[0001] This invention provides silicone pressure sensitive adhesive compositions obtainable
by reacting a mixture comprising a polydiorganosiloxane, a silicone resin copolymer
and at least one solvent or plasticizer selected carboxylic acids having at least
six carbon atoms and having a boiling point of at least 200°C. or amines having at
least 9 carbon atoms and having a boiling point of at least 200°C. to form a reaction
product and then adding an organic peroxide or azo compound to the reaction product.
[0002] Silicone pressure sensitive adhesives (PSA's) are typically produced by either blending
or condensing together a silicone resin and a silicone polymer. These types of silicone
pressure sensitive adhesives are claimed in U.S. Patent Nos. 2,736,721, 2,814,601,
2,857,356 and 3,528,940.
[0003] Silicone pressure sensitive adhesives which are produced by adding an amine or a
salt of an amine to the silicone resin-silicone polymer blend are disclosed in Great
Britain Patent Publication 998,232. Silicone pressure sensitive adhesives are also
disclosed which comprise a resin, a polydiorganosiloxane fluid and a condensation
catalyst such as a metal salt of a carboxylic acid in U.S. Patent 4,831,070.
[0004] European Patent Application 0459292 provides a silicone pressure sensitive adhesive
composition comprising a mixture of two different pressure sensitive adhesive compositions
containing resin and polymer blends.
[0005] U.S. Patent 5,248,739 teaches a silicone pressure sensitive adhesive composition
produced by mixing together a silicone resin and a polydiorganosiloxane polymer and
that these compositions can further comprise an organic peroxide as a crosslinking
agent when the polydiorganosiloxane polymer does not contain unsaturated groups.
[0006] Great Britain Patent Publication 2,301,829 discloses silicone pressure sensitive
adhesive compositions comprising 100 parts of an organopolysiloxane having a viscosity
of at least 500,000 mPa·s(cP) at 25°C., 60 to 300 parts of a silicone MQ resin, and
20 to 2500 parts of a linear or cyclic volatile organosiloxane fluid having a boiling
point in the range of 95 to 250°C. where the organo radicals of the silicone pressure
sensitive adhesive composition are selected from C
1-13 organo radicals which are attached to silicon by carbon-silicon linkages. This publication
further discloses the curing of the silicone composition with a free-radical initiator
such as an organic peroxide.
[0007] Conventional peroxide curable silicone pressure sensitive adhesives are generally
supplied at 55 to 60% solids by weight in an organic (typically aromatic) solvent
diluent. This is done to lower the viscosity of the film forming product, making it
easier to handle and apply evenly to a desired substrate.
[0008] We have found the addition of certain high boiling point solvents or plasticizers
to silicone pressure sensitive adhesive compositions can improve the performance of
the adhesive and eliminate the need for a separate silanol condensation catalyst.
[0009] Our invention claims silicone pressure sensitive adhesive compositions which are
obtained by reacting a mixture comprising at least one polydiorganosiloxane, at least
one silicone resin copolymer, and at least one solvent or plasticizer selected from
carboxylic acids having at least six carbon atoms and having a boiling point of at
least 200°C. or amines having at least 9 carbon atoms and having a boiling point of
at least 200°C. to form a reaction product, and then adding an organic peroxide or
azo compound to the reaction product.
[0010] Silicone pressure sensitive adhesive compositions produced by our invention exhibit
high tack while retaining good peel adhesion.
[0011] It is an object of our invention to provide a silicone pressure sensitive adhesive
compositions that are produced without the need for a separate silanol condensation
catalyst.
[0012] It is further an object of this invention to provide a silicone pressure sensitive
adhesive compositions having high solids content which maintain excellent adhesive
properties at low viscosities.
[0013] It is another object of this invention to provide a silicone pressure sensitive adhesive
compositions which are particularly suitable in adhesive tape constructions.
[0014] Our invention introduces a silicone pressure sensitive adhesive composition obtainable
by a method comprising the steps of (I) reacting a mixture comprising: (A)(i) at least
one hydroxyl-terminated polydiorganosiloxane having a viscosity of from 100 to 100,000,000
mm
2/s at 25°C. or (ii) a mixture of (a) a hydroxyl-terminated polydiorganosiloxane and
(b) a polydiorganosiloxane selected from (i) polydiorganosiloxanes terminated with
monovalent hydrocarbon radicals free of aliphatic unsaturation or (ii) alkenyl-terminated
polydiorganosiloxanes wherein said mixture has a viscosity of from 100 to 100,000,000
mm
2/s at 25°C., (B) at least one soluble silicone resin essentially consisting of at
least one R
3SiO
1/2 unit and at least one SiO
4/2 unit, wherein R is independently selected from a monovalent hydrocarbon or halohydrocarbon
radical free of aliphatic unsaturation and having from 1 to 20 carbon atoms, an alkenyl
radical, or a hydroxyl radical wherein the molar ratio of R
3SiO
1/2 units to SiO
4/2 units is from 0.5:1 to 1.2:1, and (C) at least one solvent or plasticizer selected
from carboxylic acids having at least six carbon atoms and having a boiling point
of at least 200°C. or amines having at least 9 carbon atoms and having a boiling point
of at least 200°C. to form a reaction product, and (II) adding (D) an organic peroxide
or azo compound to the reaction product of (I).
