(19) | |
| (11) | EP 3 537 217 A3 |
(12) | EUROPEAN PATENT APPLICATION |
(88) | Date of publication A3: | | 27.11.2019 Bulletin 2019/48 |
(43) | Date of publication A2: | | 11.09.2019 Bulletin 2019/37 |
(22) | Date of filing: 07.12.2006 |
| (51) | International Patent Classification (IPC): |
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(84) | Designated Contracting States: | | AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
(30) | Priority: | 09.12.2005 JP 2005356717 10.04.2006 JP 2006107728 19.07.2006 JP 2006196856
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(62) | Application number of the earlier application in accordance with Art. 76 EPC: | | 06025353.1 / 1795960 |
(71) | Applicant: FUJIFILM Corporation | | Minato-ku
Tokyo (JP) |
| (72) | Inventors: | | - Kanda, Hiromi
Shizuoka (JP) - Kanna, Shinichi
Shizuoka (JP)
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(74) | Representative: Hoffmann Eitle | | Patent- und Rechtsanwälte PartmbB
Arabellastraße 30 81925 München 81925 München (DE) |
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(54) | POSITIVE RESIST COMPOSITION, RESIN USED FOR THE POSITIVE RESIST COMPOSITION, COMPOUND USED FOR SYNTHESIS OF THE RESIN AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION |
(57) A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.