[0001] This invention relates to tortitied epoxy resin composition and to a process for
the preparation thereoi.
[0002] Epoxy resin matrices are usually two-component systems. comprising a resin component
[e.g. a diglycidyl ether of bisphenol A (DGEBA)] and a crosslinking agent [e.g. p,p'
diaminodiphenylmethane (DDM)]. Diluents or fillers are also otten added tor economic
or processing reasons. The resin and curing agent are mixed and "cured", usually at
elevated temperatures. The above matrix would typically have a strength of 85 MPa,
a modulus of 2800 MPa, a glass transition temperature (T
g, a maximum use temperature) of - 150°C and would fracture in an essentially brittle
fashion (H. Lee and K. Neville, "Handbook of Epoxy Resins", McGraw-Hill, New York,
1967). Considerable eftort has been expended to improve on these properties.
[0003] However, no completely satisfactory solution currently exists because improvement
in one property has been gained only at the expense of another (e.g. solvent resistance,
Tg, ductility, processability, cost).
[0004] Many curing agents or hardeners have been used in epoxy resin systems, in particular
amines such as methylene dianiline and tetraethyl- enetriamine. In some cases, adducts
of these same amines with mono- or diepoxides have been used as curing agents. In
United States Patent No. 4,182,831, January 8, 1980, Hicks, polyepoxide resins are
reacted with an aliphatic primary amine mixture, then further reacted with a monoepoxide.
United States Patent No. 4,182,832, January 8, 1980, Zondler et al, describes as curing
agents for epoxy resins, adducts of substituted 1,4-diaminobutanes and liquid epoxides.
United States Patent No. 4,195,152, March 25, 1980, Floyd, describes an adduct of
N-alkylpolyamines and monoepoxides as epoxy resin curing agents. United States Patent
4,197,389, April 8, 1980, Becker et al, describes a hardening agent (curing agent)
for epoxy resins which is a reaction product of an aliphatic or heterocyclic polyamine,
a polyalkylene polyether polyol and at least one polyepoxide. These patents are typical
of the more complex curing agents being developed.
[0005] Antiplasticization in highly crosslinked epoxy resin systeme has been reported in
the literature. For instance, N. Hata et al, in. J. Appl. Polym. Sci., 17(7), p. 2173-81,
1973, describe pentachlorobiphenyl as the most effective antiplasticizer, and dibutylphthalate
an 2,2-bis[4-(2hydroxy-3-phenoxypropoxy)phenyl]propane as less eilectiv. antiplasticizers.
There evidently has been little recent interest in this, possibly because materials
such as pentachlorubiphenyl are envirou- mentally objectionable.
[0006] The present invention provides an alternative approach to the improvement of the
properties of epoxy resins by adding reaction products to the resin which act as fortifiers.
[0007] In one aspect the invention provides a curable epoxy resin composition comprising:
(a) a resin-forming polyepoxide;
(b) an amine curing agent ior (a); and
(c) a fortifier for (a) + (b) comprising the reaction product
of (i) an aromatic amine having an amine group attached to an aromatic ring,
and (ii) a mono- or diepoxide.
[0008] The invention includes this composition cured to a strong, high modulus solid form
having a ductile mode of fracture (i.e. slope of stress-strain curve is negative at
failure). The reaction product of the aromatic amine and the mono- or diepoxide may
be further reacted with an isocyanate or a nitrile to form advantageous fortifiers
as described below.
[0009] The invention further includes a process of fortifying an epoxy resin comprising:
(a) reacting (i) an aromatic amine having an amine group attached to an aromatic ring
with (ii) a mono- or diepoxide
to form a fortifier;
(b) mixing the fortifier with a resin-forming polyepoxide and an amine curing agent
for said polyepoxide; and
(c) heat curing the mixture to form a strong, high modulus solid having a ductile
mode of fracture.
[0010] Preferably in step (a) about 1 mole of amine (i) is heated with about 0.8 to
6 moles (preferably 1-4 moles) of the mono- or diepoxide at the equivalent of about
75-190°C lor about 1hr.
Various physical properties oi epoxy resins fortified in accordance with this invention
are illustrated in the accompanying drawings, in which ;
Figure 1 is a graph showing load vs. extension curves for varying concentrations of
fortifier in a cured epoxy resin system.
Figure 2 is a graph showing the eftect of fortifier concentration on tensile strength
in a cured epoxy resin system for two different fortifiers.
Figure 3 is a graph showing the variation in tensile strength with fortifier concentration
for two different resin systems.
[0011] The polyepoxide to be fortified in accordance with this invention can be any resin-forming
polyepoxide containing a plurality of reactive 1,2-epoxy groups and curable by reaction
with an amine curing agent.
[0012] These polyepoxide materials can be monomeric or polymeric, saturated or unsaturated,
aliphatic, cycloaliphatic, aromatic or heterocyclic, and may be substituted, if desired,
with other substituents besides the epoxy groups, e.g. hydroxyl groups, ether radicals,