[0015] The hydroxyl-terminated polydiorganosiloxane of component (A) is a polydiorganosiloxane
having the general formula HOR
12SiO(R
12SiO)
aSiR
12OH wherein each R
1 is independently selected from a monovalent hydrocarbon or halohydrocarbon radical
having from 1 to 20 carbon atoms or an alkenyl radical. The monovalent hydrocarbon
radicals free of aliphatic unsaturation include alkyl radicals exemplified by methyl,
ethyl, propyl, pentyl, octyl, undecyl or octadecyl; cycloaliphatic radicals exemplified
by cyclohexyl; aryl radicals exemplified by phenyl, tolyl, xylyl, benzyl or 2-phenylethyl;
and chlorinated hydrocarbon radicals exemplified by 3-chloropropyl and dichlorophenyl.
The alkenyl radicals include vinyl, allyl, butenyl, hexenyl, cyclohexenyl and beta-cyclohexenylethyl.
Preferably, R
1 is selected from methyl, phenyl or vinyl. The most preferred hydroxyl-terminated
polydiorganosiloxane of component (A) is a compound in which at least 50%of the R
1 radicals are methyl radicals.
[0016] The average value of subscript "a" above provides a viscosity at 25°C. of 100 mm
2/s (100 cS) to 100,000,000 mm
2/s (100,000,000 cS), the viscosity is a function of the R
1 radicals on the polymer. A preferred average value of
a
" provides an organopolysiloxane component (A) having a viscosity in the range of 1,000
to 50,000,000 mm
2/s at 25°C. More is when
a
" has a value such that the viscosity of component (A) ranges from 2,000 to 500,000
mm
2/s at 25°C.
[0017] Specific examples of these polydiorganosiloxanes include; HOMe
2SiO(Me
2SiO)
aSiMe
2OH, HOMe
2SiO(Me
2SiO)
0.94a(Ph
2SiO)
0.06aSiMe
2OH, HOPh
2SiO(Me
2SiO)
0.94a(Ph
2SiO)
0.06aSiPh
2OH, HOMe
2SiO(Me
2SiO)
0.95a(MeViSiO)
0.05aSiMe
2OH, HOVi
2SiO(Me
2SiO)
0.95a(MeViSiO)
0.05aSiVi
2OH or HOR
2SiO(Me
2SiO)
0.88a(Ph
2SiO)
0.12aSiR
2OH wherein Me, Vi and Ph hereinafter denote methyl, vinyl and phenyl, respectively,
and
a
" is as defined above. Component (i) can also be a mixture of two or more different
hydroxyl-terminated polydiorganosiloxanes.
[0018] Component (A) can also be (ii) a mixture of (a) a hydroxyl-terminated polydiorganosiloxane
and (b) a polydiorganosiloxane selected from (i) polydiorganosiloxanes terminated
with monovalent hydrocarbon radicals free of aliphatic unsaturation or (ii) alkenyl-terminated
polydiorganosiloxanes wherein said mixture has a viscosity of from 100 to 100,000,000
mm
2/s at 25°C. The hydroxyl-terminated polydiorganosiloxane is as above including preferred
embodiments thereof. The monovalent hydrocarbon radicals free of aliphatic unsaturation
and the alkenyl radicals are as above including preferred embodiments thereof.
[0019] Specific examples of polydiorganosiloxanes terminated with monovalent hydrocarbon
radicals free of aliphatic unsaturation include;Me
3SiO(Me
2SiO)
aSiMe
3, Me
3SiO(Me
2SiO)
0.95a(MeViSiO)
0.05aSiMe
3, Me
3SiO(Me
2SiO)
0.5a(MePhSiO)
0.5aSiMe
3 or Me
3SiO(Me
2SiO)
0.5a(Ph
2SiO)
0.5aSiMe
3 wherein
a
" has an average value as defined above.
