electronics Inc.
Yeongdeungpo-gu Seoul 07336 (KR)

(72)Inventors:
  • MOON, Hyunwook
    Seoul 08592 (KR)
  • KIM, Eui Sung
    Seoul 08592 (KR)
  • PARK, Byeong Wook
    Seoul 08592 (KR)
  • LEE, Jae-Woo
    Seoul 08592 (KR)

(74)Representative: Vossius & Partner Patentanwälte Rechtsanwälte mbB 
Siebertstrasse 3
81675 München
81675 München (DE)


(56)References cited: : 
EP-A1- 2 408 261
DE-A1-102010 020 189
WO-A1-2013/103939
JP-A- H06 338 382
  
      
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).


    Description


    [0001] This application relates to a support structure that is configured to be driven by a working coil provided in an induction heating device to heat an object.

    [0002] Cooking devices may use various methods to heat food. For example, a gas range uses gas as fuel. In some examples, cooking devices may heat an object such as a cooking vessel or a pot, for example, using electricity without using gas.

    [0003] A method of heating an object using electricity may be divided into a resistive heating method and an induction heating method. In the electrical resistive method, heat may be generated based on current flowing through a non-metallic heating element such as silicon carbide or a metal resistance wire. In this method, heat may be transmitted to the object through a radiation or conduction to heat the object. In the induction heating method, an eddy current may be generated in the object made of metal based on a high-frequency power of a predetermined magnitude applied to the coil. In this method, the loaded object may be heated by the eddy current generated based on magnetic field around the working coil.

    [0004] An induction heating device is a heating device that uses the induction heating method.

    [0005] In some cases, the induction heating device may include a flat top plate. In such cases, it may be difficult to heat an object such as a wok that has a concave lower surface. In some cases, a large resonance current may be necessary to heat the object.

    [0006] FIG. 1 is a schematic view explaining an example of an induction heating device in related art. FIG. 2 is a schematic view explaining another example of an induction heating device in related art.

    [0007] In the example shown in FIG. 1, a top plate TB1 of an induction heating device 10 is concavely formed in a wok shape to heat an object such as a wok.

    [0008] In some cases, when other cooking vessels having a flat shape are to be heated, a cup-shaped jig 20 that has a concave lower surface may provide a top plate TB2. The cup-shaped jig 20 may include repeating coils MC1 and MC2.

    [0009] In some cases, the jig 20 may have a considerable size and weight, which may cause inconvenience for storage and transportation of the jig 20. The jig 20 does not include a capacitor in the jig 20, which may make it difficult to heat various cooking vessels as intended.

    [0010] In the example shown in FIG. 2, an induction heating device 30 may be used to heat an object placed on a flat top plate TB without a support structure 40. In the case of heating an object such as a wok, the support structure 40 may be placed on the top plate TB. The support structure 40 may include repeating coils MC1 and MC2 inside thereof.

    [0011] In some cases, a heating efficiency of the support structure 40 may be degraded due to the distance between the object and the working coil WC in the induction heating device 30 and due to a resonance point change of the repeating coils MC1 and MC2 inside of the support structure 40. The support structure 40 does not include a capacitor in the support structure 40, which may make it difficult to heat various cooking vessels as intended.

    [0012] WO 2013/103939 A1 relates to wireless power transfer, and more particularly to systems for transferring power from an inductive power supply.

    [0013] DE 10 2010 020189 A1 relates to a heating device for use in induction hob to heat cookware element, i.e. a wok, that has an upper induction coil producing induced current in the cookware element and connected to a lower induction coil, where coils are of different forms.

    [0014] The present invention is defined by the independent claim. The dependent claims relate to further aspects of the invention.

    [0015] One object of this application is to provide a support structure of an object to be heated that efficiently transmits an output of an induction heating device to the object.

    [0016] Another object of this application is to provide a support structure of an object to be heated that improves a temperature control efficiency of the object through an associated driving with an induction heating device.

    [0017] The objects of this application are not limited to the above-mentioned objects, and the other objects and the advantages of this application, which are not mentioned, can be understood by the following description, and more clearly understood by the implementations of this application. It will be also readily seen that the objects and the advantages of this application may be realized by means indicated in the patent claims and a combination thereof.

