(19)
(11)EP 3 650 698 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
22.07.2020 Bulletin 2020/30

(43)Date of publication A2:
13.05.2020 Bulletin 2020/20

(21)Application number: 19204849.4

(22)Date of filing:  23.10.2019
(51)International Patent Classification (IPC): 
F04B 43/04(2006.01)
F16K 99/00(2006.01)
F04B 53/10(2006.01)
F04B 45/047(2006.01)
(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
KH MA MD TN

(30)Priority: 07.11.2018 TW 107139569

(71)Applicant: Microjet Technology Co., Ltd
Hsinchu (TW)

(72)Inventors:
  • Mou, Hao-Jan
    Hsinchu, Taiwan, R.O.C. (TW)
  • Yu, Rong-Ho
    Hsinchu, Taiwan, R.O.C. (TW)
  • Chang, Cheng-Ming
    Hsinchu, Taiwan, R.O.C. (TW)
  • Tai, Hsien-Chung
    Hsinchu, Taiwan, R.O.C. (TW)
  • Liao, Wen-Hsiung
    Hsinchu, Taiwan, R.O.C. (TW)
  • Huang, Chi-Feng
    Hsinchu, Taiwan, R.O.C. (TW)
  • Han, Yung-Lung
    Hsinchu, Taiwan, R.O.C. (TW)
  • Kuo, Chun-Yi
    Hsinchu, Taiwan, R.O.C. (TW)

(74)Representative: Uexküll & Stolberg 
Partnerschaft von Patent- und Rechtsanwälten mbB Beselerstraße 4
22607 Hamburg
22607 Hamburg (DE)

  


(54)MICRO CHANNEL STRUCTURE


(57) A micro channel structure (100) includes a substrate (1a), a supporting layer (1c), a valve layer (1d), a second insulation layer (1e), a vibration layer (If) and a bonding-pad layer (1i). A flow channel (13a) is formed on the substrate (1a). A conductive part (12c) and a movable part (15d) are formed on the supporting layer (1c) and the valve layer (1d), respectively. A first chamber (R1) is formed at the interior of a base part (13d) and communicates to the hollow aperture (14d). A supporting part (13e) is formed on the second insulation layer (1e). A second chamber (R2) is formed at the interior of the supporting layer (1c) and communicates to the first chamber (R1) through the hollow aperture (14d). A suspension part (11f) is formed on the vibration layer (If). By providing driving power sources having different phases to the bonding-pad layer (1i), the suspension part (11f) moves upwardly and downwardly, and a relative displacement is generated between the movable part (15d) and the conductive part (12c), to achieve fluid transportation.







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