[0020] Specific examples of polydiorganosiloxanes terminated with alkenyl radicals include;
ViMe
2SiO(Me
2SiO)
aSiMe
2Vi, ViMe
2SiO(Me
2SiO)
0.95a(MePhSiO)
0.05aSiMe
2Vi, ViMe
2SiO(Me
2SiO)
0.98a(MeViSiO)
0.02aSiMe
2Vi, PhMeViSiO(Me
2SiO)
aSiPhMeVi, ViMe
2SiO(Me
2SiO)
0.95a(Ph2SiO)
0.05aSiMe
2Vi and PhMeViSiO(Me
2SiO)
0.8a(MePhSiO)
0.1a(Ph
2SiO)
0.1aSiPhMeVi wherein a has an average value as defined above.
[0021] If component (A) is (ii) a mixture of (a) and (b) as defined above, the mixture of
(a) and (b) is in weight ratios of (a):(b) of 1:99 to 99:1, is preferably from 90:10
to 10:90, and more preferred is from 70:30 to 30:70.
[0022] In component (A) the molar sum of phenyl and vinyl radicals cannot exceed 30% of
the silicon atoms. In addition, component (A) can comprise trace amounts of siloxane
branching sites; namely, R
1SiO
3/2 units and SiO
4/2 units, provided that the component remains flowable. Component (A) is well known
in the art and is prepared by known methods which need not be repeated herein.
[0023] The amount of component (A) in our compositions is from 30 to 50 parts by weight
and, more preferably, from 37 to 47 parts by weight per 100 parts by weight of components
(A)+(B).
[0024] Component (B)is at least one soluble silicone resin essentially consisting of at
least one R
3SiO
1/2 unit (M unit) and at least one SiO
4/2 unit (Q unit), wherein R is independently selected from a monovalent hydrocarbon
or halohydrocarbon radical having 1 to 20 carbon atoms, an alkenyl radical or a hydroxyl
group, all of which are as described above. The term "soluble" means the silicone
resin (B) is dispersed in either a hydrocarbon liquid exemplified by benzene, toluene,
xylene, heptane and the like or in a silicone liquid such as cyclic or linear polydiorganosiloxanes.
The resin is soluble in component (A), delineated hereinabove. The silicone resin
of component (B) is a soluble hydroxy-functional organopolysiloxane resin consisting
of M units and Q units. In the hydroxyl functional organopolysiloxane resin, the R
3SiO
1/2 units are bonded to the SiO
4/2 units, each of the latter being bonded to at least one other SiO
4/2 unit. Some of the SiO
4/2 units are bonded to hydroxy radicals resulting in HOSiO
3/2 units, thereby accounting for the silicon-bonded hydroxyl content of the resin. In
addition, the resin may contain a small amount of a low molecular weight material
comprised of a neopentamer organopolysiloxane having the formula (R
3SiO)
4Si.
[0025] The preferred hydroxy-content of the silicone resin or resin mixture as determined
by
29Si NMR (nuclear magnetic resonance) ranges from 1.0 to 5.0 wt% based on the resin
solids content, and preferably 1.5 to 3.5 wt%. However, resins having less than 1.0
wt% hydroxy can also be used in this invention.
[0026] In the formula for organopolysiloxane resin (B), the monovalent hydrocarbon radicals
free of aliphatic unsaturation and the alkenyl radicals are as defined above, including
preferred embodiments thereof. R is independently selected from methyl, phenyl, vinyl
or hydroxyl. At least one-third and, more preferably, all R radicals in the formula
for component (B) are methyl radicals. Examples of preferred R
3SiO
1/2 units include Me
3SiO
1/2, ViMe
2SiO
1/2, PhMe
2SiO
1/2 or Ph
2MeSiO
1/2.
[0027] The molar ratio of R
3SiO
1/2 units to SiO
4/2 units is 0.5:1 to 1.2:1. A molar ratio of the R
3SiO
1/2 units to SiO
4/2 units between 0.6:1 and 1:1 is preferred. The M:Q molar ratios are determined by
29Si NMR. A number average molecular weight (Mn) of 3,000 to 7,500 for component (B)
is preferred as measured by gel permeation chromatography (GPC) calibrated against
fractionated MQ resin standards. A molecular weight (Mn) of Component (B) from 3,500
to 6,000 is most preferred.
[0028] Component (B) is prepared by by the silica hydrosol capping process of U.S. Patent
2,676,182, as modified by U.S. Patent 3,627,851 and U.S. Patent 3,772,247, wherein
each patent teaches how to prepare soluble organopolysiloxanes that are useful in
this invention. Further, component (B) is obtainable by the cohydrolysis of a trialkyl
hydrolyzable silane and alkyl silicate as described in U.S. Patent 2,857,356.
