Abstract     Description     Claims     Drawing  

WO2012086639A   [0008] 

IMPROVEMENT IN TEMPERATURE CHARACTERISTICS OF PLATE WAVE RESONATOR USING ROTATED Y-CUT LiTaO3/SIN STRUCTURE   [0009] 
IEEE International Ultrasonics Symposium Proceedings   [0048] 
Room-temperature wafer bonding using argonbeam activation   [0070] 
Semiconductor Wafer Bonding: Science, Technology, and Applications V   [0070] 
Appl. Pysic. Lett   [0080] 
IEEE International Ultrasonics Symposium Proceedings   [0084] 
Modified Butterworth-Van Dyke Circuit for FBAR Resonators and Automated Measurement System   [0086]