(19)
(11)EP 4 207 265 A3

(12)EUROPEAN PATENT APPLICATION

(88)Date of publication A3:
27.09.2023 Bulletin 2023/39

(43)Date of publication A2:
05.07.2023 Bulletin 2023/27

(21)Application number: 22205578.2

(22)Date of filing:  04.11.2022
(51)International Patent Classification (IPC): 
H01L 23/047(2006.01)
H01L 23/14(2006.01)
H01L 23/36(2006.01)
H01L 23/66(2006.01)
H01L 23/10(2006.01)
H01L 23/00(2006.01)
H01L 23/373(2006.01)
(52)Cooperative Patent Classification (CPC):
H01L 2224/04042; H01L 2224/73265; H01L 2924/1421; H01L 2224/32245; H01L 2224/32258; H01L 23/047; H01L 2224/291; H01L 23/10; H01L 2223/6655; H01L 2223/6611; H01L 2224/83493; H01L 2224/83447; H01L 2224/8382; H01L 24/83; H01L 2224/95; H01L 2224/48247; H01L 23/66; H01L 23/3736; H01L 23/4334; H01L 23/367; H01L 23/3735; H01L 24/42; H01L 23/49513; H01L 23/49562; H01L 23/49568; H01L 23/49575; H01L 23/49582; H01L 24/32
 
C-Sets:
  1. H01L 2224/73265, H01L 2224/32245, H01L 2224/48247, H01L 2924/00012;
  2. H01L 2224/291, H01L 2924/014, H01L 2924/00014;
  3. H01L 2224/95, H01L 2224/83;

(84)Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA
Designated Validation States:
KH MA MD TN

(30)Priority: 09.12.2021 US 202117546453

(71)Applicant: NXP USA, Inc.
Austin TX 78735 (US)

(72)Inventors:
  • Li, Lu
    5656 AG Eindhoven (NL)
  • Viswanathan, Lakshminarayan
    5656 AG Eindhoven (NL)
  • van Straten, Freek Egbert
    5656 AG Eindhoven (NL)

(74)Representative: Miles, John Richard 
NXP SEMICONDUCTORS Intellectual Property Group Abbey House 25 Clarendon Road
Redhill, Surrey RH1 1QZ
Redhill, Surrey RH1 1QZ (GB)

  


(54)RADIO FREQUENCY PACKAGES CONTAINING SUBSTRATES WITH COEFFICIENT OF THERMAL EXPANSION MATCHED MOUNT PADS AND ASSOCIATED FABRICATION METHODS


(57) Radio frequency (RF) packages containing substrates having coefficient of thermal expansion (CTE) matched mount pads are disclosed, as are methods for fabricating RF packages and substrates. In embodiments, the RF package contains a high thermal performance substrate including a metallic base structure, which has a frontside facing a first RF power die and a first die attach region on the frontside of the base structure. A first CTE matched mount pad is bonded to the metallic base structure and covers the first die attach region. The first CTE mount pad has a CTE greater than the CTE of RF power die and less than the CTE of the metallic base structure. An electrically-conductive bonding material attaches the RF power die to the first CTE matched mount pad, while RF circuitry integrated into first RF power die is electrically coupled to the metallic base structure through the mount pad.







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