[0029] The amount of component (B) in the compositions of our invention is from 50 to 70
parts by weight and, more preferably, from 53 to 63 parts by weight per 100 parts
by weight of components (A)+(B). A preferred embodiment is the addition of a separate
high-resin containing polymer-resin mixture to the initial resin-polymer mixture such
that the resin content of the proportion of the combined resin and polymer mixture
is within the above limits.
[0030] Component (C) is at least one solvent or plasticizer selected from carboxylic acids
having at least six carbon atoms and having a boiling point of at least 200°C. or
amines having at least 9 carbon atoms and having a boiling point of at least 200°C.
The term "boiling point" denotes the boiling point of a liquid at standard atmospheric
pressure (101.3 kPa). The carboxylic acids are exemplified by nonanoic acid, caproic
acid, caprylic acid, oleic acid, linoleic acid, linolenic acid and N-coco-beta-aminobutyric
acid. The amines are exemplified by dodecylamine, hexadecylamine, octadecylamine,
dimethyldodecylamine, dicocoamine, methyldicocoamine, dimethyl cocoamine, dimethyltetradecylamine,
dimethylhexadecylamine, dimethyloctadecylamine, dimethyl tallow amine, dimethylsoyaamine,
dimethyl nonylamine, di(hydrogenated-tallow)amine and methyldi(hydrogenated-tallow)amine.
Component (C) can also be a combination of two or more different carboxylic acids
as above, a combination of two or more different amines as above or a combination
of a carboxylic acid as above and an amine as above. The materials of component (C)
are a catalyst and solvent in the silicone pressure sensitive adhesive compositions
of this invention (i.e. dual functional). This feature eliminates the need for using
a silanol condensation catalyst.
[0031] Amine or carboxylic acid of component (C) have a boiling point of at least 210°C.
are preferred and, more preferred, are amines or carboxylic acids having a boiling
point of at least 225°C. Preferably, component (C) is miscible in components (A) and
(B). Miscible denotes that Component (C) has the ability to dissolve uniformly in
the mixture of (A)+(B).
[0032] The amount of component (C) used depends on the type of amine or carboxylic acid
selected. If an amine or carboxylic acid having a boiling point near 200°C. is selected,
a greater amount of amine or carboxylic acid is required. The amount of component
(C) in the compositions of our invention is preferably from 2 to 40 parts by weight
and, more preferable, from 5 to 30 parts by weight per 100 parts by weight of components
(A)+(B).
[0033] The mixture of step (I) can further comprise (E) at least one solvent or plasticizer
having a boiling point of at least 200°C. selected from the group consisting of aliphatic
hydrocarbons, glycol ethers, esters, alcohols, ester alcohols, ketones, kerosenes,
naphthas and petrolatums. The aliphatic hydrocarbons are exemplified by dodecane (boiling
point (bp) of 216°C.), tridecane (bp of 234°C.), tetradecane (bp of 252°C.), 1-tetradecene
(bp of 256°C.), pentadecane (bp of 266°C.), hexadecane (bp of 280°C.), octadecane
(bp of 308°C.) and nonadecane (bp of 320°C.). The glycol ethers are exemplified by
diethylene glycol ethyl ether (bp of 202°C.), diethylene glycol butyl ether (bp of
230°C.), triethylene glycol methyl ether (bp of 242°C.), triethylene glycol ethyl
ether (bp of 254°C.), triethylene glycol butyl ether (bp of 283°C.), ethylene glycol
phenyl ether (bp of 245°C.), propylene glycol phenyl ether (bp of 243°C.), and aromatic
based glycol ethers (bp of 245°C.). The esters are exemplified by diethylene glycol
butyl ether acetate (bp of at least 235°C.), pine oil (bp of at least 212°C.), and
mineral seal oil (bp of at least 278°C.). The alcohols are exemplified by tridecyl
alcohol (bp of 252°C.), and the ester alcohols are exemplified by trimethyl pentane
diol isobutyrate (bp of at least 244°C.). The ketones exemplified by isophorone (bp
of at least 215°C.). It is preferred that component (E), if present, is miscible in
components (A) and (B). Miscible denotes that Component (E) has the ability to dissolve
uniformly in the mixture of (A)+(B).
[0034] The amount of component (E) used is dependent on the type of solvent or plasticizer
selected. If component (E) has a boiling point near 200°C., a greater amount of solvent
or plasticizer is required. The amount of component (E) in the compositions of this
invention is from 2 parts by weight to 40 parts by weight and, more preferred, from
5 parts by weight to 30 parts by weight per 100 parts by weight of components (A)+(B).
[0035] The mixture of step (I) can also comprise a rare earth metal salt of a fatty acid.
