| (57) Acid copper electroplating solutions containing the reaction product of
(1) a compound of the formula
wherein R1 and R2 are lower alkyl radicals of with 1 to 6 carbon atoms, a hydrogen atom or mixtures
thereof and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX, wherein X is an
alkali metal, hydrogen or magnesium, or a compound of the formula
wherein R3 is an aromatic, heterocyclic or alicyclic radical containing 3 to 12 carbon atoms
and R4 is an alkali metal, hydrogen, magnesium, or the groups SX or SSX where X is an alkali
metal, hydrogen or magnesium,
(2) a compound of the formula
wherein R, and R2 are the same or different and are alkylene radicals containing 1 to 6 carbon atoms,
X is hydrogen or -SO,H and n equals 2 to 5, and
(3) acrylamide in a sufficient amount to increase the brightness of the deposit and/or
to prevent the formation of cracks during thermal shock.
|
|
