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"EP2081085"; "EP 2081085"; "G03F 7/004"; "G03F 7/039"; "G03F 7/20"; "Positive resist compositions and patterning process"
1.4
2009-06-30T10:40:56+02:00
2010-08-28T21:03:30+02:00
2010-08-28T21:03:30+02:00
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EP-2081085-A1-20090722
Positive resist compositions and patterning process - European Patent Office - EP 2081085 A1
Positive resist compositions and patterning process - European Patent Office - EP 2081085 A1
EP2081085
EP 2081085
G03F 7/004
G03F 7/039
G03F 7/20
Positive resist compositions and patterning process
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units, represented by formula (1). The acid generator (B) is a specific sulfonium salt compound. When processed by lithography, the composition is improved in resolution and forms a pattern with a satisfactory mask fidelity and a minimal LER. [chem]Herein R is H or methyl, m is 1 or 2, and n is 1 or 2.
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units, represented by formula (1). The acid generator (B) is a specific sulfonium salt compound. When processed by lithography, the composition is improved in resolution and forms a pattern with a satisfactory mask fidelity and a minimal LER. [chem]Herein R is H or methyl, m is 1 or 2, and n is 1 or 2.
en
European Patent Office
EUROPEAN PATENT APPLICATION
1
B
79
EP
2081085
A1
2009-07-22
09000571.1
2009-01-16
JP
2008008931
2008-01-18
G03F 7/004 20060101AFI20090528BHEP
G03F 7/039 20060101ALI20090528BHEP
G03F 7/20 20060101ALI20090528BHEP
Shin-Etsu Chemical Co., Ltd.
Ohsawa, Youichi
Kinsho, Takeshi
Watanabe, Takeru
Merkle, Gebhard
Positive resist compositions and patterning process
Positive Resistzusammensetzungen und Strukturierungsverfahren
Positive resist compositions and patterning process
Compositions de réserve positive et procédé de formation de motifs
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units, represented by formula (1). The acid generator (B) is a specific sulfonium salt compound. When processed by lithography, the composition is improved in resolution and forms a pattern with a satisfactory mask fidelity and a minimal LER. [chem]Herein R is H or methyl, m is 1 or 2, and n is 1 or 2.
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63
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