Examples of rare earth metals suitable for forming the salt include cerium, lanthanum,
praseodymium, with cerium the most preferred. The fatty acid contains 6 to 18 carbon
atoms, most preferably, 8 carbon atoms. The preferred rare earth metal salt is cerium
octoate. Rare earth metal salt concentration in our compositions are within the range
of from 1 to 1000 parts by weight, and most preferred from 10 to 250 parts by weight
per one million parts by weight of components (A)+(B). Typically, the rare earth metal
salt when used is in the form of a 30% solvent solution, 6% of which is composed of
the active rare earth metal. Solvents suitable for the rare earth metal solution are
solvents having a boiling point of less than 200°C. such as hexane, heptane, toluene,
xylene, naphtha, mineral spirits or ketones.
[0036] The reaction product of step (I) is made by reacting a mixture of components (A),
(B) and (C). Reacting for the purposes of this invention denotes simply mixing components
(A), (B) and (C); and any optional components at room temperature (25°C.) or heating
a mixture of components (A)-(C) and any optional components at temperatures above
room temperature. A mixture of components (A)-(C) and any optional components are
heated at a temperature above 100°C. A preferred embodiment of the reaction process
is to pre-neutralize catalytic impurities which are often introduced with the raw
materials of the adhesive product. The mixing of these components is enhanced with
the use of one or more solvents having a boiling point of less than 200°C. in the
mixture of step (I), such as benzene, toluene, xylene, naphtha, mineral spirits, cyclic
polysiloxanes or alcohols such as methanol, ethanol, isopropanol, butanol or n-propanol.
The amount of solvent having a boiling point of less than 200°C., if used, ranges
from 60 to 200 parts by weight per 100 parts by weight of components (A)+(B). The
mixture of (A)-(C) is heated for 4 hours at temperatures of from 100 to 180°C., however,
the time and temperature are dependent on the selection and concentration of the reaction
components. The reaction is complete when the viscosity of the reaction product remains
constant or decreases after achieving a maximum value. The reacting of the mixture
of (A)-(C) results in the formation of a reaction product.
[0037] When a solvent having a boiling point of less than 200°C. is used, it is necessary
to remove this solvent after the formation of the reaction product. Methods of removing
volatile components are well known in the art and need not be repeated herein. Any
method of removing volatile components can be used, such methods exemplified by molecular
stills, rotoevaporators and wipe film evaporators, with the preferred method being
rotoevaporators.
[0038] It is preferred that the reaction product of step (I) have a solids content of at
least 60% and a viscosity of up to 200,000 (mPa·s), a solids content of at least 75%
is more preferable with a viscosity of up to 150,000 mPa·s. Most preferred is when
the reaction product of step (I) has a solids content of at least 80% and a viscosity
of up to 100,000 mPa·s.
[0039] In step (II), component (D) an organic peroxide or azo compound is added to the reaction
product of step (I). Examples of preferred organic peroxides which are suitable as
component (D) include diacyl peroxides such as benzoyl peroxide or dichlorobenzoyl
peroxide. Benzoyl peroxide is a particularly effective organic peroxide.
[0040] Examples of azo compounds suitable as component (D) include azobenzene, azobenzene-p-sulfonic
acid, 2,4-dimethyl-4-methoxyvaleronitrile, azobisdimethylvaleronitrile, azobisisobutyronitrile
or azodine, with azobisisobutyronitrile being preferred. Component (D) when added
to the product of step (I) is a solution in a solvent having a boiling point of less
than 200°C., namely, benzene, toluene, xylene, naphtha, chlorocarbons, ketones or
mineral spirits.
[0041] The amount of Component (D) in the compositions of this invention is from 0.1 to
5 parts by weight and, more preferably, from 1.5 to 3.5 parts by weight per 100 parts
by weight of components (A)+(B).
[0042] During or after the formation of the silicone pressure sensitive adhesive composition,
small amounts of additional ingredients may be added to the composition providing
they do not materially affect the pressure sensitive adhesive composition. These additional
ingredients are exemplified by, but not limited to, antioxidants, pigments, stabilizers
and fillers. It is apparent that a blend of two or more reaction products, each having
different amounts of components (A), (B) and (C), is formed in Step (I), and the blend
is catalyzed according to Step (II). Our invention further provides articles of manufacture
prepared by (I) applying a silicone pressure sensitive adhesive composition to at
least one surface of a substrate, wherein the silicone pressure sensitive adhesive
composition is the above described silicone pressure sensitive adhesive composition
and (II) heating the silicone pressure sensitive adhesive composition and the substrate
to cure the composition. The method can further comprise (III) contacting a solid
support with the substrate having the adhesive composition cured thereon after step
(II) whereby the solid support and the substrate are adhered together.
