Description     Claims  

US2006251986A1   [0006] 
US2003219677A1   [0006] 
JP4253058A   [0023] 
US6991888B   [0029] 
US20040265733A   [0029] 
US7358408B   [0029] 
US20050271974A   [0029] 
US20020061464A   [0029] 
US6274286B   [0032] 

Electrochemically Deposited Solder Bumps for Wafer-Level Packaging, Packaging/Assembly   [0008] 
Chemistry and Application of Phenolic Resins   [0022]