    [0018] According to one aspect of the subject matter described in this application, a support structure is disclosed for an induction heating device that includes a working coil configured to heat an object. The support structure includes: a housing including an upper surface that is recessed downward and that is configured to seat the object; a repeating coil that is located inside of the housing, that is configured to generate magnetic induction or magnetic resonance with the working coil, and that is configured to heat the object on the upper surface of the housing based on magnetic induction or magnetic resonance with the working coil; and a compensation capacitor located inside of the housing and connected to the repeating coil, where the compensation capacitor is configured to control output of the repeating coil.

    [0019] Implementations according to this aspect may include one or more of the following features. For example, the repeating coil may be arranged vertically between the working coil and a lowermost end of the object. In some examples where the induction heating device further includes a resonance capacitor connected to the working coil, a capacitance value of the compensation capacitor may be less than half of a capacitance value of the resonance capacitor. In some examples, the support structure may further include a temperature sensor located inside of the housing and configured to sense a temperature of the object on the upper surface of the housing, and a communication module that is configured to wirelessly communicate with the temperature sensor and the induction heating device, that is configured to receive information regarding the temperature of the object from the temperature sensor, and that is configured to provide the information to the induction heating device.

    [0020] In some examples, the temperature sensor may be arranged at a central region of the housing, and the housing may further include a lower surface that is spaced apart from the upper surface, where a distance between the upper surface and the lower surface of the housing decreases toward the central region of the housing. In some examples, the repeating coil is configured to supply, to the temperature sensor and to the communication module, power generated through the magnetic induction or the magnetic resonance with the working coil.

    [0021] In some implementations, the upper surface of the housing includes a first horizontal portion that extends in a horizontal direction with respect to a lower surface of the housing, a curved surface portion that has a first end connected to an end of the first horizontal portion and that is curved downward to the lower surface of the housing, a vertical portion that extends from a second end of the curved surface portion in a vertical direction with respect to the lower surface of the housing, and a second horizontal portion that extends from an end of the vertical portion in the horizontal direction with respect to the lower surface of the housing.

    [0022] In some examples, the support structure may further include a temperature sensor that is configured to sense a temperature of the object on the upper surface of the housing. The temperature sensor and the repeating coil may be arranged between the second horizontal portion and the lower surface of the housing. The temperature sensor is provided at a central region inside of the housing and is spaced apart from the repeating coil by a predetermined distance in a radial direction of the repeating coil.

    [0023] In some examples, at least a portion of the second horizontal portion is configured to be spaced apart from the object in a state in which the curved surface portion contacts a bottom surface of the object. In some examples, a vertical distance between the first end of the curved surface portion and the second end of the curved surface portion is greater than a vertical distance between the second end of the curved surface portion and the second horizontal portion.

    [0024] In some implementations, the upper surface of the housing has a concave shape. In some examples, the repeating coil is located vertically above the working coil. The upper surface of the housing may be configured to contact a lowermost end of the object vertically above the repeating coil. In some examples, the temperature sensor is arranged at the central region of the housing at a position that defines a minimum distance between the upper surface and the lower surface of the housing. In some examples, the repeating coil is arranged radially outward of the temperature sensor.

    [0025] In some implementations, the housing further includes a lower surface that has a planar shape and that is configured to contact a top plate of the induction heating device, the top plate being located vertically above the working coil. In some examples, the repeating coil is located in a space defined between the upper surface of the housing and the lower surface of the housing. The compensation capacitor may be located in the space defined between the upper surface of the housing and the lower surface of the housing. The compensation capacitor may be located radially outward of the repeating coil.

    [0026] In some implementations, the support structure may further include a temperature sensor that is located in the space defined between the upper surface of the housing and the lower surface of the housing, where the temperature sensor is configured to sense a temperature of the object on the upper surface of the housing, and a communication module that is located in the space defined between the upper surface of the housing and the lower surface of the housing, where the communication module is configured to receive information regarding the temperature of the object from the temperature sensor and to provide the information to the induction heating device. The repeating coil may be arranged radially outward of the temperature sensor, and the communication module may be arranged radially outward of the repeating coil.