[0043] The silicone pressure sensitive adhesive compositions of this invention are useful
to adhere a substrate to a solid support, whether flexible or rigid. These compositions
may be applied to a surface of a substrate by any suitable means namely rolling, spreading
or spraying and cured as described above.
[0044] The surface of the solid support and the substrate to which the solid support is
adhered may be any known solid material such as metals; namely, aluminum, silver,
copper, iron and their alloys, porous materials; namely, paper, wood, leather and
fabrics, organic polymeric materials; namely, polyolefins including polyethylene and
polypropylene, fluorocarbon polymers such as polytetrafluoroethylene and polyvinylfluoride,
silicone elastomers and resins, polystyrene, polyamides such as Nylon, polyimides,
polyesters and acrylic polymers, painted surfaces, siliceous materials such as concrete,
bricks, cinderblocks and glass such as glass cloth. Porous materials such as glass
cloth are often impregnated with a substance that will prevent the migration of the
silicone pressure sensitive adhesive from one surface to another surface of the support.
In this regard, it is also well known to chemically treat, physically treat (for example,
etching) or primecoat (adding a curable polysiloxane) the surface of a substrate prior
to addition of the silicone pressure sensitive adhesive compositions to enhance adhesion
to said surface. Our invention is particularly suited to applications wherein good
adhesion to a low energy surface (e.g., polyethylene or Teflon™) is desired.
[0045] The amount of silicone pressure sensitive adhesive composition applied to the surfaces
is sufficient to render the surface tacky to the touch after the removal of any solvent
having a boiling point of less than 200°C. After applying it to the surface, the adhesive
is cured by air drying or heating at temperatures of up to 300°C.
[0046] Solid supports bearing the cured compositions of our invention are readily adhered
to any solid substrate because the silicone pressure sensitive adhesive compositions
of this invention have high tack and good adhesive strength.
[0047] Useful articles which are prepared with the silicone pressure sensitive adhesive
compositions of this invention include pressure sensitive tapes, labels, emblems and
other decorative or informational signs. In particular, our silicone pressure sensitive
adhesive compositions are useful in tapes such as a splicing tape in label and paper
stock manufacture and converting. An especially useful article is one comprising a
flexible or rigid support that withstands extreme temperatures, hot and/or cold, and
carrying on at least one surface thereof the silicone pressure sensitive adhesive
compositions of our invention. Such an article makes full use of the stability at
high temperatures and the flexibility at low temperatures that the silicone pressure
sensitive adhesive compositions of this invention possess.
[0048] All parts and percentages are on a weight basis and all measurements were obtained
at 25°C. unless otherwise indicated. The molecular weight properties of the polydimethylsiloxane
polymers below were determined by Gas Phase Chromatography (GPC) in a toluene solvent,
and using a polydimethylsiloxane standard.
[0049] The apparatus and testing procedures used for the results shown herein are as follows:
[0050] Adhesion was measured by applying a 6 x 1 inch strip of a Kapton™- or Mylar™-backed
adhesive to a clean 2 x 6 inch stainless steel panel using two passes of a 4.5 lb.
rubber-coated roller. The force required to remove the tape from the panel was measured
with a Keil Tester at an peel angle of 180° at a rate of 12 inches per minute. The
values recorded are the average of multiple readings taken during the course of one
pull per sample. The Keil Tester is described in TAPPI, vol. 43, No. 8., pages 164A
and 165A (August 1960). The readings are reported in units of ounces per inch (oz/in),
as specified in said article.
[0051] Tack was measured on at least five 2.54 cm squares of the Kapton™ or Mylar™-backed
adhesive using a POLYKEN
(R) probe tack tester, available from Testing Machines, Inc., Amityville, NY. The tack
tester has a 0.5 cm diameter stainless steel probe. The test procedure used a 20 gram
weight, a dwell time of 1.0 second and a pull speed of 0.5 cm per second. The results
reported represent the average of at least five readings, expressed in g/cm
2.
[0052] Non-volatile content, i.e. percent solids, of an adhesive material was determined
by heating a two g sample of the material at 150°C. for one hour and expressing the
weight of the residue as a percentage of the original sample weight.
[0053] The non-volatile content of the MQ resins was determined by mixing 1.5 g of resin
solution with 0.75 g of a polydimethylsiloxane fluid having a viscosity of 100 centistokes
(cS) (100 mm
2/s), followed by devolatilization at 150°C. for 2 hours.
[0054] The resins in the examples were analyzed using
29Si NMR to determine the molar ratios of the (CH
3)
3SiO
1/2 units (M) to SiO
4/2 units (Q) in each resin and to determine the hydroxyl content of each resin.
