Description  Revendications  Dessins  Références citées 

US2009065932A1   [0004] 
WO2009115686A   [0046] 
US20110094789A   [0046] 

Investigation of Al2O3 barrier film properties made by atomic layer deposition onto fluorescent tris-(8-hydroxyquinoline) aluminium molecular films   [0005] 
Underfill material selection for flip chip technology   [0009] 
Characterization of a No-Flow Underfill Encapsulant During the Solder Reflow Process   [0010]