(19)
(11)EP 3 503 289 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
14.08.2019 Bulletin 2019/33

(43)Date of publication A2:
26.06.2019 Bulletin 2019/26

(21)Application number: 19150354.9

(22)Date of filing:  11.03.2014
(51)Int. Cl.: 
H01Q 1/22  (2006.01)
H01Q 9/40  (2006.01)
H01Q 1/38  (2006.01)
(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

(30)Priority: 13.03.2013 US 201313798557

(62)Application number of the earlier application in accordance with Art. 76 EPC:
14719910.3 / 2973846

(71)Applicant: Avery Dennison Corporation
Mentor, OH 44060 (US)

(72)Inventor:
  • Forster, Ian James
    Essex (GB)

(74)Representative: Müller-Boré & Partner Patentanwälte PartG mbB 
Friedenheimer Brücke 21
80639 München
80639 München (DE)

  


(54)RFID INLAY INCORPORATING A GROUND PLANE


(57) An RFID inlay is described. The RFID inlay comprises: a first substrate having a first conductive structure disposed thereon; a second substrate having a second conductive structure disposed thereon, the second conductive structure having a first portion and at least one second portion; and a dielectric layer disposed between the first conductive structure and the first portion of the second conductive structure; wherein the at least one second portion of the second conductive structure is capacitively coupled to the first conductive structure.