(19)
(11)EP 3 537 217 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
27.11.2019 Bulletin 2019/48

(43)Date of publication A2:
11.09.2019 Bulletin 2019/37

(21)Application number: 19170084.8

(22)Date of filing:  07.12.2006
(51)International Patent Classification (IPC): 
G03F 7/004(2006.01)
G03F 7/20(2006.01)
G03F 7/30(2006.01)
C07C 69/653(2006.01)
G03F 7/039(2006.01)
G03F 7/075(2006.01)
G03F 7/32(2006.01)
(84)Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

(30)Priority: 09.12.2005 JP 2005356717
10.04.2006 JP 2006107728
19.07.2006 JP 2006196856

(62)Application number of the earlier application in accordance with Art. 76 EPC:
06025353.1 / 1795960

(71)Applicant: FUJIFILM Corporation
Minato-ku Tokyo (JP)

(72)Inventors:
  • Kanda, Hiromi
    Shizuoka (JP)
  • Kanna, Shinichi
    Shizuoka (JP)

(74)Representative: Hoffmann Eitle 
Patent- und Rechtsanwälte PartmbB Arabellastraße 30
81925 München
81925 München (DE)

  


(54)POSITIVE RESIST COMPOSITION, RESIN USED FOR THE POSITIVE RESIST COMPOSITION, COMPOUND USED FOR SYNTHESIS OF THE RESIN AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION


(57) A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.





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