Description  Claims  Drawing  Cited references 

US5234529A   [0006] 
US20020023899A   [0007] 
US20140123895A   [0008] 
US20080283500A1   [0008] 
WO02072913A1   [0008] 
US20020179246A1   [0010] 
US20140134829A1   [0011] 
KR20040008882   [0012] 
WO0023633A   [0013] 

High Density Plasma Sources   [0002] 
Controlling roughness: from etching to nanotexturing and plasmadirected organization on organic and inorganic materials   [0004] 
Effect of Clamping Ring Materials and Chuck Temperature on the Formation of Silicon Nanograss in Deep RIE   [0009]