    [0027] The support structure may efficiently transmit the output of the induction heating device to an object such as a wok. Accordingly, the user can heat an object in a special shape such as a wok as well as other cooking vessels as intended, and furthermore, it is possible to shorten the cooking time when cooking by using the object to be heated such as the wok.

    [0028] Further, the support structure may improve the temperature control efficiency of the object through the associated driving with the induction heating device. In some examples, a fixed temperature control may be possible to cook using the object, which may improve a taste of cooking.

    [0029] Hereafter, a specific effect of this application, in addition to the above-mentioned effect, will be described together while describing a specific matter for implementing this application.

    FIG. 1 is a schematic view explaining an example of an induction heating device in related art.

    FIG. 2 is a schematic view explaining another example of an induction heating device in related art.

    FIG. 3 is a perspective view showing an example support structure according to the present disclosure.

    FIG. 4 is a cross-sectional view showing the support structure of FIG. 3.

    FIG. 5 is a schematic view showing an example repeating coil of the support structure of FIG. 4 and an example position of the repeating coil.

    FIG. 6 is a schematic view illustrating an example control flow and an example power flow between the support structure of FIG. 3 and an example object.



    [0030] Hereinafter, the example implementations of this application will be described in detail with reference to the accompanying drawings. In the drawings, the like reference numerals are used to indicate the same or similar components.

    [0031] Hereinafter, a support structure for an object in accordance with an exemplary implementation of this application will be described.

    [0032] FIG. 3 is a perspective view explaining an example support structure for an object that is to be heated. FIG. 4 is a cross-sectional view showing the support structure of FIG. 3. FIG. 5 is a schematic view showing an example position of a repeating coil of FIG. 4. FIG. 6 is a schematic view showing an example control flow and an example power flow between the support structure of FIG. 3 and the object.

    [0033] In some implementations, a support structure 1 is driven by a working coil and associated with the working coil (WC in FIG. 6) provided in an induction heating device (1000 in FIG. 6), and a specific matter thereof will be described later.

    [0034] Referring to FIGS. 3 to 5, the support structure 1 includes a housing 100, a repeating coil 150, a compensation capacitor 200, a temperature sensor 250, and a communication module 300.

    [0035] An upper surface 100a of the housing 100 can be concavely recessed downward and an object to be heated W can be arranged in the upper surface 100a of the housing 100.

    [0036] For example, the housing 100 may include an upper surface 100a, a side surface 100b, and a lower surface 100c. In an inside the housing 100, the repeating coil 150, the compensation capacitor 200, the temperature sensor 250, and the communication module 300 may be included.

    [0037] Here, the upper surface 100a may be concavely formed downward so that the object W that to be heated. For example, the object W may be a cooking vessel such as a wok that is be stably supported as shown in FIG. 5.

    [0038] In some examples, an upper surface 100a of a housing 100 may include a first horizontal portion HP1, a curved portion CP, a vertical portion VP, and a second horizontal portion HP2.

    [0039] For example, the first horizontal portion HP1 is connected to the side surface 100b of the housing 100 and may be formed to extend in a horizontal direction. The curved portion CP has one end connected to the first horizontal portion HP1, and may be formed to have a curved surface. In addition, the vertical portion VP has one end connected to the other end of the curved portion CP and may be formed to extend in a vertical direction (that is, a direction orthogonal to a horizontal direction). The second horizontal portion HP2 has one end connected to the other end of the vertical portion VP, and may be formed to extend in a horizontal direction (that is, a direction parallel to the first horizontal portion HP1).

    [0040] A repeating coil 150 is provided inside the housing 100 and can be driven through a magnetic induction (i.e., an electromagnetic induction) or a magnetic resonance (i.e., a magnetic resonance) with a working coil WC provided in an induction heating device.

    [0041] In some implementations, the working coil WC may correspond to a primary coil that transmits a wireless power, and the repeating coil 150 may correspond to a secondary coil that receives a wireless power. In the same or other implementations, the repeating coil 150 can be driven by receiving a power through the magnetic induction or the magnetic resonance with the working coil WC.

    [0042] In some implementations, as shown in FIG. 5, the repeating coil 150 may be arranged in an area between an intermediate point between the working coil WC and a lowermost end of an object to be heated W. For example, the repeating coil 150 may be arranged in an area A between a lower end of a top plate TB of the induction heating device and a lowermost end of an object W. In some cases, the area A has an area having the same size as an area B between the lower end of the top plate TB of the induction heating device and the working coil WC.