[0055] Viscosities of the pressure sensitive adhesive compositions were measured in centipoise
(cP) (1 cP = 1 millipascal-second (mPa·s)) at room temperature (25°+/-2°C.) using
a Brookfield rotating disc viscometer fitted with an LV-4 spindle. Kinematic viscosities
of starting polydimethylsiloxane fluids were recorded in centistokes (cS) (1 cS =
1 mm
2/s).
[0056] The following materials were employed in preparing the compositions in the examples:
POLYMER A was a hydroxyl-endblocked polydimethylsiloxane fluid having a viscosity
of 15,000 mm2/s, a number average molecular weight (Mn) of 38,200, and a weight average molecular
weight (Mw) of 68,470.
RESIN A was a benzene-soluble, siloxane resin consisting of (CH3)3SiO1/2 (M) units and SiO4/2 (Q) units and having an M:Q molar ratio of 0.78:1.0, a hydroxyl content of 2.9 wt%,
and the following molecular weight characteristics as determined by GPC in chloroform,
using fractionated MQ resin standards and an IR detector, a Mn of 4,300, a Mw of 14,600,
and a Mw/Mn of 3.395.
THERMAL STABILITY ADDITIVE was Ten-Cem® (a dispersion of a neodecanoate salt of a
rare earth metal in mineral spirits having 6% active metals in the mineral spirits
from Mooney Chemicals, Inc., Cleveland, Ohio).
PEROXIDES:
Perkadox(R) PD-50S-ps-a - a suspension of 50 wt% 2,4-dichlorobenzoyl peroxide in a
proprietary polysiloxane fluid supplied by Akzo Chemical.
Benzoyl peroxide, in granular form, was 98% pure supplied by Aldrich Chemical Company.
EXAMPLE 1
[0057] First 150.1 g of Resin A, 73.6 g of polymer A, 58.3 g of toluene, 18 g of nonanoic
acid and 0.06 g of a thermal stability additive, were combined and thoroughly blended
in a three-necked flask equipped with a stirrer, thermometer, condenser and Dean Stark
Trap. This mixture was heated to reflux, and maintained at reflux, for 4 hours. Water
was continuously removed during the reflux step. The reaction product was then stripped
at atmospheric pressure to 87% solids, cooled, recovered and stored for evaluation.
[0058] A portion of the product was catalyzed with Perkadox® PD-50S-ps-a at a level of 2
wt% peroxide solids based on solids. The catalyzed mixture was cast onto 50.8 µm polyester
film (Mylar® A), de-volatilized for 2 minutes at 70°C., and finally cured for an additional
2 minutes at 178°C. The thickness of the film was 48.3 µm. The Probe Tack and 180
degree Peel Adhesion were then measured as described above. The silicone pressure
sensitive adhesive composition had a Peel Adhesion of 42 oz/in and a Probe Tack of
1,089 g/cm
2.
EXAMPLE 2
[0059] Then 150.1 g of Resin A, 73.6 g of polymer A, 58.3 g of toluene, 18.0 g of Armeen®DM12D
(dimethyldodecylamine from Akzo Nobel Chemicals, Inc., McCook, Ill.), and 0.06 g of
a thermal stability additive, were combined and thoroughly blended in a three-necked
flask equipped with a stirrer, thermometer, condenser and Dean Stark Trap. The mixture
was heated to reflux, and maintained at reflux, for 4 hours. Water was continuously
removed during the reflux step. The reaction product (adhesive) was then stripped
at atmospheric pressure to 87% solids.
[0060] A portion of the adhesive was catalyzed with Perkadox® PD-50S-ps-a at a level of
2 wt% peroxide solids based on solids. The catalyzed mixture was cast onto 50.8 µm
polyester film ( Mylar® A), de-volatilized for 2 minutes at 70°C., and finally cured
for an additional 2 minutes at 178°C. The thickness of the film was 50.8 µm. The probe
Tack and 180 degree Peel Adhesion were then measured as described above. The Peel
Adhesion of this silicone pressure sensitive adhesive composition was >72 oz/in, and
the Probe Tack was 1,381 g/cm
2.
EXAMPLE 3
[0061] Next 150.1 g of Resin A, 73.6 g of polymer A, 58.3 g of toluene, 7.8 g of Armeen®
DM12D, 10.2 g oleic acid, and 0.06 g of a thermal stability additive, were combined
and thoroughly blended in a three-necked flask equipped with a stirrer, thermometer,
condenser and Dean Stark Trap. The mixture was heated to reflux, and maintained at
reflux, for 4 hours. Water was continuously removed during the reflux step. The reaction
product (adhesive) was then stripped at atmospheric pressure to 73% solids.
