(19)
(11) EP 0 568 733 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
11.05.1994 Bulletin 1994/19

(43) Date of publication A2:
10.11.1993 Bulletin 1993/45

(21) Application number: 92121918.4

(22) Date of filing: 23.12.1992
(51) International Patent Classification (IPC)5: C25D 1/04
(84) Designated Contracting States:
BE DE FR GB IT LU NL SE

(30) Priority: 06.05.1992 US 878973

(71) Applicant: CIRCUIT FOIL U.S.A. INCORPORATED
Bordentown, New Jersey 08505-2297 (US)

(72) Inventors:
  • Wolski, Adam M.
    Edgewater Park, NJ 08010 (US)
  • Acx, Kurt
    Hopewell, NJ 08525 (US)
  • Mathieu, Michel
    New Jersey 08691 (US)
  • Maquet, Laure M.
    L-9088 Ettelbruck (LU)

(74) Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät 
Maximilianstrasse 58
80538 München
80538 München (DE)


(56) References cited: : 
   
       


    (54) Low profile copper foil and process and apparatus for making bondable metal foils


    (57) A one-step electrolytic process and apparatus for producing metal foil, e.g., copper foil (34) having a low profile treated surface for use in fabricating printed circuit boards, wherein primary foil is electrodeposited on a cathode (21) in a first electrodeposition zone using a first current density while circulating electrolyte therein under turbulent flow conditions, and micronodules of the metal are electrodeposited on a matte surface of the primary foil in a second electrodeposition zone using a second current density greater than the first current density while circulating electrolyte therein under laminar flow conditions. A grain refining agent is employed in the electrolyte to further improve the quality. The process provides a low profile finished foil having a high peel strength.






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