    [0043] In some examples, as the distance between the repeating coil 150 and the working coil WC is closer, an energy transfer performance between two coils (that is, a coupling coefficient between the repeating coil 150 and the working coil WC becomes similar to a coupling coefficient between the working coil WC and the object W, and thus, a function of the repeating coil 150 can be degraded, which is an intermediate medium of a power transmission) can be degraded. Thus, in order to prevent this, the repeating coil 150 is arranged at the area A.

    [0044] In addition, as mentioned above, the repeating coil 150 is driven through the magnetic induction or the magnetic resonance with the working coil WC, and thus, it is possible to supply the power generated based on a magnetic flux generated when driving the working coil WC to a temperature sensor 250 and a communication module 300.

    [0045] In some implementations, the repeating coil 150 may be arranged between the second horizontal portion HP2 and a lower surface 100c of the housing 100 and may be arranged so as to be spaced apart from the temperature sensor 250 in a horizontal direction by a predetermined space.

    [0046] A compensation capacitor 200 may be provided inside a housing 100 and may be connected to the repeating coil 150 in order to control an output of a repeating coil 150.

    [0047] In some implementations, the compensation capacitor 200 may be provided inside the housing 100 by being connected to the repeating coil 150 so that it is possible to efficiently transmit an output of the induction heating device to be object to be heated.

    [0048] In some cases, when a capacitance value of the compensation capacitor 200 is a half or more of a capacitance value of a resonance capacitor connected to the working coil WC, it may be difficult to effectively transmit the output of the induction heating device to the object to be heated. In such cases, the magnitude of a resonance current supplied to the working coil WC may have to be increased to provide an expected output to the object W.

    [0049] In some implementations, the capacitance value of the compensation capacitor 200 is less than a half (1/2) of the capacitance value of the resonance capacitor connected to the working coil WC to effectively transmit the output of the induction heating device to the object to be heated.

    [0050] In some implementations, the capacitance value of the compensation capacitor 200 may be set to be larger than or equal to a half (1/2) of the capacitance value of the resonance capacitor connected to the working coil WC. However, for convenience of explanation, it will be described by having an example that the capacitance value of the compensation capacitor 200 has a value less than a half 1/2 of the capacitance value of the resonance capacitor connected to the working coil WC.

    [0051] The temperature sensor 250 may be provided inside the housing 100 to sense a temperature of the object W arranged on the upper surface 100a of the housing 100.

    [0052] For example, the temperature sensor 250 may be arranged at the center in the inside of the housing 100.

    [0053] Here, an interval between the upper surface 100a and the lower surface 100c of the housing 100 is the narrowest at the center in the inside of the housing 100, so that the temperature sensor 250 can sense the temperature of the object W at a position adjacent to the object W.

    [0054] In addition, the temperature sensor 250 may be arranged between the second horizontal portion HP2 and a lower surface 100c of a housing 100 and may be provided at the center in the inside of the housing 100 so as to be spaced apart from the repeating coil 150 in the horizontal direction by the predetermined space.

    [0055] In some implementations, the temperature sensor 250 can provide information on the temperature of the object W to the communication module 300.

    [0056] The communication module 300 may receive information on the temperature of the object W, which is sensed by the temperature sensor 250, and may provide information to the induction heating device 1000 (see FIG. 6) through a wireless communication.

    [0057] In some implementations, the communication module 300 may provide information on the temperature of the object W to the induction heating device 1000 through the wireless communication such as Bluetooth, Zigbee, and WiFi, etc.

    [0058] Here, referring to FIG. 6, a control and a power flow of an object to be heated are shown.

    [0059] In some implementations, a temperature sensor 250 may sense a temperature of an object to be heated W and may provide information on a temperature to a communication module 300. In addition, the communication module 300 can provide information on the temperature of the object W supplied from the temperature sensor 250 to an induction heating device 1000 through a wireless communication.

    [0060] In some implementations, the induction heating device 1000 can control an output of a working coil WC (e.g., a frequency, a phase, and a magnitude of a resonance current provided to a working coil WC) based on information on the temperature of the object W provided from the communication module 300.