aromatic halogen atoms and the like.
[0013] A widely used class of polyepoxides which can be fortified according to the practice
of the present invention includes the resinous epoxy polyethers obtained by reacting
an epihalohydrin, such as epichlorohydrin, and the like, with either a polyhydric
phenol or a polyhydric alcohol. An illustrative, but by no means exhaustive, listing
of suitable dihydric phenols includes 4,4'-isopropylidene bisphenol, 2,4'-dihydroxydiphenylethylmethane,
3,3'-dihydroxydiphenyldiethylmethane, 3,4'-dihydroxydiphenylmethylpropylmethane, 2,3'-dihydroxydiphenylethyl-
phenylmethane, 4,4'-dihydroxydiphenylpropylphenylmethane, 4,4'-dihydroxy- diphenylbutylphenylmethane,
2,2'-dihydroxydiphenylditolylmethane, 4,4'-dihydroxydiphenyltolylmethylmethane and
the like. Other polyhydric phenols which may also be co-reacted with an epihalohydrin
to provide these epoxy polyethers are such compounds as resorcinol, hydroquinone,
substituted hydroquinones, e.g. p-tert-butylhydroquinone, and the like.
[0014] Among the polyhydric alcohols which can be co-reacted with an epihalohydrin to provide
these resinous epoxy polyethers are such compounds as ethylene glycol, propylene glycols,
butylene glycols, pentane diols, bis(4-hydroxycyclohexyl)dimethylmethane, 1,4-dimethylolbenzene,
glycerol, 1,2,6-hexanetrioL, trimethylolpropane, mannitol, sorbitol, erythritol, pentaerythritol,
their dimers, trimers and higher polymers, e.g. polyethylene glycols, polypropylene
glycols, triglycerol, dipentaerythritol and the like, polyallyl alcohol, polyhydric
thioethers, such as 2,2'-, 3,3'-tetrahydroxydipropylsulfide and the like, mercapto
alcohols such as c-monothioglycerol, a,a'-dithioglycerol, and the like, polyhydric
alcohol partial esters, such as monostearin, pentaerythritol monoacetate, and the
like, and halogenated polyhydric alcohols, such as the monochlorohydrins of glyercol,
sorbitol, pentaerythritol and the like.
[0015] Another class of polymeric polyepoxides which can be cured by means of the amine
curing agents and fortified, includes the epoxy novolac resins obtained by reacting,
preferably, in the presence of a basic catalyst, e.g. sodium or potassium hydroxide,
an epihalohydrin, such as epichlorohydrin, with the resinous condensate of an aldehyde,
e.g. formaldehyde, and either a monohydric phenol, e.g. phenol itself, or a polyhydric
phenol. Further details concerning the nature and preparation of these epoxy novolac
resins can be obtained in H. Lee and K. Neville, "Handbook of Epoxy Resins".
[0016] Other suitable polyglycidyl compounds are the polyglycidyl. esters of polycarboxylic
acids, such as the polyglycidyl esters of adipic acid, phthalic acid and the like.
Polyglycidyl esters of polycarboxylic acids are described in detail in U.S. Patent
2,870,170 to Payne et al. Also suitable are polyglycidyl compounds produced by reacting
epichlorohydrin with aromatic amines such as aniline, 2,6-dimethylaniline, p-toluidine,
m-chloroaniline, p-aminodiphenyl, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenyl
methane, or with amino phenols such as p-aminophenol, 5-amino-1-n-naphthol, 4-aminoresorcinol,
2-methyl-4-aminophenol, 2-chloro-4-aminophenol and the like. Specific compounds include,
among others, N,N-diglycidylaniline, N.N-diglycidyl-2,6-dimethylaniline, N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl
methane, the triglycidyl derivative of p-aminophenol wherein the aminohydrogen and
OH hydrogen atoms are replaced by glycidyl groups.
[0017] It will be appreciated by those skilled in the art that the polyepoxide compositions
which can be cured and fortified according to the practice of the present invention
are not limited to those containing the above described polyepoxides, but that these
polyepoxides are to be considered merely as being representative of the class of polyepoxides
as a whole.
[0018] The amine curing agents are any aromatic or aliphatic amine curing agents (hardeners)
known in the art. Typical examples are methylene dianiline (MDA), metaphenylenediamine
and other aromatic polyamines, diethylamine hydrochloride, diethylenetriamine, triethylenetetramine,
diethylaminopropylamine, polyoxypropyleneamines and other aliphatic polyamines. Amine
adducts such as reaction products of aliphatic amines with epoxide monomers and amino
group-containing polyamides are known amine curing agents and would be operative.
Heterocyclic amines such as N-aminoethylpiperazine and ethylmethylimidazole may also
be used. We prefer the aromatic polyamines particularly when improved high temperature
properties are important.
[0019] Comparative tests with and without amine curing agents have confirmed that the fortifiers
are not effective curing agents. For example, a fortifier formed from vinylcyclohexenedioxide
and aniline was added to a resin with and without the amine curing agent. Compositions
containing 15 and 30 parts by wt. of fortifier per hundred of resin, but no curing
agent, did not gel when run through the normal cure cycle. With the curing agent plus
fortifier, a significant increase in strength and modulus was achieved.
[0020] The aromatic amine reactant used to form the fortifier has the general formula:

in which A to E are selected from hydrogen, lower alkyl, halogen, halogenated lower
alkyl, phenyl, halogenated phenyl, hydroxyl, amino, an alkylene-linked aromatic amine
or amide moiety, -GNHX and -gNHX where X is selected from H, lower alkyl and phenyl.
The lower alkyl or alkylene groups may have from 1-4 carbon atoms. Suitable compounds
include aniline, methylene dianiline, m-phenylenediamine, '4-chloroaniline, 4-bromoaniline,
2,4,6-tribromoaniline, 2,4,6-trichloroaniline, a,a,a-trifluoro-m-toluidene, ortho-toluidine,
m- and p-aminophenol, ortho-tolidene
lsulfanilamide and anthranilamide.
[0021] The monoepoxide reactant has the general formula

in which A' and B' are selected from hydrogen, halogen, lower alkyl, halogenated lower
alkyl, phenyl, halogenated phenyl, and an alkylene-linked aromatic ether moiety. Suitable
monoepoxides include ethylene oxide, propylene oxide, epichlorohydrin, styrene oxide
and phenylglycidyl ether (PGE).
[0022] The alternative diepoxide reactant contains two vicinal epoxide rings, one of which
is less reactive than the other (for structural or chemical reasons). The reactivity
of the less reactive epoxide group may be lower because of, e.g., being attached to
an alicyclic moiety or by substituents on the alpha-carbons or because of its steric
configuration. Suitable dioxides include vinylcyclohexene dioxide, limonene dioxide,
bis(2,3-epoxycyclopentyl)ether (liquid isomer), and p-epoxycyclopentyl- phenyl glycidyl
ether.
[0023] The fortifier is formed by reacting the aromatic amine and mono- or diepoxide together
at a selected temperature, usually within about 70°C to 200°C, for a time within about
15 min. to about 4 hr. Preferably, reaction conditions are selected to be equivalent
to 75-190°C for about 1-2 hrs. at a ratio of 1 mole amine to 1 to 4 moles epoxide.
The temperature (and time) are selected to give the desired degree and mode of reaction
yet not boil off the more volatile components. Depending on exotherms encountered,
it may be necessary to cool the reaction vessel to maintain the desired reaction temperature.
Typical temperatures and times found operative are illustrated in the examples. Catalysts
can be used to facilitate the reaction if desired but we have not found them necessary.
Suitable catalysts for the fortifier formation include those of the type of diethylamine
hydrochloride, ethylmethylimidazole, alphamethylbenzyldimethylamine, and 2-hydroxybenzyldimethylamine.
Suitable catalyst concentrations are about 0.1-0.3X.
[0024] The reaction products are a complex mixture in each case and were used as fortifiers
without purification or separation. The reaction products were viscous oils or low
melting point solids. Chromatographic analysis of a typical fortifier showed the presence
of at least 12 chemical components in measurable amounts. Several fortifiers have
been retested after at least one year of storage and they showed no signs of deterioration.
[0025] We have found that (in preparing the fortifiers) when only part of the desired amount
of one of the reactants is added initially and reacted, and the remainder introduced
later, the reaction product is different than if the full amount had been reacted
at one time. Using this variation in properties, it is possible to select both reactants
and reaction stages to optimize properties of the fortifier for a particular purpose.
It is possible to add a different mono- or diepoxide at a second stage of the reaction
to vary the properties further. In the same manner, variations or staged additions
of the same or different aromatic amines change the properties of the fortifier somewhat.
Thus, it is possible to tailor the fortifier to obtain a desired balance of properties
for a particular resin system. For each resin-curing agent system, the fortifier is
selected to bestow increased tensile strength and modulus on curing.
[0026] The concentration of fortifier relative to the resin (resin-forming polyepoxide)
may range from an effective amount up to about 40 parts per hundred parts of resin
(PHR). Amounts within the range of 5-30 PHR normally are preferred.
[0027] These fortifiers will have some free hydroxyl groups available for further reaction.
We have found that reaction with isocyanates or nitriles gives fortifiers which bestow
increased strengths on the resin (compared to the original fortifier). Any monoisocyanate
may be used with typical ones being methyl:, ethyl-, propyl-, and phenylisocyanates
and halogenated derivatives thereof. Alternatively, nitrile reactants may be used
and these may be mono- or dinitriles. Suitable nitrile reactants include p-aminobenzonitrile,
phthalonitrile, malononitrile, succinonitrile, butyronitrile, adiponitrile and acrylonitrile.
Halogenated derivatives of these nitriles can be used. Normally, the amount of isocyanate
or nitrile will be sufficient to react with all hydroxyl groups present. The reaction
conditions with nitrile reactants generally are about 1 hr at about 150 though variations
are possible. With the isocyanates, they are added cold and usually in stages since
the reaction is exothermic, preferably with the final temperature controlled to be
about 120°C.
[0028] The final cure conditions of the resin-forming polyepoxide + amine curing agent +
fortifier generally follow conventional epoxy resin cure techniques. Usually at least
two cure stages are utilized, with preferred cure sequences being within the ranges:

[0029] Those skilled in the art will be able to determine a suitable cure cycle for any
particular system.
[0030] The following examples are illustrative.
Example 1
[0031] Phenylglycidylether was mixed with aniline at a mole ratio of 1.05:1 and 0.25% of
diethylamine hydrochloride added as catalyst. The mixture was heated at 100°C for
30 min. and 160°C for 60 min. to give the fortifier designated PGE-A.
[0032] This fortifier was mixed in varying proportions with Epon 828 (trademark for diglycidyether
of bisphenol A) as resin-forming polyepox- .ide containing methylene dianiline as
curing agent. The actual amount of curing agent was adjusted, depending on the amount
of fortifier, to maintain an added active hydrogen to epoxy group ratio of approximately
1:1. The system was cured at 100°C for 3 hrs, + 125°C for 2 hrs, + 175°C for 4 hrs.
The tensile strength results are shown in Figure 2. A significant increase in strength
was obtained.
Example 2
[0033] Vinylcyclohexene dioxide was mixed with aniline at a mole ratio of 2:1 and 0.25%
of diethylamine hydrochloride added as catalyst. The mixture was heated at 190°C for
2 hrs. to give the fortifier designated VCD-A. This fortifier was mixed with Epon
828 containing 30 PHR methylene dianiline curing agent and cured as in Ex. 1. The
load vs grip extension curves for 0, 10, 20, 30 and 40 PHR of this fortifier in this
system, are shown in Figure 1. The tensile strength results are shown for varying
concentrations of fortifier in Fig. 2 and the strength is
[0034] - 9
- seen to increase with concentration of fortifier, i.e. from about 85 MPa to about
120 MPa at 35 PUR fortifier.
Example 3
[0035] Using as resin-forming polyepoxide, the diglycidyl ether of bisphenol A (Epon 828)
but with aliphatic amine curing agents, and using the two fortifiers of Ex. 1 and
2, compounding and curing were carried out as follows:
A mixture of 34 parts of a polyoxypropyleneamine (Jeffamine D400 - trademark) and
4 parts of diethylenetriamine was prepared as curing agent, and mixed with 100 parts
of Epon 828 and 30 parts of either the phenylglycidylether-aniline fortifier or the
vinylcyclohexene dioxide -aniline fortifier, then cured at 50°C for 1 hr. + 80°C for
1 hr. + 125°C for 4 hrs. The tensile test results on the cured product were as follows:

Example 4
[0036] In other runs, fortifiers were made using phenylglycidylether, aniline or chloroaniline
and in some cases ethyl or phenyl isocyanate. These fortifiers were compounded with
Epon 828 resin and 30 PHR MDA and cured at 100°C for 7 hrs. + 160°C for 8 hrs. The
results are summarized in Table 1.
[0037] Note that brittle systems were made ductile by increasing the proportion of epoxide
in the fortifier.
Example 5
[0038] The effect of fortifying an epoxy novolac resin (DEN 431 - Dow Chemical) compared
to Epon 828 was investigated. Varying concentrations of the fortifier VCDA (prepared
as in Ex. 2) were added to each resin and the systems cured with 30 PHR methylene
dianiline using the cure cycle 100°C for 3 hrs, + 125°C for 2 hrs, + 175°C for 4 hrs.
The results are shown in Figure 3. The novolac resin consistently had a strength about
10 MPa higher than the Epon 828 and tensile strengths over 130 MPa (over 19000 psi)
were realized.

Example 6
[0039] A nitrile-modified fortifier was prepared by reacting one mole of the VCD-A fortifier
of Ex. 2 with one mole of p-aminobenzonitrile by heating to 150°C for 1 hr. Upon compounding
various amounts of this fortifier with Epon 828 and 30 PHR MDA and curing as in Ex.
2, the following results were obtained.

[0040] Similar results have been obtained with styrene oxide, propylene oxide and 1,2-epoxybutane
as epoxide reactant in forming the fortifier and also with 4-chloroaniline, 2,4,6-trichloroaniline,
α,α,α-tri- fluoro-m-toluidine and m-aminophenol as aromatic amine reactant. Still
other such reactants would be operative.
Example 7
[0041] A fortifier was made from vinylcyclohexene dioxide and sulfanilamide at a mole ratio
of 2.75 : 1 as in Example 2 except heating to 130°C -for 1 hr. This fortifier (VCDSAA)
was mixed at 2 proportions with Epon 828 resin containing 30 PHR methylene dianiline
curing agent and cured as in Example 1. The results are summarized in Table 2.

Example 8
[0042] A fortifier was made from vinylcyclohexene dioxide and anthranilamide (Q-aminobenzamide)
at a mole ratio of 2:1 with heating to 130 C for 1 hr. This fortifier was mixed at
2 proportions with Epon 828 resin and cured as in Example 1. The results arc summarized
in Table 3.