[0062] A portion of the adhesive was catalyzed with Perkadox® PD-50S-ps-a at a level of
2 wt% peroxide solids based on PSA solids. The catalyzed mixture was cast onto 50.8
µm polyester film (Mylar® A), de-volatilized for 2 minutes at 70°C., and finally cured
for an additional 2 minutes at 178°C. The thickness of the film was 45.7 µm. The probe
Tack and 180 degree Peel Adhesion were then measured as described above. The Peel
Adhesion of this silicone pressure sensitive adhesive composition was >72 oz/in and
the Probe Tack was 1,241 g/cm
2.
1. A silicone pressure sensitive adhesive composition obtainable by a method comprising
the steps of
(I) reacting a mixture comprising:
(A)(i) at least one hydroxyl-terminated polydiorganosiloxane having a viscosity of
from 100 to 100,000,000 mm2/s at 25°C. or (ii) a mixture of (a) a hydroxyl-terminated polydiorganosiloxane and
(b) a polydiorganosiloxane selected from (i) polydiorganosiloxanes terminated with
monovalent hydrocarbon radicals free of aliphatic unsaturation or (ii) alkenyl-terminated
polydiorganosiloxanes wherein said mixture has a viscosity of from 100 to 100,000,000
mm2/s at 25°C;
(B) at least one soluble silicone resin consisting of at least one R3SiO1/2 unit and at least one SiO4/2 unit, wherein R is independently selected from a monovalent hydrocarbon or halohydrocarbon
radical free of aliphatic unsaturation and having from 1 to 20 carbon atoms, an alkenyl
radical or a hydroxyl radical wherein the molar ratio of R3SiO1/2 units to SiO4/2 units is from 0.5:1 to 1.2:1; and
(C) at least one solvent or plasticizer selected carboxylic acids having at least
six carbon atoms and having a boiling point of at least 200°C. or amines having at
least 9 carbon atoms and having a boiling point of at least 200°C. to form a reaction
product; and
(II) adding (D) an organic peroxide or azo compound to the reaction product of (I).
2. The composition of claim 1 wherein the hydroxyl-terminated polydiorganosiloxane is
a polydiorganosiloxane having the general formula
HOR
12SiO(R
12SiO)
aSiR
12OH
wherein each R
1 is independently selected from a monovalent hydrocarbon or halohydrocarbon radical
having from 1 to 20 carbon atoms or an alkenyl radical and
a
" has a value such that the viscosity of said polydiorganosiloxane ranges from 1,000
to 500,000 mm
2/s when measured at 25°C.
3. The composition of claim 1 wherein R is independently selected from methyl, phenyl,
vinyl or hydroxyl, the molar ratio of R3SiO1/2 units to SiO4/2 units is from 0.6:1 to 1:1, and (B) has a number average molecular weight of 3,000
to 7,500.
4. The composition of claim 1 wherein (C) is a carboxylic acid having at least six carbon
atoms and having a boiling point of at least 200°C.
5. The composition of claim 1 wherein (C) is an amine having at least 9 carbon atoms
and having a boiling point of at least 200°C.
6. The composition of claim 1 wherein (C) is a combination of a carboxylic acid having
at least six carbon atoms and having a boiling point of at least 200°C. and an amine
having at least 9 carbon atoms and having a boiling point of at least 200°C.
7. The composition of claim 1 wherein the mixture of step (I) further comprises (E) at
least one solvent or plasticizer having a boiling point of at least 200°C. selected
from the group consisting of aliphatic hydrocarbons, glycol ethers, esters, alcohols,
ester alcohols, ketones, kerosenes, naphthas and petrolatums.
8. The composition of claim 1 wherein the mixture of step (I) further comprises a rare
earth metal salt of a fatty acid.
9. The composition of claim 1 wherein the mixture of step (I) further comprises a solvent
having a boiling point of less than 200°C.
10. The composition of claim 1 wherein (D) is selected from the group consisting of benzoyl
peroxide, dichlorobenzoyl peroxide, 2,4-dimethyl-4-methoxyvaleronitrile and azobisisobutyronitrile.
11. The composition of claim 1 wherein the reaction product of step (I) has a solids content
of at least 60% and a viscosity of up to 200,000 millipascal-seconds (mPa·s).
12. An article of manufacture obtainable by a method comprising
(I) applying a silicone pressure sensitive adhesive composition to at least one surface
of a substrate, wherein the silicone pressure sensitive adhesive composition is obtainable
by the method of any of claims 1 - 11 and
(II) heating the silicone pressure sensitive adhesive composition and the substrate
to cure the composition.
13. The article of manufacture of claim 12 wherein the article is further obtained by
(III) contacting a solid support with the substrate having the adhesive composition
cured thereon after step (II) whereby the solid support and the substrate are adhered
together.