    [0061] That is, a support structure 1 and the induction heating device 1000 are driven associated with each other through the communication module 300 so that a temperature control efficiency of the object to be heated can be improved.

    [0062] In some implementations, a repeating coil 150 receives or generates power wirelessly through a magnetic induction or a magnetic resonance with the working coil WC, and generates an eddy current to the object W by using a magnetic field generated by a received power to heat the object to be heated.

    [0063] The repeating coil 150 can provide the power generated through the magnetic induction or the magnetic resonance with the working coil WC to a component (for example, the temperature sensor 250 and the communication module 300, etc.) inside the housing 100.

    [0064] As mentioned above, the support structure 1 can efficiently transmit an output of the induction heating device to the object to be heated. The user can heat an object to be heated in a special shape such as a wok as well as a general cooking vessel as intended, and furthermore, it is possible to shorten the cooking time when cooking by using the object to be cooked such as a wok.

    [0065] In addition, the support structure 1 can improve a temperature control efficiency of the object to be heated through an associated driving with the induction heating device. Furthermore, when cooking by using the object to be heated, a fixed temperature control is possible, so that the taste of food can be improved.

    [0066] In some implementations, when the user wishes to heat the general cooking vessel, the general cooking vessel is placed on the top plate (TB of FIG. 5) of the induction heating device without the support structure 1 and heated. In addition, when the user wishes to heat the wok, the wok is placed on the support structure 1 and heated, after arranging the support structure 1 on the top plate (TB of FIG. 5) of the induction heating device. Of course, the user may place the general cooking vessel on the support structure 1 and heat it.

    [0067] Since various substitutions, changes, and modifications can be made within the scope that does not deviate the technical idea of this application for those skilled in the art to which this application pertains, the above-mentioned application is not limited by the above-mentioned implementations and the accompanying drawings.


    Claims

    1. A system, comprising:

    an induction heating device (1000) comprising a working coil (WC) and a resonance capacitor connected to the working coil (WC); and

    a support structure (1) for an object to be heated that is driven by being associated with the working coil (WC) provided in the induction heating device (1000),

    wherein the support structure (1) comprises:

    a housing (100) comprising an upper surface (100a) that is concavely formed downward and an object to be heated is arranged on the upper surface (100a);

    a repeating coil (150) that is provided inside the housing (100) and driven through a magnetic induction or a magnetic resonance with the working coil (WC); and

    a compensation capacitor (200) that is provided inside the housing (100) and connected to the repeating coil (150) for controlling an output of the repeating coil (150),

    characterised in that a capacitance value of the compensation capacitor (200) comprises a value less than a half of a capacitance value of the resonance capacitor connected to the working coil (WC).


     
    2. The system of claim 1, wherein the support structure (1) further comprises:

    a temperature sensor (250) that is provided in the housing (100) and configured to sense a temperature of the object to be heated arranged on the upper surface (100a) of the housing (100); and

    a communication module (300) configured to receive information on the temperature of the object to be heated from the temperature sensor (250) and to provide information to the induction heating device (1000) through a wireless communication.


     
    3. The system of claim 2,
    wherein the temperature sensor (250) is arranged at the center of the inside of the housing (100), and
    wherein an interval between the upper surface (100a) and a lower surface (100c) of the housing (100) is narrowest at the center of an inside of the housing (100).
     
    4. The system of claim 2 or 3, wherein the repeating coil (150) is configured to supply a power generated through the magnetic induction or the magnetic resonance with the working coil (WC) to the temperature sensor (250) and the communication module (300).
     
    5. The system of any one of claims 1 to 4,
    wherein the upper surface (100a) of the housing (100) comprises:

    a first horizontal portion (HP1),

    a curved surface portion (CP) with one end connected to the first horizontal portion (HP1),

    a vertical portion (VP) that the one end is connected to the other end of the curved surface portion (CP), and

    a second horizontal portion (HP2) with one end connected to the other end of the vertical portion (VP).


     
    6. The system of claim 5, wherein the support structure (1) further comprises the temperature sensor (250) that is configured to sense the temperature of the object to be heated arranged in the upper surface (100a) of the housing (100),
    wherein the temperature sensor (250) and the repeating coil (150) are arranged between the second horizontal portion (HP2) and a lower surface (100c) of the housing (100), and
    wherein the temperature sensor (250) is provided at the center inside the housing (100) so as to be spaced apart from the repeating coil (150) by a predetermine space.
     