Example 9
[0043] A cycloaliphatic epoxy resin (a cyclohexane diepoxy carboxylate) known as Araldite
(trademark) CY 179 was fortified and cured. The fortifiers were VCDA and BCDSAA prepared
as above and VCDMAP. The later was prepared from vinylcyclohexene dioxide and meta-aminophenol
in a mole ratio of 3:1 with heating to 120°C for 1 hr. Curing was for 3 hrs. at 100°C
and then 6 hrs. at 180°C. The results are summarized in Table 4.

1. A iortitied curable epoxy resin composition comprising a resin forming polyepoxide
and an amine curing agent therefor, characterized in that the composition further
contains, as a fortifier, the reaction product of i) an aromatic amine having an amino
group attached to an aromatic ring and ii) a mono-diepoxide, said reaction product
optionally being further reacted with an isocyanate or nitrile.
2. A composition according to claim 1, characterized in that the fortifier is the
reaction of a mono- or diepoxide with an amine of the formula

in which A to E are each hydrogen, C
1 -C4 alkyl, halogen, halogenated C
1-C
4 alkyl, phenyl, halogenated phenyl, hydroxyl, amino, an alkylene-linked aromatic amine
or amide moiety, or an

group where X is H, C
1- C
4 alkyl or phenyl.
3. A composition according to claim 1 or 2,characterized in that the fortifier is
the reaction product of said amine with a monoepoxide of the formula

wherein A' and B' are each hydrogen, halogen, C
1-C
4 alkyl, halo-
genated C
1-C
4 alkyl, phenyl or halogenated phenyl, or an alkylene-linked aromatic ether moiety.
4. A composition according to claim 1 or 2, characterized in that the fortifier is
the reaction product of said amine with a diepoxide containing two epoxide groups
one oi which is less reactive than the other.
5. A composition according to claim 4, wherein the diepoxide reactant is vinylcyclohexene
dioxide.
6. A composition according to any one of the preceding claims, characterized in that
the fortifier is present in an amount of up to 40 parts by wt. per hundred parts of
resin.
7. A composition according to any one of the preceding claims wherein the amine curing
agent is methylene dianiline, N-aminoethylpiperazine, metaphenylenediamine or ethylmethylimidazole.
8. A composition according to any one of claims 1 to 7, wherein the fortifier is a
reaction product obtained by reacting the amine with said mono- or di-epoxide and
further.reacting the product thus obtained with an isocyanate selected from methyl
isocyanate, ethyl isocyanate, phenyl isocyanate, or a halogenated derivative thereof
or with a nitrile selected from aminobenzonitrile, phthalonitrile, malononitrile,
succinonitrile, adiponitrile, or a halogenated derivative of one of those nitriles.
9. A fortified, cross-linked polyester resin composition according to any one of claims
1 to 8, which has been cured to effect cross-linking of said polyepoxide with said
amine.
10. A method of fortifying amine-cured polyepoxy resin compositions obtained by heat
curing a reaction mixture comprising a resin-forming polyepoxide and an amine curing
agent, characterized by incorporating into the reaction mixture prior to curing a
fortifying agent which comprises the reaction product obtained by reacting i) an aromatic
amine having an amine group attached to an aromatic ring, and ii) a mono- or di-epoxide,
and optionally further reacting said reaction product with a isocyanate or nitrile,
and heat curing the mixture so formed.
11. A method according to claim 10, characterized in that the fortifying agent is
a reaction product obtained by reacting said aromatic amine and said mono- or di-epoxide
at a molar ratio of from 1:0.8 to 1:6 and at a temperature of from 75-190°C for a
period of about 1 houi.
12. A method according to claim 11, characterized in that the fortifying agent is
obtained by reaction of said amine with said mono- or di-epoxide in the presence of
diethylamine hydrochloride, ethylmethylimidazole, alphamethylbenzyldimethylamine or
2-hydroxybenzyldimethylamine.
13. A method according to claim 10, 11 or 12 characterized in that the fortifying
agent is added to the curable resin composition in an amount of from 5-30 parts by
weight, per hundred parts of resin.
14. A method according to any one of claims 10 - 13, characterized in that the fortifier
is as required by any one of claims 1 - 5, 7 and 8 .