[0001] The present invention relates to an electronic component-mounting substrate on which
a photodiode or a laser element is mounted and an electronic component using the same.
[0002] In recent years, with the development of information communications technologies,
communication speed of communications equipment has been remarkably improved. Also,
with regard to optical communications modules which play central roles in backbone
communications, there are growing demands for speedier photodiodes and laser elements
for carrying out a conversion between an optical signal and an electric signal. Connection
to a substrate has also changed from mounting by conventional wire bonding to mounting
by flip-chip bonding.
[0003] For example, an optical receiver module employing a general flip-chip bonding has
a structure such that a substrate 10 to which a photodiode 8 is mounted by flip-chip
bonding is mounted on a package 1 provided with a lens 2 and an electrode terminal
5, as shown in Figure 1. A signal line 12 of the substrate 10 is bonded to the electrode
terminal 5 via a ribbon wire 7, an optical fiber 3 is fixed so as to be covered with
a ferrule 4, and the package 1 is sealed with a lid 6.
[0004] A substrate to be used for such an optical receiver module is a substrate which allows
flip-chip bonding of a photodiode, which has been disclosed in Japanese Unexamined
Patent Publication No. Hei-10-41739, for example. Namely, as shown in Figures 2, a
substrate 10 is composed of a rectangular solid-shaped dielectric 11, wherein (a)
is a perspective view of the ground side, (b) is a perspective view of the signal
line side, and (c) illustrates a photodiode 8 to be mounted on the substrate 10. Herein,
in Figure 2(a) and Figure 2(b), symbols A-D are designated as indicating the four
corners of the rectangular solid-shaped dielectric 11.
[0005] As shown in Fig. 2(b), the rectangular solid-shaped dielectric 11 for this substrate
10 is provided with microstrip lines 12 of an identical line width for a high-frequency
signal (hereinafter, also referred to as a signal line) on two orthogonal surfaces
thereof. In addition, as shown in Fig. 2(a), a part of two surfaces opposed to the
two signal line surfaces is a ground 13, and at this ground 13, the substrate 10 is
joined to the package 1. Furthermore, as shown in Fig. 2(b), a pad portion 13a is
provided on one signal line surface in a manner extended from the ground 13, and bump
portions 8a of the photodiode 8 are joined to these pad portions 13a.
[0006] In a conventional mounting substrate composed of the above-described rectangular
solid-shaped dielectric, since the line width of the microstrip lines 12 is the same
throughout as shown in Fig. 2(b), the drawback is that, when forming the lines, a
disconnection of the signal lines 12 easily occurs at a line junction 12a on the line
of the intersection between the two signal line surfaces as compared to other portions.
[0007] In addition, since the shape of the signal line 12 is rectilinear, line impedance
increases as it proceeds from the line end portions 12b to the line junction 12a.
Therefore, with a high-frequency signal, an increase in signal reflection and a decrease
in transmission due to a line impedance mismatching easily occurr, as well as the
problem of the deterioration of the reception sensitivity of the photodiode.
[0008] In light of such conventional circumstances, it is an object of the present invention
to provide an electronic component-mounting substrate wherein, in terms of microstrip
lines formed on two surfaces which are orthogonal on a rectangular solid-shaped dielectric,
joint reliability of a line junction at the line of intersection between two signal
line surfaces has been enhanced. In addition, it is an object of the present invention
to prevent an increase in signal reflection and a decrease in transmission due to
a line impedance mismatching by approximating impedance at each line portion of the
microstrip lines to one objective value or a fixed value.
[0009] Furthermore, it is an object of the present invention to provide an electronic component
wherein an electronic component in which high-frequency characteristics are required
is mounted on a mounting substrate, and in particular an electronic component wherein
deterioration of electrical characteristics can be suppressed.
[0010] In order to achieve the above objects, the present invention provides an electronic
component-mounting substrate wherein microstrip lines for a high-frequency signal
are formed on two orthogonal signal line surfaces of a rectangular-solid dielectric
and a part of two surfaces opposed to these two signal line surfaces is a ground,
the width of the microstrip lines being broader at junction thereof at intersecting
line between these two signal line surfaces as compared with the width of the end
portions of the microstrip lines.
[0011] In the above electronic component-mounting substrate of the present invention, the
cross-section of a dielectric which is perpendicular to the microstrip lines is square,
and the width of the line junction of the microstrip lines at intersecting line between
two signal line surfaces is designed such that if the thickness of the microstrip
lines substrate be equivalently substituted with a thickness equal to the length of
a diagonal line of the dielectric section, the impedance of the microstrip lines would
be equivalent to an impedance at the end portion of the substituted microstrip lines.
[0012] In addition, the present invention provides an electronic component wherein a photodiode
or a laser element is mounted on the above electronic component-mounting substrate
of the present invention.
