(19)
(11)EP 3 595 421 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
06.05.2020 Bulletin 2020/19

(43)Date of publication A2:
15.01.2020 Bulletin 2020/03

(21)Application number: 19185611.1

(22)Date of filing:  10.07.2019
(51)Int. Cl.: 
H05K 7/20  (2006.01)
H04B 1/036  (2006.01)
H05K 9/00  (2006.01)
H05K 5/02  (2006.01)
(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30)Priority: 12.07.2018 US 201862696884 P

(71)Applicant: ARRIS Enterprises LLC
Suwanee, GA 30024 (US)

(72)Inventors:
  • DIEP, Justin
    San Diego, California 92129 (US)
  • HUANG, Chien-Cheng
    Poway, California 92064 (US)
  • HAUSMAN, John
    San Diego, California 92130 (US)
  • LIN, Hai
    San Diego, California 92130 (US)

(74)Representative: Openshaw & Co. 
8 Castle Street
Farnham, Surrey GU9 7HR
Farnham, Surrey GU9 7HR (GB)

  


(54)RAISED PATHWAY HEAT SINK


(57) Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.