    7. The system of claim 5 or 6, wherein the repeating coil (150) is arranged in an area from an intermediate point between the working coil (WC) and the second horizontal portion (HP2) to the second horizontal portion (HP2).
     


    Ansprüche

    1. System, mit:

    einer Induktionsheizvorrichtung (1000), die eine Arbeitsspule (WC) und einen mit der Arbeitsspule (WC) verbundenen Resonanzkondensator aufweist; und

    einer Stützstruktur (1) für ein zu erwärmendes Objekt, das betrieben werden soll, indem es mit der in der Induktionsheizvorrichtung (1000) vorgesehenen Arbeitsspule (WC) verbunden ist,

    wobei die Stützstruktur (1) aufweist:

    ein Gehäuse (100), das eine Oberseite (100a) aufweist, die konkav nach unten ausgebildet ist, wobei ein zu erwärmendes Objekt auf der Oberseite (100a) angeordnet ist;

    einer Übertragerspule (150), die innerhalb des Gehäuses (100) vorgesehen ist und durch eine magnetische Induktion oder eine magnetische Resonanz mit der Arbeitsspule (WC) betrieben wird; und

    einem Kompensationskondensator (200), der innerhalb des Gehäuses (100) vorgesehen und mit der Übertragerspule (150) zum Steuern einer Ausgangsleistung der Übertragerspule (150) verbunden ist,

    dadurch gekennzeichnet, dass

    ein Kapazitätswert des Kompensationskondensators (200) einen Wert aufweist, der kleiner als die Hälfte eines Kapazitätswerts des mit der Arbeitsspule (WC) verbundenen Resonanzkondensators ist.


     
    2. System nach Anspruch 1, wobei die Stützstruktur (1) ferner aufweist:

    einen Temperatursensor (250), der im Gehäuse (100) vorgesehen und konfiguriert ist, eine Temperatur des zu erwärmende Objekts zu erfassen, das auf der Oberseite (100a) des Gehäuses (100) angeordnet ist; und

    ein Kommunikationsmodul (300), das konfiguriert ist, Informationen über die Temperatur des zu erwärmende Objekts vom Temperatursensor (250) zu empfangen und Informationen an die Induktionsheizvorrichtung (1000) durch eine drahtlose Kommunikation zu liefern.


     
    3. System nach Anspruch 2,
    wobei der Temperatursensor (250) in der Mitte des Inneren des Gehäuses (100) angeordnet ist, und
    wobei ein Abstand zwischen der Oberseite (100a) und einer Unterseite (100c) des Gehäuses (100) in der Mitte des Inneren des Gehäuses (100) am engsten ist.
     
    4. System nach Anspruch 2 oder 3, wobei die Übertragerspule (150) konfiguriert ist, einen durch die magnetische Induktion oder die magnetische Resonanz mit der Arbeitsspule (WC) erzeugten Strom an den Temperatursensor (250) und das Kommunikationsmodul (300) zu liefern.
     
    5. System nach einem der Ansprüche 1 bis 4,
    wobei die Oberseite (100a) des Gehäuses (100) aufweist:

    einen ersten horizontalen Abschnitt (HP1),

    einen gekrümmten Flächenabschnitt (CP), von dem ein Ende mit dem ersten horizontalen Abschnitt (HP1) verbunden ist,

    einen vertikalen Abschnitt (VP), von dem ein Ende mit dem anderen Ende des gekrümmten Flächenabschnitts (CP) verbunden ist, und

    einen zweiten horizontalen Abschnitt (HP2), von dem ein Ende mit dem anderen Ende des vertikalen Abschnitts (VP) verbunden ist.