[0013] According to the present invention, an electronic component-mounting substrate wherein
joint reliability of a line junction of microstrip lines at the line of intersection
between two signal line surfaces has been enhanced can be provided, and moreover,
design of the lines is simple, and it becomes possible to approximate an impedance
at each line portion of the microstrip lines to an objective value of an eternal signal
line or the like or a fixed value, thus an increase in signal reflection and a decrease
in transmission due to a line impedance mismatching can be prevented.
[0014] Furthermore, by using an electronic component-mounting substrate of the present invention,
an electronic component in which an electronic component, such as a photodiode or
a laser element, having preferable high-frequency characteristics is mounted without
losing its characteristics can be provided.
Figure 1 is a partially cut-away side view schematically illustrating an optical receiver
module by a general flip-chip bonding,
Figures 2 are perspective views illustrating an electronic component-mounting substrate
of the present invention, wherein (a) is a view of the ground side, (b) is a view
of the signal line side, and (c) illustrates a photodiode to be mounted on the substrate,
Figures 3 are perspective views illustrating an electronic component-mounting substrate
of the prior art, wherein (a) is a view of the ground side, (b) is a view of the signal
line side, and (c) illustrates a photodiode to be mounted on the substrate,
Figure 4 is a diagram for explaining an equivalent substitution of a signal line when
the width of the signal line on the electronic component-mounting substrate of the
present invention is determined,
Figure 5 is a graph indicating reflection characteristics at the signal line of the
electronic component-mounting substrate in the present invention and prior art, and
Figure 6 is a graph indicating transmission characteristics at the signal line of
the electronic component-mounting substrate in the present invention and prior art.
[0015] In an electronic component-mounting substrate 20 of the present invention, as shown
in Figure 3, for example, microstrip lines (signal lines) 22 for a high-frequency
signal are formed on two orthogonal signal line surfaces of a rectangular solid-shaped
dielectric 21 such that the width of a line junction 22a at intersecting line between
the two signal line surfaces is broader than the width of line end portions 22b. Figure
3(a) is a perspective view of the ground side, Figure 3(b) is a perspective view of
the signal line side, and Figure 3(c) illustrates a photodiode 8 to be mounted to
the substrate 20. In addition, in Fig. 3(a) and Fig. 3(b), symbols A-D are designated,
respectively to indicate the four corners of the rectangular solid-shaped dielectric
21.
[0016] Since the width of the line junction 22a at intersecting line between the two signal
line surfaces becomes broad owing to such a construction, the joint reliability can
be enhanced, and in addition, it becomes possible to approximate the impedance of
the overall signal lines 22 to an impedance of an external signal line, whereby it
is possible to prevent an increase in signal reflection and a decrease in transmission
in a case where a high-frequency signal due to line impedance mismatching passes.
[0017] In particular, when a cross-section which is perpendicular to the two signal line
surfaces of the dielectric is a square, signal line design can be carried out simply
so that the impedance of each portion of the signal lines 22 becomes a desirable fixed
value or approximates thereto. Namely, as shown in Figure 4, in the case where a cross-section
of the dielectric 21 which is vertical to the signal lines 22 of the electronic component-mounting
substrate 20 is a square, it is satisfactory to equivalently substitute the signal
lines 22 of the two signal line surfaces with signal lines on a substrate having a
thickness equal to the length of a diagonal line of the cross-section thereof (refer
to the left-side diagram) and to set the width of the line junction 22a at intersecting
line between the two signal line surfaces to a width such that the impedance of the
signal lines would become equivalent to the impedance of a line end portion of the
substituted lines.
[0018] In addition, by mounting an electronic component such as a photodiode or a laser
element, which requires preferable high-frequency characteristics, on the aforementioned
electronic component-mounting substrate according to the present invention, it becomes
possible to fabricate an electronic component wherein deterioration of electrical
characteristics can be suppressed.
Examples
[0019] An electronic component-mounting substrate 20 as shown in Figures 3 was fabricated
by using alumina with a size of 0.5 millimeters square and 5 millimeters long (specific
inductive capacity of 9.5) as a rectangle solid-shaped dielectric 21. Namely, microstrip
lines (signal lines) 22 were formed on two orthogonal surfaces of the dielectric 21,
and a ground 23 was formed on two faces opposite to these two signal line surfaces.
The signal lines 22 and the ground 23 were formed by depositing sequentially Ti with
0.1µm, Ni with 0.2µm, and Au with 2.0µm by an evaporation method. The signal lines
and ground may also be formed by a printing method.
[0020] At this time, a design objective impedance of the signal lines 22 was provided as
50Ω, which was the same as that of an external signal line. The width of both line
end portions 22b was determined as 0.09mm through a calculation using, for example,
a port calibration function of a simulator, the commercially available HFSS (Agilent
Technologies) so that the impedance becomes 50Ω. On the other hand, the width of the
line junction 22a of the signal lines 22 at intersecting line between the two signal
line surfaces was designed to 0.7mm by calculating using the aforementioned HFSS such
that an equivalent substitution of the microstrip lines with microstrip lines substrate
(right-side diagram) having a thickness equal to the length of a diagonal line of
the cross-section as shown in Figure 4 would result in an impedance of 50Ω.
[0021] In addition, on a surface of the substrate 20 where a photodiode 8 was to be mounted,
one line end portion 22b of the signal line 22 was provided so as to end at a mid-point
of the surface, and two pad portions 23a, which were provided on both sides of this
line end portion 22b so as to face each other, were joined to the ground 23 of the
neighboring surface. Furthermore, a ground 23 of the neighboring surface which was
continuous from the ground 23 joined to these pad portions 23a was provided by covering,
as the ground 23, the whole surface from a position 0.1mm apart from the line end
portion 22b adjacent at the corner A of the dielectric 21.
[0022] On pad portions 23a of this electronic component-mounting substrate 20, the photodiode
8 was mounted by flip-chip bonding. Thereafter, as shown in Fig. 1, the substrate
20 was mounted on a package 1 which was provided with a lens 2 and an electrode terminal
5, a ribbon wire 7 was bonded, and moreover, the position of an optical fiber 3 was
determined aligning so that light struck a light-receiving surface of the photodiode
8, and the optical fiber 3 was fixed with a ferrule 4. Finally, the package was shielded
with a lid 6, whereby a high-frequency optical receiver module according to one example
of the present invention was fabricated.
[0023] For comparison, a prior-art electronic component-mounting substrate 10 as shown in
Figs. 2 (a) through (c) was fabricated. A dielectric 11 was of alumina with the size
of 0.5 millimeters square and 5 millimeters long (specific inductive capacity of 9.5).
By depositing sequentially Ti with 0.1µm, Ni with 0.2µm, and Au with 2.0µm by an evaporation
method, signal lines 12 were formed on two orthogonal surfaces of this dielectric
11 and a ground 23 was formed on two faces opposed to these two signal line surfaces.
[0024] A design objective impedance of the signal lines 12 was provided as 50Ω, which was
the same as that of an external signal line. Design was carried out so that an impedance
of a section becomes 50Ω with the width of both line terminal portions 12b at 0.09mm,
and signal lines 12 having an identical width not only at a line junction 12a but
also at other portions were used. In addition, on the surface of the substrate 10
where a photodiode 8 was to be mounted, one line end portion 12b of the signal line
12 was provided so as to end at a mid-point of the surface, and two pad portions 13a,
which were provided on both sides of this line end portion 12b so as to face each
other, were joined to the ground 13 of the neighboring surface. Furthermore, a ground
13 of the neighboring surface which was continuous from the ground 13 joined to these
pad portions 13a was provided by covering, as a ground 13, the whole surface from
a position 0.1mm apart from the line end portion 12b which is adjacent at the corner
A of the dielectric 11.
[0025] On pad portions 13a of this electronic component-mounting substrate 10, the photodiode
8 was mounted by flip-chip bonding. Thereafter, as shown in Fig. 1, the substrate
10 was mounted on a package 1 with a lens 2 and an electrode terminal 5. A ribbon
wire 7 was bonded, and moreover, the position of an optical fiber 3 was determined
by aligning so that light struck a light-receiving surface of the photodiode 8, and
then the optical fiber 3 was fixed with a ferrule 4. Finally, the package was shielded
with a lid 6, whereby a high-frequency optical receiver module according to one example
of a prior art was fabricated.
[0026] With respect to the respective samples fabricated as described above as optical receiver
modules of the present invention example and prior-art example, a burn-in test was
performed at a high temperature of 80°C. As a result, the lifetime of the module using
the substrate of the prior-art example, until a breakage occurred in the substrate
wiring, was one hundred thousand hours, whereas a module using the substrate of the
present invention example had a lifetime of two hundred and forty thousand hours:
a lifetime approximately 2.4 times as long as that of the prior-art example.
[0027] Reflection characteristics and transmission characteristics at signal lines of the
electronic component-mounting substrate of the present invention example and prior-art
example were measured. Based on the results obtained, reflection characteristics are
shown in Figure 5 and transmission characteristics are shown in Figure 6. As can be
understood from these results, the electronic component-mounting substrate of the
present invention example at 40GHz, was improved in reflection by 4dB and in transmission
by 0.7dB compared to the prior-art example.
[0028] The present invention is not limited to the aforementioned embodiments, and various
modifications can be made in terms of the material, size, application and the like,
provided that it does not depart from the spirit of the present invention. For example,
aluminum nitride, glass ceramic or the like can be used as a dielectric, and as for
an application, the electronic component-mounting substrate may be used with a high-frequency
laser or the like mounted thereto.