     
    6. System nach Anspruch 5, wobei die Stützstruktur (1) ferner den Temperatursensor (250) aufweist, der konfiguriert ist, die Temperatur des zu erwärmenden Objekts zu erfassen, das auf der Oberseite (100a) des Gehäuses (100) angeordnet ist,
    wobei der Temperatursensor (250) und die Übertragerspule (150) zwischen dem zweiten horizontalen Abschnitt (HP2) und einer Unterseite (100c) des Gehäuses (100) angeordnet sind, und
    wobei der Temperatursensor (250) in der Mitte des Inneren des Gehäuses (100) so vorgesehen ist, dass er von der Übertragerspule (150) durch einen vorgegebenen Abstand beabstandet ist.
     
    7. System nach Anspruch 5 oder 6, wobei die Übertragerspule (150) in einem Bereich von einem Zwischenpunkt zwischen der Arbeitsspule (WC) und dem zweiten horizontalen Abschnitt (HP2) zum zweiten horizontalen Abschnitt (HP2) angeordnet ist.
     


    Revendications

    1. Système, comprenant :

    un dispositif de chauffage par induction (1000) comprenant une bobine de travail (WC) et un condensateur de résonance relié à la bobine de travail (WC) ; et

    une structure de support (1) pour un objet à chauffer entraîné en étant associé à la bobine de travail (WC) prévue dans le dispositif de chauffage par induction (1000),

    où la structure de support (1) comprend :

    un boîtier (100) présentant une surface supérieure (100a) de forme concave vers le bas, un objet à chauffer étant disposé sur ladite surface supérieure (100a) ;

    une bobine de répétition (150) prévue à l'intérieur du boîtier (100) et entraînée par induction magnétique ou résonance magnétique avec la bobine de travail (WC) ; et

    un condensateur de compensation (200) prévu à l'intérieur du boîtier (100) et relié à la bobine de répétition (150) pour commander une sortie de la bobine de répétition (150),

    caractérisé

    en ce qu'une valeur de capacité du condensateur de compensation (200) comprend une valeur inférieure à la moitié d'une valeur de capacité du condensateur de résonance relié à la bobine de travail (WC).


     
    2. Système selon la revendication 1, où la structure de support (1) comprend en outre :

    un capteur de température (250) prévu dans le boîtier (100) et destiné à détecter la température de l'objet à chauffer disposé sur la surface supérieure (100a) du boîtier (100) ; et

    un module de communication (300) prévu pour recevoir du capteur de température (250) des informations sur la température de l'objet à chauffer et pour transmettre des informations au dispositif de chauffage par induction (1000) par communication sans fil.


     
    3. Système selon la revendication 2,
    où le capteur de température (250) est disposé centralement à l'intérieur du boîtier (100), et
    où un intervalle entre la surface supérieure (100a) et une surface inférieure (100c) du boîtier (100) est minimal au centre à l'intérieur du boîtier (100).
     
    4. Système selon la revendication 2 ou la revendication 3, où la bobine de répétition (150) est prévue pour le capteur de température (250) et le module de communication (300) en courant généré par induction magnétique ou résonance magnétique avec la bobine de travail (WC).
     
    5. Système selon l'une des revendications 1 à 4,
    où la surface supérieure (100a) du boîtier (100) comprend :

    une première partie horizontale (HP1),

    une partie de surface incurvée (CP) dont une extrémité est raccordée à la première partie horizontale (HP1),

    une partie verticale (VP) dont la première extrémité est raccordée à l'autre extrémité de la partie de surface incurvée (CP), et

    une deuxième partie horizontale (HP2) dont une extrémité est raccordée à l'autre extrémité de la partie verticale (VP).


     
    6. Système selon la revendication 5, où la structure de support (1) comprend en outre le capteur de température (250) prévu pour détecter la température de l'objet à chauffer disposé sur la surface supérieure (100a) du boîtier (100),
    où le capteur de température (250) et la bobine de répétition (150) sont disposés entre la deuxième partie horizontale (HP2) et une surface inférieure (100c) du boîtier (100), et
    où le capteur de température (250) est prévu centralement à l'intérieur du boîtier (100) de manière à être espacé d'un intervalle défini de la bobine de répétition (150).
     
    7. Système selon la revendication 5 ou la revendication 6, où la bobine de répétition (150) est disposée dans une zone allant d'un point intermédiaire entre la bobine de travail (WC) et la deuxième partie horizontale (HP2) à la deuxième partie horizontale (HP2).
     




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    REFERENCES CITED IN THE DESCRIPTION



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    Patent documents cited in the description